Patents by Inventor Ching-Ping Huang
Ching-Ping Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12204163Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.Type: GrantFiled: February 5, 2024Date of Patent: January 21, 2025Assignee: TDK TAIWAN CORP.Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
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Patent number: 12205888Abstract: Semiconductor packages and methods of forming the same are disclosed. An semiconductor package includes two dies, an encapsulant, a first metal line and a plurality of dummy vias. The encapsulant is disposed between the two dies. The first metal line is disposed over the two dies and the encapsulant, and electrically connected to the two dies. The plurality of dummy vias is disposed over the encapsulant and aside the first metal line.Type: GrantFiled: August 1, 2023Date of Patent: January 21, 2025Assignee: Taiwan Semiconductor Manufacturing Company, LtdInventors: Ching-Yu Huang, Han-Ping Pu, Ming-Kai Liu, Ting-Chu Ko, Yung-Ping Chiang, Chang-Wen Huang, Yu-Sheng Hsieh
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Patent number: 10454453Abstract: A control circuit for a impedance matching circuit having first and second capacitor arrays receives as input one or more RF parameters of the impedance matching circuit, and in response thereto: determines a first match configuration for the first capacitor array and a second match configuration for the second capacitor array to create an impedance match between a fixed RF source impedance and a variable RF load impedance, the first match configuration and the second match configuration being determined from one or more look-up tables and based upon the detected one or more RF parameters; and alters at least one of the first array configuration and the second array configuration to the first match configuration and the second match configuration, respectively, by controlling the on and off states of (a) each discrete capacitor of the first capacitor array and (b) each discrete capacitor of the second capacitor array.Type: GrantFiled: December 29, 2015Date of Patent: October 22, 2019Assignee: RENO TECHNOLOGIES, INC.Inventors: Imran Ahmed Bhutta, Ching Ping Huang, Michael Gilliam Ulrich, Tomislav Lozic
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Publication number: 20160134260Abstract: A control circuit for a impedance matching circuit having first and second capacitor arrays receives as input one or more RF parameters of the impedance matching circuit, and in response thereto: determines a first match configuration for the first capacitor array and a second match configuration for the second capacitor array to create an impedance match between a fixed RF source impedance and a variable RF load impedance, the first match configuration and the second match configuration being determined from one or more look-up tables and based upon the detected one or more RF parameters; and alters at least one of the first array configuration and the second array configuration to the first match configuration and the second match configuration, respectively, by controlling the on and off states of (a) each discrete capacitor of the first capacitor array and (b) each discrete capacitor of the second capacitor array.Type: ApplicationFiled: December 29, 2015Publication date: May 12, 2016Inventors: Imran Ahmed Bhutta, Ching Ping Huang, Michael Gilliam Ulrich, Tomislav Lozic
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Publication number: 20150086496Abstract: The present disclosure relates to a composition of scar gel. The composition of scar gel includes a silicone fluid, a volatile diluent, a precipitated silica powder, and an embellishing powder. The silicone fluid is fully miscible with the volatile diluent, and the precipitated silica powder and the embellishing powder are uniformly dispersed in the silicone fluid and the volatile diluent.Type: ApplicationFiled: April 15, 2014Publication date: March 26, 2015Applicant: FAR EASTERN NEW CENTURY CORPORATIONInventors: Yong-Yi WU, Ching-Ping HUANG, Ai-Yun SHIH
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Patent number: 8492513Abstract: The present invention provides a method for producing a silicone hydrogel having a high water content. The method comprises the following steps: (a) polymerizing a monomer mixture to form the silicone hydrogel, wherein the monomer mixture comprises at least one silicon-containing monomer and at least one ionic monomer; and (b) placing the silicone hydrogel in an alkaline solution for at least 20 minutes, wherein the alkaline solution has a pH not less than 7.5 and the ionic monomer is present in an amount not less than 0.7 wt % based on the total dry weight of the silicone hydrogel.Type: GrantFiled: October 14, 2011Date of Patent: July 23, 2013Assignee: Far Eastern New Century CorporationInventors: Chih-Ta Lee, Ching-Ping Huang, Yi-Hsuan Chang, Ken-Yuan Chang
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Publication number: 20120214898Abstract: The present invention provides a silicone hydrogel comprising a reaction product of a monomer mixture for forming the silicone hydrogel and water, wherein the water is present in an amount not less than 50 wt % based on the total weight of the silicone hydrogel. The monomer mixture comprises at least one silicon-containing monomer and at least one ionic monomer, wherein the ionic monomer is present in an amount not less than 0.7 wt % based on the total dry weight of the silicone hydrogel. The present invention also provides ocular articles made from the silicone hydrogel.Type: ApplicationFiled: October 14, 2011Publication date: August 23, 2012Inventors: CHIH-TA LEE, Ching-Ping Huang, Yi-Hsuan Chang, Ken-Yuan Chang
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Publication number: 20120214899Abstract: The present invention provides a method for producing a silicone hydrogel having a high water content. The method comprises the following steps: (a) polymerizing a monomer mixture to form the silicone hydrogel, wherein the monomer mixture comprises at least one silicon-containing monomer and at least one ionic monomer; and (b) placing the silicone hydrogel in an alkaline solution for at least 20 minutes, wherein the alkaline solution has a pH not less than 7.5 and the ionic monomer is present in an amount not less than 0.7 wt % based on the total dry weight of the silicone hydrogel.Type: ApplicationFiled: October 14, 2011Publication date: August 23, 2012Inventors: Chih-Ta LEE, Ching-Ping HUANG, Yi-Hsuan CHANG, Ken-Yuan CHANG
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Publication number: 20110166248Abstract: The present invention provides a reactive hydrophilic copolymer consisting essentially of units formed by ethylenically unsaturated hydrophilic monomers and units of formula (I) or (II) formed by ethylenically unsaturated monomers having alkoxy silane functional groups in a random order: wherein the copolymer has a molecular weight of at least 50,000, and wherein R1, R2 and R3 can be the same or different and are independently selected from H or C1-3 alkyl; R is C1-3 alkyl; X, Y and Z can be the same or different and are independently selected from R? or OR?, provided that at least one of X, Y and Z is OR?; R? is H or C1-3 alkyl; and the equivalent ratio of the units formed by ethylenically unsaturated hydrophilic monomers to the units of formula (I) or (II) is within the range of 5/1 to 200/1. The present invention also provides silicone hydrogel compositions comprising the reactive hydrophilic copolymer of the present invention and ocular articles made therefrom.Type: ApplicationFiled: December 30, 2010Publication date: July 7, 2011Inventors: Yu-Fang HSU, Ching-Ping HUANG, Chia-Chang LIU
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Patent number: 7906563Abstract: A polysiloxane-based prepolymer of a three-dimensional network structure produced by hydrolysis-condensation of a first mixture having a tetra-alkoxysilane compound, an ethylenically unsaturated organosiloxane monomer, and a hydrophilic silicon-containing polyfunctional monomer. A hydrogel is prepared by polymerizing a second mixture having the aforesaid polysiloxane-based prepolymer, an acrylated silicon-containing monomer, and an ethylenically unsaturated hydrophilic monomer.Type: GrantFiled: December 1, 2008Date of Patent: March 15, 2011Assignee: Far Eastern New Century CorporationInventors: Ching-Ping Huang, Roy Wu, Ken-Yuan Chang
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Publication number: 20090170976Abstract: A polysiloxane-based prepolymer of a three-dimensional network structure produced by hydrolysis-condensation of a first mixture having a tetra-alkoxysilane compound, an ethylenically unsaturated organosiloxane monomer, and a hydrophilic silicon-containing polyfunctional monomer. A hydrogel is prepared by polymerizing a second mixture having the aforesaid polysiloxane-based prepolymer, an acrylated silicon-containing monomer, and an ethylenically unsaturated hydrophilic monomer.Type: ApplicationFiled: December 1, 2008Publication date: July 2, 2009Inventors: Ching-Ping Huang, Roy Wu, Ken-Yuan Chang
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Patent number: 7218096Abstract: An adjusting device for a chip adapter. The adjusting device comprises a main body having a plurality of adjusting holes into which testing pins of the adapter are inserted and a slider disposed on the main body and sliding perpendicular to the top surface thereof for easy removal the chip adapter without mis-alignment of testing pins.Type: GrantFiled: September 13, 2004Date of Patent: May 15, 2007Assignee: Asustek Computer, Inc.Inventors: Ching-Ping Huang, Chi-Chuan Chu
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Publication number: 20050073330Abstract: An adjusting device for a chip adapter. The adjusting device comprises a main body having a plurality of adjusting holes into which testing pins of the adapter are inserted and a slider disposed on the main body and sliding perpendicular to the top surface thereof for easy removal the chip adapter without mis-alignment of testing pins.Type: ApplicationFiled: September 13, 2004Publication date: April 7, 2005Inventors: Ching-Ping Huang, Chi-Chuan Chu