Patents by Inventor Ching-Ming Chuang

Ching-Ming Chuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High density package substrate and method for fabricating the same
    Patent number: 8058567
    Abstract: The invention provides a high density package substrate and a method for fabricating the same. A double-sided copper clad laminate containing an upper copper foil and a lower copper foil is provided. A bottom pad is disposed on the lower copper foil, aligned to a predetermined position of a through hole. The through hole is formed by laser drilling through the upper copper foil and the substrate, but not through the bottom pad. A seed layer is formed conformally lining the through hole, and a metal layer is formed on the seed layer by plating to form a plated through hole (PTH).
    Type: Grant
    Filed: July 17, 2008
    Date of Patent: November 15, 2011
    Assignee: Nan Ya PCB Corp.
    Inventors: Meng-Han Lee, Wei-Wen Lan, Ching-Ming Chuang, Shi-Shyan James Shang
  • HIGH DENSITY PACKAGE SUBSTRATE AND METHOD FOR FABRICATING THE SAME
    Publication number: 20090283315
    Abstract: The invention provides a high density package substrate and a method for fabricating the same. A double-sided copper clad laminate containing an upper copper foil and a lower copper foil is provided. A bottom pad is disposed on the lower copper foil, aligned to a predetermined position of a through hole. The through hole is formed by laser drilling through the upper copper foil and the substrate, but not through the bottom pad. A seed layer is formed conformally lining the through hole, and a metal layer is formed on the seed layer by plating to form a plated through hole (PTH).
    Type: Application
    Filed: July 17, 2008
    Publication date: November 19, 2009
    Applicant: NAN YA PCB CORP.
    Inventors: Meng-Han Lee, Wei-Wen Lan, Ching-Ming Chuang, Shi-Shyan James Shang