Abstract: A three-dimensional (3D) scanning system includes a projector that generates an emitted light projected on an object, a reflected light being reflected from the object; a sensor that generates image data according to the reflected light; and a depth processor that generates depth data according to the image data and at least one modified factor representing corresponding deviation amount between the image data and an ideal image data due to a circle of confusion caused by the reflected light passing a lens of the sensor and then irradiating a sense plane of the sensor out of focus.

Abstract: The present disclosure relates to an integrated chip including a dielectric structure over a substrate. A first capacitor is disposed between sidewalls of the dielectric structure. The first capacitor includes a first electrode between the sidewalls of the dielectric structure and a second electrode between the sidewalls and over the first electrode. A second capacitor is disposed between the sidewalls. The second capacitor includes the second electrode and a third electrode between the sidewalls and over the second electrode. A third capacitor is disposed between the sidewalls. The third capacitor includes the third electrode and a fourth electrode between the sidewalls and over the third electrode. The first capacitor, the second capacitor, and the third capacitor are coupled in parallel by a first contact on a first side of the first capacitor and a second contact on a second side of the first capacitor.

Abstract: Some embodiments relate to an integrated chip including a substrate having a first side and a second side opposite the first side. The integrated chip further includes a first photodetector positioned in a first pixel region within the substrate. A floating diffusion region with a first doping concentration of a first polarity is positioned on the first side of the substrate in the first pixel region. A first body contact region with a second doping concentration of a second polarity different from the first polarity is positioned on the second side of the substrate in the first pixel region.

Abstract: A transmission device includes a daisy chain structure composed of at least three daisy chain units arranged periodically and continuously. Each of the daisy chain units includes first, second and third conductive lines, and first and second conductive pillars. The first and second conductive lines at a first layer extend along a first direction and are discontinuously arranged. The third conductive line at a second layer extends along the first direction and is substantially parallel to the first and second conductive lines. The first conductive pillar extends in a second direction. The second direction is different from the first direction. A first part of the first conductive pillar is connected to the first and third conductive lines. The second conductive pillar extends in the second direction. A first part of the second conductive pillar is connected to the second and third conductive lines.

Abstract: A transmission device for suppressing the glass-fiber effect includes a circuit board and a transmission line. The circuit board includes a plurality of glass fibers, so as to define a fiber pitch. The transmission line is disposed on the circuit board. The transmission line includes a plurality of non-parallel segments. Each of the non-parallel segments of the transmission line has an offset distance with respect to a reference line. The offset distance is longer than or equal to a half of the fiber pitch.

Abstract: This disclosure relates to a stretchable composite electrode and a fabricating method thereof, and particularly relates to a stretchable composite electrode including a silver nanowire layer and a flexible polymer film and a fabricating method thereof.

Abstract: A method may include forming a mask layer on top of a first dielectric layer formed on a first source/drain and a second source/drain, and creating an opening in the mask layer and the first dielectric layer that exposes portions of the first source/drain and the second source/drain. The method may include filling the opening with a metal layer that covers the exposed portions of the first source/drain and the second source/drain, and forming a gap in the metal layer to create a first metal contact and a second metal contact. The first metal contact may electrically couple to the first source/drain and the second metal contact may electrically couple to the second source/drain. The gap may separate the first metal contact from the second metal contact by less than nineteen nanometers.

Abstract: A server includes a chassis, an air duct, a sensing module and a board management controller. The air duct is disposed in the chassis. The sensing module is disposed in the chassis. The sensing module senses whether the air duct is correctly installed. The board management controller is disposed in the chassis and coupled to the sensing module. When the air duct is not correctly installed, the sensing module notifies the board management controller to generate a warning message.

Abstract: A three-dimensional sensing system includes a plurality of scanners each emitting a light signal to a scene to be sensed and receiving a reflected light signal, according to which depth information is obtained. Only one scanner executes transmitting corresponding light signal and receiving corresponding reflected light signal at a time.

Abstract: The present disclosure relates to an integrated chip including a dielectric structure over a substrate. A first capacitor is disposed between sidewalls of the dielectric structure. The first capacitor includes a first electrode between the sidewalls of the dielectric structure and a second electrode between the sidewalls and over the first electrode. A second capacitor is disposed between the sidewalls. The second capacitor includes the second electrode and a third electrode between the sidewalls and over the second electrode. A third capacitor is disposed between the sidewalls. The third capacitor includes the third electrode and a fourth electrode between the sidewalls and over the third electrode. The first capacitor, the second capacitor, and the third capacitor are coupled in parallel by a first contact on a first side of the first capacitor and a second contact on a second side of the first capacitor.

Abstract: A portable electronic apparatus includes a structural member, a sound member, a circuit board, and a frame. The structural member has an opening and an accommodating recess. The sound member is accommodated in the accommodating recess, and has a top surface, a bottom surface, and a sound outlet. The sound outlet is located at the top surface. The circuit board cover plates the opening and has a first through hole corresponding to the sound outlet. The circuit board is disposed between the frame and the structural member. The frame has a second through hole corresponding to the sound outlet. The sound member is electrically connected to the circuit board. The sound outlet is communicated with the first and second through holes.

Abstract: A portable electronic apparatus includes a structural member, a sound member, a circuit board, and a frame. The structural member has an opening and an accommodating recess. The sound member is accommodated in the accommodating recess, and has a top surface, a bottom surface, and a sound outlet. The sound outlet is located at the top surface. The circuit board cover plates the opening and has a first through hole corresponding to the sound outlet. The circuit board is disposed between the frame and the structural member. The frame has a second through hole corresponding to the sound outlet. The sound member is electrically connected to the circuit board. The sound outlet is communicated with the first and second through holes.