Abstract: A method and apparatus for block partition are disclosed. If a cross-colour component prediction mode is allowed, the luma block and the chroma block are partitioned into one or more luma leaf blocks and chroma leaf blocks. If a cross-colour component prediction mode is allowed, whether to enable an LM (Linear Model) mode for a target chroma leaf block is determined based on a first split type applied to an ancestor chroma node of the target chroma leaf block and a second split type applied to a corresponding ancestor luma node. According to another method, after the luma block and the chroma block are partitioned using different partition tress, determine whether one or more exception conditions to allow an LM for a target chroma leaf block are satisfied when the chroma partition tree uses a different split type, a different partition direction, or both from the luma partition tree.

Abstract: Method and apparatus for constrained de-blocking filter are disclosed. One method receives input data related to a current block in a current picture at a video encoder side or a video bitstream corresponding to compressed data including the current block in the current picture at a video decoder side, and determines a first boundary associated with the current block, wherein the first boundary corresponds to one vertical boundary or one horizontal boundary of the current block. The method then applies de-blocking process to a reconstructed current block corresponding to the current block to result in a filtered-reconstructed current block, using a plurality of first reference samples at a same side of the first boundary, and replaces a first set of the first reference samples by one or more padding values. The method then generates a filtered decoded picture including the filtered-reconstructed current block.

Abstract: The invention provides a high density package substrate and a method for fabricating the same. A double-sided copper clad laminate containing an upper copper foil and a lower copper foil is provided. A bottom pad is disposed on the lower copper foil, aligned to a predetermined position of a through hole. The through hole is formed by laser drilling through the upper copper foil and the substrate, but not through the bottom pad. A seed layer is formed conformally lining the through hole, and a metal layer is formed on the seed layer by plating to form a plated through hole (PTH).

Abstract: The invention provides a high density package substrate and a method for fabricating the same. A double-sided copper clad laminate containing an upper copper foil and a lower copper foil is provided. A bottom pad is disposed on the lower copper foil, aligned to a predetermined position of a through hole. The through hole is formed by laser drilling through the upper copper foil and the substrate, but not through the bottom pad. A seed layer is formed conformally lining the through hole, and a metal layer is formed on the seed layer by plating to form a plated through hole (PTH).