Patents by Inventor Ching-Ping Wong

Ching-Ping Wong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11845663
    Abstract: A method for integrally forming a graphene film (GF) of a high specific surface area (SSA) by ultrafast ultraviolet (UV) laser processing, includes: selecting a carbon precursor material, where the carbon precursor material is one selected from the group consisting of a biomass/hydrogel composite and a heavy hydrocarbon compound; adding an activator solution to an inside of the carbon precursor material to obtain a composite with an activator uniformly loaded, and spreading the composite on a flexible substrate to form a carbon precursor material layer; heating and drying the carbon precursor material layer; in-situ processing with an ultrafast UV laser to obtain an activated GF of a high SSA; and cleaning and drying the activated GF. With the method of the present disclosure, a microporous activated GF of a high SSA can be directly processed in-situ on a flexible substrate.
    Type: Grant
    Filed: December 25, 2022
    Date of Patent: December 19, 2023
    Assignee: GUANGDONG UNIVERSITY OF TECHNOLOGY
    Inventors: Huilong Liu, Yun Chen, Xin Chen, Yixin Zheng, Kyoung-Sik Moon, Dachuang Shi, Jian Gao, Ching-Ping Wong
  • Publication number: 20230357016
    Abstract: A method for integrally forming a graphene film (GF) of a high specific surface area (SSA) by ultrafast ultraviolet (UV) laser processing, includes: selecting a carbon precursor material, where the carbon precursor material is one selected from the group consisting of a biomass/hydrogel composite and a heavy hydrocarbon compound; adding an activator solution to an inside of the carbon precursor material to obtain a composite with an activator uniformly loaded, and spreading the composite on a flexible substrate to form a carbon precursor material layer; heating and drying the carbon precursor material layer; in-situ processing with an ultrafast UV laser to obtain an activated GF of a high SSA; and cleaning and drying the activated GF. With the method of the present disclosure, a microporous activated GF of a high SSA can be directly processed in-situ on a flexible substrate.
    Type: Application
    Filed: December 25, 2022
    Publication date: November 9, 2023
    Applicant: GUANGDONG UNIVERSITY OF TECHNOLOGY
    Inventors: Huilong LIU, Yun CHEN, Xin CHEN, Yixin ZHENG, Kyoung-Sik MOON, Dachuang SHI, Jian GAO, Ching-Ping WONG
  • Patent number: 10850304
    Abstract: A device for processing microstructure arrays of polystyrene-graphene nanocomposites, including a laser generator, a vacuum chamber, an object stage, an ultraviolet filter and a gas flow control unit. The object stage is detachably fixed to a bottom of the vacuum chamber with a passage that can be opened or closed. The ultraviolet filter is provided in the vacuum chamber. A laser light emitted by the laser generator arrives at the object stage through the ultraviolet filter. The object stage is configured to place a sample to be processed. The gas flow control unit is communicated with the vacuum chamber and is configured to control the flow of the gas entering the vacuum chamber. The vacuum chamber is fixed on a three-axis precision positioning platform via a vacuum chamber clamp. The device disclosed herein aims to solve the existing difficulty in processing microstructure arrays of polystyrene-graphene nanocomposites.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: December 1, 2020
    Assignee: Guangdong University of Technology
    Inventors: Yun Chen, Junyu Long, Shuang Zhou, Xin Chen, Jian Gao, Qiang Liu, Ching-Ping Wong, Shenghui Zhang
  • Patent number: 10784400
    Abstract: A mass transfer method for Micro-LEDs with a temperature-controlled adhesive layer, including: configuring a self-assembling structure based on Micro-LED dies and a transfer substrate having a self-receiving structure coated on its surface with a temperature-controlled adhesive layer; distributing the Micro-LED dies in water, soaking the transfer substrate in water and heating water to perform self-assembling; carrying out transferring and removing the transfer substrate to separate Micro-LED dies from a transfer substrate then onto a target substrate.
    Type: Grant
    Filed: December 7, 2019
    Date of Patent: September 22, 2020
    Assignee: Guangdong University of Technology
    Inventors: Yun Chen, Dachuang Shi, Xin Chen, Qiang Liu, Jian Gao, Ching-Ping Wong
  • Publication number: 20200230644
    Abstract: A device for processing microstructure arrays of polystyrene-graphene nanocomposites, including a laser generator, a vacuum chamber, an object stage, an ultraviolet filter and a gas flow control unit. The object stage is detachably fixed to a bottom of the vacuum chamber with a passage that can be opened or closed. The ultraviolet filter is provided in the vacuum chamber. A laser light emitted by the laser generator arrives at the object stage through the ultraviolet filter. The object stage is configured to place a sample to be processed. The gas flow control unit is communicated with the vacuum chamber and is configured to control the flow of the gas entering the vacuum chamber. The vacuum chamber is fixed on a three-axis precision positioning platform via a vacuum chamber clamp. The device disclosed herein aims to solve the existing difficulty in processing microstructure arrays of polystyrene-graphene nanocomposites.
    Type: Application
    Filed: December 17, 2019
    Publication date: July 23, 2020
    Inventors: Yun CHEN, Junyu LONG, Shuang ZHOU, Xin CHEN, Jian GAO, Qiang LIU, Ching-Ping WONG, Shenghui ZHANG
  • Publication number: 20200203558
    Abstract: A mass transfer method for Micro-LEDs with a temperature-controlled adhesive layer, including: configuring a self-assembling structure based on Micro-LED dies and a transfer substrate having a self-receiving structure coated on its surface with a temperature-controlled adhesive layer; distributing the Micro-LED dies in water, soaking the transfer substrate in water and heating water to perform self-assembling; carrying out transferring and removing the transfer substrate to separate Micro-LED dies from a transfer substrate then onto a target substrate.
    Type: Application
    Filed: December 7, 2019
    Publication date: June 25, 2020
    Inventors: Yun CHEN, Dachuang SHI, Xin CHEN, Qiang LIU, Jian GAO, Ching-Ping Wong
  • Patent number: 10134634
    Abstract: An embodiment of a method for metal-assisted chemical etching of a semiconductive substrate comprises forming a patterned coating on a top surface of a substrate layer of a silicon wafer; applying a noble metal layer over the patterned coating such that a portion of the noble metal layer is in contact with the top surface of the substrate layer; and immersing the silicon wafer in a wet etching solution to form a trench under the portion of the noble metal layer that is contact with the top surface of the substrate layer. Further, the trench may be filled with copper material to form a through silicon via structure. Such embodiments provide etching techniques that enable etched formations that are deep (e.g., high-aspect-ratio) and uniform as opposed to shallow etchings (i.e., low-aspect-ratio) or non-uniform deep etchings.
    Type: Grant
    Filed: November 2, 2015
    Date of Patent: November 20, 2018
    Assignee: GEORGIA TECH RESEARCH CORPORATION
    Inventors: Liyi Li, Ching Ping Wong, Jack K. Moon, Xueying Zhao
  • Publication number: 20170342273
    Abstract: An exemplary embodiment of the present invention provides a filler comprising a silica core, a first layer in communication with the core, and a second layer in communication with the first layer. The presence of the second layer can decrease the coefficient of thermal expansion, decrease the composite modulus, and increase the glass transition temperature of the modulus as compared to fillers without a second layer.
    Type: Application
    Filed: May 30, 2017
    Publication date: November 30, 2017
    Inventors: Chia-Chi Tuan, Kyoung-Sik Moon, Ching Ping Wong
  • Patent number: 9490043
    Abstract: The present invention provides for a relatively simple method to decrease the electrical resistivity of conductive adhesives by in-situ nanoparticle formation and sintering using a reducing agent. The reducing agent was found to cause sintering within the conductive adhesive by facilitating the reduction of the silver salts of fatty acids on the surface of silver flakes, leading to the formation of nano-/submicron-silver necks. These silver necks bridge neighboring silver flakes, decreasing the contact resistance between flakes within the conductive adhesives. The reducing agent also removes at least a portion of the lubricant commonly found on silver flakes used in conductive adhesives, thus reducing the tunneling resistance between the silver flakes.
    Type: Grant
    Filed: February 23, 2012
    Date of Patent: November 8, 2016
    Assignee: GEORGIA TECH RESEARCH CORPORATION
    Inventors: Rongwei Zhang, Ching-Ping Wong
  • Publication number: 20160126133
    Abstract: An embodiment of a method for metal-assisted chemical etching of a semiconductive substrate comprises forming a patterned coating on a top surface of a substrate layer of a silicon wafer; applying a noble metal layer over the patterned coating such that a portion of the noble metal layer is in contact with the top surface of the substrate layer; and immersing the silicon wafer in a wet etching solution to form a trench under the portion of the noble metal layer that is contact with the top surface of the substrate layer. Further, the trench may be filled with copper material to form a through silicon via structure. Such embodiments provide etching techniques that enable etched formations that are deep (e.g., high-aspect-ratio) and uniform as opposed to shallow etchings (i.e., low-aspect-ratio) or non-uniform deep etchings.
    Type: Application
    Filed: November 2, 2015
    Publication date: May 5, 2016
    Inventors: Liyi Li, Ching Ping Wong, Jack K. Moon, Xueying Zhao
  • Patent number: 8702897
    Abstract: Embodiments of the present disclosure include structures including a layer of carbon nanotubes, methods of making structures including a layer of carbon nanotubes, and the like.
    Type: Grant
    Filed: May 26, 2010
    Date of Patent: April 22, 2014
    Assignee: Georgia Tech Research Corporation
    Inventors: Wei Lin, Ching Ping Wong
  • Publication number: 20130056689
    Abstract: The present invention provides for a relatively simple method to decrease the electrical resistivity of conductive adhesives by in-situ nanoparticle formation and sintering using a reducing agent. The reducing agent was found to cause sintering within the conductive adhesive by facilitating the reduction of the silver salts of fatty acids on the surface of silver flakes, leading to the formation of nano-/submicron-silver necks. These silver necks bridge neighboring silver flakes, decreasing the contact resistance between flakes within the conductive adhesives. The reducing agent also removes at least a portion of the lubricant commonly found on silver flakes used in conductive adhesives, thus reducing the tunneling resistance between the silver flakes.
    Type: Application
    Filed: February 23, 2012
    Publication date: March 7, 2013
    Applicant: Georgia Tech Research Corporation
    Inventors: Rongwei Zhang, Ching-Ping Wong
  • Patent number: 8278191
    Abstract: Disclosed herein are various embodiments related to metal-assisted chemical etching of substrates on the micron, sub-micron and nano scales. In one embodiment, among others, a method for metal-assisted chemical etching includes providing a substrate; depositing a non-spherical metal catalyst on a surface of the substrate; etching the substrate by exposing the non-spherical metal catalyst and the substrate to an etchant solution including a composition of a fluoride etchant and an oxidizing agent; and removing the etched substrate from the etchant solution.
    Type: Grant
    Filed: March 31, 2010
    Date of Patent: October 2, 2012
    Assignee: Georgia Tech Research Corporation
    Inventors: Owen Hildreth, Ching Ping Wong, Yonghao Xiu
  • Patent number: 8206776
    Abstract: Methods of reducing pollution problems in power lines systems are disclosed herein. In one embodiment, the method comprises applying Lotus Effect materials as a (superhydrophobicity) protective coating for external electrical insulation system applications. Further disclosed are methods of fabricating/preparing Lotus Effect coatings. Selected inorganic or polymeric materials are applied on the insulating material surface, and stable superhydrophobic coatings can be fabricated. Various UV stabilizers and UV absorbers can be incorporated into the coating system to enhance the coating's UV stability. Other aspects, features, and embodiments are also discussed and claimed.
    Type: Grant
    Filed: April 2, 2010
    Date of Patent: June 26, 2012
    Assignee: Georgia Tech Research Corporation
    Inventors: Jun Li, Lianhua Fan, Ching-Ping Wong, Franklin Cook Lambert
  • Patent number: 8173525
    Abstract: Systems and methods of nanomaterial transfer are described. A method of nanomaterial transfer involving fabricating a template and synthesizing nanomaterials on the template. Subsequently, the nanomaterials are transferred to a substrate by pressing the template onto the substrate. In some embodiments, the step of transferring the nanomaterials involves pressing the template onto the substrate such that the nanomaterials are embedded below a surface layer of the substrate. In some embodiments, the temperature of the plurality of nanomaterials is raised to assist the transfer of the nanomaterials to the substrate.
    Type: Grant
    Filed: June 16, 2006
    Date of Patent: May 8, 2012
    Assignee: Georgia Tech Research Corporation
    Inventors: Samuel Graham, Jr., William P. King, Ching-ping Wong
  • Publication number: 20100304101
    Abstract: Embodiments of the present disclosure include structures including a layer of carbon nanotubes, methods of making structures including a layer of carbon nanotubes, and the like.
    Type: Application
    Filed: May 26, 2010
    Publication date: December 2, 2010
    Inventors: Wei Lin, Ching Ping Wong
  • Publication number: 20100189925
    Abstract: Methods of applying Lotus Effect materials as a (superhydrophobicity) protective coating for external electrical insulation system applications, as well as the method of fabricating/preparing Lotus Effect coatings are discussed. Selected inorganic or polymeric materials are applied on the insulating material surface, and stable superhydrophobic coatings can be fabricated. Various UV stabilizers and UV absorbers can be incorporated into the coating system to enhance the coating's UV stability. Other aspects, features, and embodiments are also discussed and claimed.
    Type: Application
    Filed: April 2, 2010
    Publication date: July 29, 2010
    Inventors: JUN LI, Lianhua Fan, Ching-Ping Wong, Franklin Cook Lambert
  • Patent number: 7722951
    Abstract: The present invention is a method of applying Lotus Effect materials as a (superhydrophobicity) protective coating for external electrical insulation system applications, as well as the method of fabricating/preparing Lotus Effect coatings. Selected inorganic or polymeric materials are applied on the insulating material surface, and stable superhydrophobic coatings can be fabricated. Various UV stabilizers and UV absorbers can be incorporated into the coating system to enhance the coating's UV stability.
    Type: Grant
    Filed: October 15, 2004
    Date of Patent: May 25, 2010
    Assignee: Georgia Tech Research Corporation
    Inventors: Jun Li, Lianhua Fan, Ching-Ping Wong, Franklin Cook Lambert
  • Patent number: 7663381
    Abstract: An electrical condition monitoring method utilizes measurement of electrical resistivity of a conductive composite degradation sensor to monitor environmentally induced degradation of a polymeric product such as insulated wire and cable. The degradation sensor comprises a polymeric matrix and conductive filler. The polymeric matrix may be a polymer used in the product, or it may be a polymer with degradation properties similar to that of a polymer used in the product. The method comprises a means for communicating the resistivity to a measuring instrument and a means to correlate resistivity of the degradation sensor with environmentally induced degradation of the product.
    Type: Grant
    Filed: April 9, 2008
    Date of Patent: February 16, 2010
    Inventors: Kenneth S. Watkins, Jr., Shelby J. Morris, Daniel D. Masakowski, Ching Ping Wong, Shijian Luo
  • Patent number: 7527749
    Abstract: Modified electrically conductive adhesives and methods of preparation thereof, are disclosed.
    Type: Grant
    Filed: October 18, 2005
    Date of Patent: May 5, 2009
    Assignee: Georgia Tech Research Corporation
    Inventors: Yi Li, Kyoung-sik Moon, Ching Ping Wong