Patents by Inventor Ching-Min Liu

Ching-Min Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9164549
    Abstract: An electronic device including a main body, a shell and a locking mechanism is provided. The locking mechanism includes a first locking component and at least one second locking component. The first locking component is slidably disposed at the main body, locks the shell and has at least one retaining portion. The second locking component is slidably disposed at the main body and locks the shell. The retaining portion blocks the second locking component from sliding relatively to the main body. When the first locking component slides relatively to the main body to release the shell, the retaining portion moves away from the second locking component and the second locking component slides relatively to the main body to release the shell.
    Type: Grant
    Filed: April 24, 2012
    Date of Patent: October 20, 2015
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Ching-Min Liu, Chao-Yu Hsieh, Chih-Jung Kao, Shih-Ming Hung, Hsi-Chi Chien
  • Publication number: 20120268874
    Abstract: An electronic device including a main body, a shell and a locking mechanism is provided. The locking mechanism includes a first locking component and at least one second locking component. The first locking component is slidably disposed at the main body, locks the shell and has at least one retaining portion. The second locking component is slidably disposed at the main body and locks the shell. The retaining portion blocks the second locking component from sliding relatively to the main body. When the first locking component slides relatively to the main body to release the shell, the retaining portion moves away from the second locking component and the second locking component slides relatively to the main body to release the shell.
    Type: Application
    Filed: April 24, 2012
    Publication date: October 25, 2012
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Ching-Min Liu, Chao-Yu Hsieh, Chih-Jung Kao, Shih-Ming Hung, Hsi-Chi Chien