Patents by Inventor Ching-Ping Huang

Ching-Ping Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10559573
    Abstract: A layout pattern of a static random access memory (SRAM) includes a substrate, a first pull-up transistor (PL1), a first pull-down transistor (PD1), a second (PL2), and a second pull-down transistor (PD2) on the substrate, and a first pass gate transistor (PG1A), a second pass gate transistor (PG1B), a third pass gate transistor (PG2A) and a fourth pass gate transistor (PG2B), wherein the PG1A and the PG1B comprise a first fin structure, the PG2A and the PG2B comprise a second fin structure, a first local interconnection layer disposed between the PG1A and the PG1B and disposed on the fin structures of the PL1 and the PD1, a second local interconnection layer disposed between the PG2A and the PG2B and disposed between the fin structures of the PL2 and the PD2, the first local interconnection layer and the second local interconnection layer are monolithically formed structures respectively.
    Type: Grant
    Filed: October 16, 2018
    Date of Patent: February 11, 2020
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Shu-Ru Wang, Ching-Cheng Lung, Yu-Tse Kuo, Chien-Hung Chen, Chun-Hsien Huang, Li-Ping Huang, Chun-Yen Tseng, Meng-Ping Chuang
  • Publication number: 20200020628
    Abstract: Integrated fan-out packages and methods of forming the same are disclosed. An integrated fan-out package includes two dies, an encapsulant, a first metal line and a plurality of dummy vias. The encapsulant is disposed between the two dies. The first metal line is disposed over the two dies and the encapsulant, and electrically connected to the two dies. The plurality of dummy vias is disposed over the encapsulant and aside the first metal line.
    Type: Application
    Filed: July 16, 2018
    Publication date: January 16, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ching-Yu Huang, Han-Ping Pu, Ming-Kai Liu, Ting-Chu Ko, Yung-Ping Chiang, Chang-Wen Huang, Yu-Sheng Hsieh
  • Patent number: 10527928
    Abstract: Optical proximity correction (OPC) based computational lithography techniques are disclosed herein for enhancing lithography printability. An exemplary mask optimization method includes receiving an integrated circuit (IC) design layout having an IC pattern; generating target points for a contour corresponding with the IC pattern based on a target placement model, wherein the target placement model is selected based on a classification of the IC pattern; and performing an OPC on the IC pattern using the target points, thereby generating a modified IC design layout. The method can further include fabricating a mask based on the modified IC design layout. The OPC can select an OPC model based on the classification of the IC pattern. The OPC model can weight the target placement model.
    Type: Grant
    Filed: July 19, 2017
    Date of Patent: January 7, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hung-Chun Wang, Chi-Ping Liu, Feng-Ju Chang, Ching-Hsu Chang, Wen Hao Liu, Chia-Feng Yeh, Ming-Hui Chih, Cheng Kun Tsai, Wei-Chen Chien, Wen-Chun Huang, Yu-Po Tang
  • Patent number: 10454453
    Abstract: A control circuit for a impedance matching circuit having first and second capacitor arrays receives as input one or more RF parameters of the impedance matching circuit, and in response thereto: determines a first match configuration for the first capacitor array and a second match configuration for the second capacitor array to create an impedance match between a fixed RF source impedance and a variable RF load impedance, the first match configuration and the second match configuration being determined from one or more look-up tables and based upon the detected one or more RF parameters; and alters at least one of the first array configuration and the second array configuration to the first match configuration and the second match configuration, respectively, by controlling the on and off states of (a) each discrete capacitor of the first capacitor array and (b) each discrete capacitor of the second capacitor array.
    Type: Grant
    Filed: December 29, 2015
    Date of Patent: October 22, 2019
    Assignee: RENO TECHNOLOGIES, INC.
    Inventors: Imran Ahmed Bhutta, Ching Ping Huang, Michael Gilliam Ulrich, Tomislav Lozic
  • Patent number: 10333001
    Abstract: A fin structure disposed over a substrate and a method of forming a fin structure are disclosed. The fin structure includes a mesa, a channel disposed over the mesa, and a convex-shaped feature disposed between the channel and the mesa. The mesa has a first semiconductor material, and the channel has a second semiconductor material different from the first semiconductor material. The convex-shaped feature is stepped-shaped, stair-shaped, or ladder-shaped. The convex-shaped feature includes a first isolation feature disposed between the channel and the mesa, and a second isolation feature disposed between the channel and the first isolation feature. The first isolation feature is U-shaped, and the second isolation feature is rectangular-shaped. A portion of the second isolation feature is surrounded by the channel and another portion of the second isolation feature is surrounded by the first isolation feature.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: June 25, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Gin-Chen Huang, Ching-Hong Jiang, Neng-Kuo Chen, Sey-Ping Sun, Clement Hsingjen Wann
  • Patent number: 10290723
    Abstract: A semiconductor device includes a substrate and a gate structure on the substrate, in which the gate structure includes a high-k dielectric layer on the substrate and a bottom barrier metal (BBM) layer on the high-k dielectric layer. Preferably, the BBM layer includes a top portion, a middle portion, and a bottom portion, the middle portion being a nitrogen rich portion, the top portion and the bottom portion being titanium rich portions, and the top portion, the middle portion, and the bottom portion are of same material composition.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: May 14, 2019
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chun-Tsen Lu, Chien-Ming Lai, Lu-Sheng Chou, Ya-Huei Tsai, Ching-Hsiang Chiu, Yu-Tung Hsiao, Chen-Ming Huang, Kun-Ju Li, Yu-Ping Wang
  • Publication number: 20160134260
    Abstract: A control circuit for a impedance matching circuit having first and second capacitor arrays receives as input one or more RF parameters of the impedance matching circuit, and in response thereto: determines a first match configuration for the first capacitor array and a second match configuration for the second capacitor array to create an impedance match between a fixed RF source impedance and a variable RF load impedance, the first match configuration and the second match configuration being determined from one or more look-up tables and based upon the detected one or more RF parameters; and alters at least one of the first array configuration and the second array configuration to the first match configuration and the second match configuration, respectively, by controlling the on and off states of (a) each discrete capacitor of the first capacitor array and (b) each discrete capacitor of the second capacitor array.
    Type: Application
    Filed: December 29, 2015
    Publication date: May 12, 2016
    Inventors: Imran Ahmed Bhutta, Ching Ping Huang, Michael Gilliam Ulrich, Tomislav Lozic
  • Publication number: 20150086496
    Abstract: The present disclosure relates to a composition of scar gel. The composition of scar gel includes a silicone fluid, a volatile diluent, a precipitated silica powder, and an embellishing powder. The silicone fluid is fully miscible with the volatile diluent, and the precipitated silica powder and the embellishing powder are uniformly dispersed in the silicone fluid and the volatile diluent.
    Type: Application
    Filed: April 15, 2014
    Publication date: March 26, 2015
    Applicant: FAR EASTERN NEW CENTURY CORPORATION
    Inventors: Yong-Yi WU, Ching-Ping HUANG, Ai-Yun SHIH
  • Patent number: 8492513
    Abstract: The present invention provides a method for producing a silicone hydrogel having a high water content. The method comprises the following steps: (a) polymerizing a monomer mixture to form the silicone hydrogel, wherein the monomer mixture comprises at least one silicon-containing monomer and at least one ionic monomer; and (b) placing the silicone hydrogel in an alkaline solution for at least 20 minutes, wherein the alkaline solution has a pH not less than 7.5 and the ionic monomer is present in an amount not less than 0.7 wt % based on the total dry weight of the silicone hydrogel.
    Type: Grant
    Filed: October 14, 2011
    Date of Patent: July 23, 2013
    Assignee: Far Eastern New Century Corporation
    Inventors: Chih-Ta Lee, Ching-Ping Huang, Yi-Hsuan Chang, Ken-Yuan Chang
  • Publication number: 20120214899
    Abstract: The present invention provides a method for producing a silicone hydrogel having a high water content. The method comprises the following steps: (a) polymerizing a monomer mixture to form the silicone hydrogel, wherein the monomer mixture comprises at least one silicon-containing monomer and at least one ionic monomer; and (b) placing the silicone hydrogel in an alkaline solution for at least 20 minutes, wherein the alkaline solution has a pH not less than 7.5 and the ionic monomer is present in an amount not less than 0.7 wt % based on the total dry weight of the silicone hydrogel.
    Type: Application
    Filed: October 14, 2011
    Publication date: August 23, 2012
    Inventors: Chih-Ta LEE, Ching-Ping HUANG, Yi-Hsuan CHANG, Ken-Yuan CHANG
  • Publication number: 20120214898
    Abstract: The present invention provides a silicone hydrogel comprising a reaction product of a monomer mixture for forming the silicone hydrogel and water, wherein the water is present in an amount not less than 50 wt % based on the total weight of the silicone hydrogel. The monomer mixture comprises at least one silicon-containing monomer and at least one ionic monomer, wherein the ionic monomer is present in an amount not less than 0.7 wt % based on the total dry weight of the silicone hydrogel. The present invention also provides ocular articles made from the silicone hydrogel.
    Type: Application
    Filed: October 14, 2011
    Publication date: August 23, 2012
    Inventors: CHIH-TA LEE, Ching-Ping Huang, Yi-Hsuan Chang, Ken-Yuan Chang
  • Publication number: 20110166248
    Abstract: The present invention provides a reactive hydrophilic copolymer consisting essentially of units formed by ethylenically unsaturated hydrophilic monomers and units of formula (I) or (II) formed by ethylenically unsaturated monomers having alkoxy silane functional groups in a random order: wherein the copolymer has a molecular weight of at least 50,000, and wherein R1, R2 and R3 can be the same or different and are independently selected from H or C1-3 alkyl; R is C1-3 alkyl; X, Y and Z can be the same or different and are independently selected from R? or OR?, provided that at least one of X, Y and Z is OR?; R? is H or C1-3 alkyl; and the equivalent ratio of the units formed by ethylenically unsaturated hydrophilic monomers to the units of formula (I) or (II) is within the range of 5/1 to 200/1. The present invention also provides silicone hydrogel compositions comprising the reactive hydrophilic copolymer of the present invention and ocular articles made therefrom.
    Type: Application
    Filed: December 30, 2010
    Publication date: July 7, 2011
    Inventors: Yu-Fang HSU, Ching-Ping HUANG, Chia-Chang LIU
  • Patent number: 7906563
    Abstract: A polysiloxane-based prepolymer of a three-dimensional network structure produced by hydrolysis-condensation of a first mixture having a tetra-alkoxysilane compound, an ethylenically unsaturated organosiloxane monomer, and a hydrophilic silicon-containing polyfunctional monomer. A hydrogel is prepared by polymerizing a second mixture having the aforesaid polysiloxane-based prepolymer, an acrylated silicon-containing monomer, and an ethylenically unsaturated hydrophilic monomer.
    Type: Grant
    Filed: December 1, 2008
    Date of Patent: March 15, 2011
    Assignee: Far Eastern New Century Corporation
    Inventors: Ching-Ping Huang, Roy Wu, Ken-Yuan Chang
  • Publication number: 20090170976
    Abstract: A polysiloxane-based prepolymer of a three-dimensional network structure produced by hydrolysis-condensation of a first mixture having a tetra-alkoxysilane compound, an ethylenically unsaturated organosiloxane monomer, and a hydrophilic silicon-containing polyfunctional monomer. A hydrogel is prepared by polymerizing a second mixture having the aforesaid polysiloxane-based prepolymer, an acrylated silicon-containing monomer, and an ethylenically unsaturated hydrophilic monomer.
    Type: Application
    Filed: December 1, 2008
    Publication date: July 2, 2009
    Inventors: Ching-Ping Huang, Roy Wu, Ken-Yuan Chang
  • Patent number: 7218096
    Abstract: An adjusting device for a chip adapter. The adjusting device comprises a main body having a plurality of adjusting holes into which testing pins of the adapter are inserted and a slider disposed on the main body and sliding perpendicular to the top surface thereof for easy removal the chip adapter without mis-alignment of testing pins.
    Type: Grant
    Filed: September 13, 2004
    Date of Patent: May 15, 2007
    Assignee: Asustek Computer, Inc.
    Inventors: Ching-Ping Huang, Chi-Chuan Chu
  • Publication number: 20050073330
    Abstract: An adjusting device for a chip adapter. The adjusting device comprises a main body having a plurality of adjusting holes into which testing pins of the adapter are inserted and a slider disposed on the main body and sliding perpendicular to the top surface thereof for easy removal the chip adapter without mis-alignment of testing pins.
    Type: Application
    Filed: September 13, 2004
    Publication date: April 7, 2005
    Inventors: Ching-Ping Huang, Chi-Chuan Chu