Abstract: A voltage sensing circuit receives an input voltage signal and generates an output voltage signal. The circuit has a sensing node. A first P-type MOS transistor is connected having one of its ends to receive the input voltage signal with the other end connected to the sensing node to provide a sensing signal. A first voltage source is connected to the gate of the first P-type transistor. A voltage dropping circuit receives the input voltage signal and generates a first drop voltage signal lower than the input voltage signal. A second P-type MOS transistor has one end connected to receive the first drop voltage signal. The first voltage source is also connected to the gate of the second P-type MOS transistor. A third N-type MOS transistor has a gate connected to the other end of the second P-type MOS transistor. The third N-type MOS transistor has one of its ends connected to the sensing node. A second voltage source is connected to the other end of the third N-type MOS transistor.

Abstract: A method for forming an array of antifuse structures on a semiconductor substrate which previously has had CMOS devices fabricated thereupon up to first metallization. A fuse structure is formed as a sandwich by successively depositing a bottom layer of TiW, a layer of amorphous silicon, and a top layer of TiW. The amorphous silicon is formed in an antifuse via formed in a dielectric layer covering the bottom layer of TiW. First metallization is deposited and patterned over the top layer of TiW. An intermetal dielectric layer is formed over the fuse array and second metal conductors are formed thereupon. An alternative embodiment includes forming an oxide sidewall spacer around the periphery of an antifuse structure. Connection resistance to the bottom layer of TiW is lowered by using a number of vias between the second-metal conductors and the bottom layer of TiW in a row of an array of antifuse devices.