Patents by Inventor Ching-Shan Tsai

Ching-Shan Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12204163
    Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
    Type: Grant
    Filed: February 5, 2024
    Date of Patent: January 21, 2025
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
  • Publication number: 20220387863
    Abstract: A golf club head includes a main body and a plate member disposed on the main body. The plate member includes a plurality of carbon fiber layers which are stacked on each other and are impregnated with a thermoset carbon fiber resin containing carbon nanotubes. The carbon nanotubes are present in an amount ranging from 0.01 wt% to 5 wt%, based on the total weight of the thermoset carbon fiber resin.
    Type: Application
    Filed: February 11, 2022
    Publication date: December 8, 2022
    Inventors: Ching-Shan TSAI, Pei-Chun CHAO, Ming-Fu SU, Chun-Hao HUANG
  • Publication number: 20160278235
    Abstract: A heat dissipation casing is adapted to be mounted to an electronic device, and includes a casing body, a support member and a plurality of thermally conductive fibers. The casing body has an inner surface facing the electronic device, and an outer surface opposite to the inner surface. The support member is connected to the inner surface of the casing body. The thermally conductive fibers are distributed in the support member.
    Type: Application
    Filed: September 1, 2015
    Publication date: September 22, 2016
    Inventors: Ching-Shan TSAI, Cetera CHEN, Chun-Yu CHANG
  • Publication number: 20160271840
    Abstract: A method of making a heat dissipation element includes the steps of: preparing a liquid matrix having a viscosity ranging from 1000 cps to 30000 cps; dipping a plurality of thermally conductive fibers into the liquid matrix and having the thermally conductive fibers partially exposed from the liquid matrix; and solidifying the liquid matrix into a support member from which the thermally conductive fibers are partially exposed.
    Type: Application
    Filed: September 1, 2015
    Publication date: September 22, 2016
    Inventors: Ching-Shan TSAI, Cetera CHEN, Chun-Yu CHANG
  • Publication number: 20110083797
    Abstract: A method of forming a flexible display panel and an alignment layer and spacers thereof includes the following steps. A base material is provided. A shaping process is then performed on the base material to render the base material into a structural layer including an alignment layer monolithically formed with a plurality of spacers. Subsequently, a first transparent conductive film and a second transparent conductive film are provided, and the structural layer is mounted between the first transparent conductive film and the second transparent conductive film such that the first transparent conductive film, the structural layer and the second transparent conductive film form a sandwich structure.
    Type: Application
    Filed: November 3, 2009
    Publication date: April 14, 2011
    Inventors: Chi-Yuan Huang, Keng-Yu Tsao, Jui-Shu Chou, Ching-Shan Tsai, Chi-Neng Mo, Mei-Tsao Chiang