Abstract: A method and apparatus for performing de-skew control are provided, where the method is applied to an electronic device. The method includes the steps of: performing a symbol detection at a plurality of lanes of the electronic device, respectively, to determine locations of a specific symbol at the plurality of lanes, respectively; according to the locations of the specific symbol at the plurality of lanes, selectively rearranging decoded data in the plurality of lanes to generate a plurality of sets of de-skewed data respectively corresponding to the plurality of lanes; and by buffering the plurality of sets of de-skewed data, selectively delaying output of the plurality of sets of de-skewed data to control beginning of the plurality of sets of de-skewed data to be simultaneously output.

Abstract: A portable electronic device includes: a printed circuit board having opposite first and second surfaces and provided with at least one electronic component, the first surface being provided with at least one conductive pad that is electrically coupled to the electronic component; and a flexible circuit board having a main part stacked on the second surface of the printed circuit board, and an extension part extending and folded from the main part and stacked on the first surface of the printed circuit board. The extension part is provided with at least one conductive bump thereon. An outer surface of the main part is provided with at least one input key that is electrically coupled to the conductive bump. The conductive pad is bonded to the conductive bump.

Abstract: A solder applying apparatus includes a tray body having a base portion and a surrounding portion extending from a periphery of the base portion, cooperating with the base portion to define a solder-accommodating space therebetween for receiving a solder material therein, and having a top end distal from the base portion. The base portion has an inner wall confining a bottom side of the solder-accommodating space. The inner wall of the base portion is divided into a plurality of parallel planar regions. Each of the planar regions cooperates with an adjacent one of the planar regions to define a step therebetween so as to permit the planar regions to have different depths relative to the top end of the surrounding portion.

Abstract: A portable electronic device includes: a printed circuit board having opposite first and second surfaces and provided with at least one electronic component, the first surface being provided with at least one conductive pad that is electrically coupled to the electronic component; and a flexible circuit board having a main part stacked on the second surface of the printed circuit board, and an extension part extending and folded from the main part and stacked on the first surface of the printed circuit board. The extension part is provided with at least one conductive bump thereon. An outer surface of the main part is provided with at least one input key that is electrically coupled to the conductive bump. The conductive pad is bonded to the conductive bump.

Abstract: A dual-focus lens includes a stop and at least two lenses. One of the lenses is relatively close to the stop, and formed with a first transmission area and a second transmission area. When the at least two lenses are fixed without shifting any lens, an image beam reflected from a first object distance can pass through the first transmission area to form a clear optical image on an image formation area located at a fixed position, and an image beam reflected from a second object distance can pass through the second transmission area to form a clear optical image on the same image formation area, so as to achieve a purpose of providing double focuses without any active elements or changing the image formation distance.

Abstract: The present invention discloses a compact camera module (CCM) package structure that allows a lens module to adjoin directly on the CCM module to prevent height error that occurs when CCM module is soldered to the substrate from affecting the imaging performance of chip module. The CCM package structure comprises a substrate, a sensor chip module and a lens module. The lens module can encase and cover the sensor chip module, and adjoin the periphery of a light transmitting plane of the sensor chip module through a concave step disposed in the lens module so that the lens module can synchronously maintain the same horizontal angle and height as the light-transmitting plane of sensor chip module, thereby reducing error occurred in the manufacturing process and allowing the lens module and the sensor chip module to produce better focusing and image quality.

Abstract: The present invention is related to a microminiature lens module and a lens device with the microminiature lens module. The microminiature lens module is applied in the lens device in order to decrease the entire outer diameter of the lens device. The microminiature lens module comprises a containing base and a lens set, wherein the containing base has a through hole, and an inner thread is located on a partial inner wall of the through hole. A radius with the inner thread of the through hole is smaller than a radius without the inner thread of the through hole. The lens set is female-connected to the through hole. An outer thread is on an outer rim of the lens set where relative to the inner thread, and the outer thread collocates the inner thread. A radius with the outer thread of the lens set is smaller than a radius without the outer thread of the lens set.

Abstract: The present invention is related to a microminiature lens module and a lens device with the microminiature lens module. The microminiature lens module is applied in the lens device in order to decrease the entire outer diameter of the lens device. The microminiature lens module comprises a containing base and a lens set, wherein the containing base has a through hole, and an inner thread is located on a partial inner wall of the through hole. A radius with the inner thread of the through hole is smaller than a radius without the inner thread of the through hole. The lens set is female-connected to the through hole. An outer thread is on an outer rim of the lens set where relative to the inner thread, and the outer thread collocates the inner thread. A radius with the outer thread of the lens set is smaller than a radius without the outer thread of the lens set.

Abstract: A holding apparatus for an optical integration rod is installed outside of an optical integration rod. It comprises a holder which is a heat sink substrate with fins disposed at the outside surface thereof. A thermal conductivity material is filled in between the holding apparatus and the optical integration rod to allow the heat yielded in the rod to be guided out through the thermal conductivity material and then to be transmitted to the holder to carry away by way of a natural or forced convection manner so as to attain to a heat dissipation effect. Because the holder has a broader heat exchange area and the heat conduction function of the thermal conductivity material is better than air, the heat contact resistance between the holder and the rod can be reduced so as to enhance the heat dissipation efficiency.

Abstract: A heat sink retainer has a rectangle frame with four corners each having a slit defined through the corner. A pair of U shape clamping strips each has two legs. Each leg extends through a corresponding one of the slits. A controlling device pivotally connects to each of the clamping strips and has two driving bosses and each driving boss is integrally formed on a distal end of the controlling device and is clamped between the frame and the clamping strip to control movement of the distal ends of the clamping strip to engage/disengage with holes in the heat sink.