Abstract: Semiconductor packages and methods of forming the same are disclosed. An semiconductor package includes two dies, an encapsulant, a first metal line and a plurality of dummy vias. The encapsulant is disposed between the two dies. The first metal line is disposed over the two dies and the encapsulant, and electrically connected to the two dies. The plurality of dummy vias is disposed over the encapsulant and aside the first metal line.

Abstract: A memory device including a first semiconductor die and a memory cube mounted on and connected with the first semiconductor die is described. The memory cube includes multiple stacked tiers, and each tier of the multiple stacked tiers includes second semiconductor dies laterally wrapped by an encapsulant and a redistribution structure disposed on the second semiconductor dies and the encapsulant. The second semiconductor dies of the multiple stacked tiers are electrically connected with the first semiconductor die through the redistribution structures in the multiple stacked tiers.

Abstract: A memory device including a first semiconductor die and a memory cube mounted on and connected with the first semiconductor die is described. The memory cube includes multiple stacked tiers, and each tier of the multiple stacked tiers includes second semiconductor dies laterally wrapped by an encapsulant and a redistribution structure disposed on the second semiconductor dies and the encapsulant. The second semiconductor dies of the multiple stacked tiers are electrically connected with the first semiconductor die through the redistribution structures in the multiple stacked tiers.

Abstract: An electronic device includes a first circuit block and a second circuit block. The first circuit block is allocated in a first power domain, and includes a first clock counter and an updating circuit. The first clock counter is arranged to generate a first counter value according to a first reference clock. The updating circuit is arranged to receive a second counter value, and update the first counter value according to the second counter value. The second circuit block is allocated in a second power domain, and includes a second clock counter arranged to generate the second counter value according to a second reference clock. The first power domain and the second power domain are controlled independently.

Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a circuit assembly. The movable assembly is configured to connect an optical element, the movable assembly is movable relative to the fixed assembly, and the optical element has an optical axis. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The circuit assembly includes a plurality of circuits and is affixed to the fixed assembly.

Abstract: The invention provides a self-organized quantum dot semiconductor structure. The quantum dot semiconductor structure includes: a conductive ridge on a substrate; an insulative layer covering the substrate and the conductive ridge, wherein the insulative layer includes a top portion and two sidewalls over the conductive ridge; a semiconductor mechanism of etching back and thermal oxidation, implemented on a semiconductor-alloyed layer set on the insulative layer; a plurality of quantum dots respectively embedded within a plurality of silicon dioxide spacer islands based on the semiconductor mechanism, the quantum dots and the silicon dioxide spacer islands adhered to the sidewalls of the insulative layer; and a plurality of conductive ledges adhered to the silicon dioxide spacer islands, wherein each of the conductive ledges is a portion of an electrode self-alignment to the quantum dot.

Abstract: A control circuit for a impedance matching circuit having first and second capacitor arrays receives as input one or more RF parameters of the impedance matching circuit, and in response thereto: determines a first match configuration for the first capacitor array and a second match configuration for the second capacitor array to create an impedance match between a fixed RF source impedance and a variable RF load impedance, the first match configuration and the second match configuration being determined from one or more look-up tables and based upon the detected one or more RF parameters; and alters at least one of the first array configuration and the second array configuration to the first match configuration and the second match configuration, respectively, by controlling the on and off states of (a) each discrete capacitor of the first capacitor array and (b) each discrete capacitor of the second capacitor array.

Abstract: A control circuit for a impedance matching circuit having first and second capacitor arrays receives as input one or more RF parameters of the impedance matching circuit, and in response thereto: determines a first match configuration for the first capacitor array and a second match configuration for the second capacitor array to create an impedance match between a fixed RF source impedance and a variable RF load impedance, the first match configuration and the second match configuration being determined from one or more look-up tables and based upon the detected one or more RF parameters; and alters at least one of the first array configuration and the second array configuration to the first match configuration and the second match configuration, respectively, by controlling the on and off states of (a) each discrete capacitor of the first capacitor array and (b) each discrete capacitor of the second capacitor array.

Abstract: The present disclosure relates to a composition of scar gel. The composition of scar gel includes a silicone fluid, a volatile diluent, a precipitated silica powder, and an embellishing powder. The silicone fluid is fully miscible with the volatile diluent, and the precipitated silica powder and the embellishing powder are uniformly dispersed in the silicone fluid and the volatile diluent.

Abstract: The present invention provides a method for producing a silicone hydrogel having a high water content. The method comprises the following steps: (a) polymerizing a monomer mixture to form the silicone hydrogel, wherein the monomer mixture comprises at least one silicon-containing monomer and at least one ionic monomer; and (b) placing the silicone hydrogel in an alkaline solution for at least 20 minutes, wherein the alkaline solution has a pH not less than 7.5 and the ionic monomer is present in an amount not less than 0.7 wt % based on the total dry weight of the silicone hydrogel.

Abstract: The present invention provides a silicone hydrogel comprising a reaction product of a monomer mixture for forming the silicone hydrogel and water, wherein the water is present in an amount not less than 50 wt % based on the total weight of the silicone hydrogel. The monomer mixture comprises at least one silicon-containing monomer and at least one ionic monomer, wherein the ionic monomer is present in an amount not less than 0.7 wt % based on the total dry weight of the silicone hydrogel. The present invention also provides ocular articles made from the silicone hydrogel.

Abstract: The present invention provides a method for producing a silicone hydrogel having a high water content. The method comprises the following steps: (a) polymerizing a monomer mixture to form the silicone hydrogel, wherein the monomer mixture comprises at least one silicon-containing monomer and at least one ionic monomer; and (b) placing the silicone hydrogel in an alkaline solution for at least 20 minutes, wherein the alkaline solution has a pH not less than 7.5 and the ionic monomer is present in an amount not less than 0.7 wt % based on the total dry weight of the silicone hydrogel.

Abstract: The present invention provides a reactive hydrophilic copolymer consisting essentially of units formed by ethylenically unsaturated hydrophilic monomers and units of formula (I) or (II) formed by ethylenically unsaturated monomers having alkoxy silane functional groups in a random order: wherein the copolymer has a molecular weight of at least 50,000, and wherein R1, R2 and R3 can be the same or different and are independently selected from H or C1-3 alkyl; R is C1-3 alkyl; X, Y and Z can be the same or different and are independently selected from R? or OR?, provided that at least one of X, Y and Z is OR?; R? is H or C1-3 alkyl; and the equivalent ratio of the units formed by ethylenically unsaturated hydrophilic monomers to the units of formula (I) or (II) is within the range of 5/1 to 200/1. The present invention also provides silicone hydrogel compositions comprising the reactive hydrophilic copolymer of the present invention and ocular articles made therefrom.

Abstract: A polysiloxane-based prepolymer of a three-dimensional network structure produced by hydrolysis-condensation of a first mixture having a tetra-alkoxysilane compound, an ethylenically unsaturated organosiloxane monomer, and a hydrophilic silicon-containing polyfunctional monomer. A hydrogel is prepared by polymerizing a second mixture having the aforesaid polysiloxane-based prepolymer, an acrylated silicon-containing monomer, and an ethylenically unsaturated hydrophilic monomer.

Abstract: A polysiloxane-based prepolymer of a three-dimensional network structure produced by hydrolysis-condensation of a first mixture having a tetra-alkoxysilane compound, an ethylenically unsaturated organosiloxane monomer, and a hydrophilic silicon-containing polyfunctional monomer. A hydrogel is prepared by polymerizing a second mixture having the aforesaid polysiloxane-based prepolymer, an acrylated silicon-containing monomer, and an ethylenically unsaturated hydrophilic monomer.

Abstract: An adjusting device for a chip adapter. The adjusting device comprises a main body having a plurality of adjusting holes into which testing pins of the adapter are inserted and a slider disposed on the main body and sliding perpendicular to the top surface thereof for easy removal the chip adapter without mis-alignment of testing pins.

Abstract: An adjusting device for a chip adapter. The adjusting device comprises a main body having a plurality of adjusting holes into which testing pins of the adapter are inserted and a slider disposed on the main body and sliding perpendicular to the top surface thereof for easy removal the chip adapter without mis-alignment of testing pins.