Abstract: In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing the first side, a second semiconductor package having a first side and a second side opposing the first side, and a plurality of inter-package connector coupled between the first side of the first semiconductor package and the first side of the second semiconductor package. The PoP structure further includes a first molding material on the second side of the first semiconductor package. The second side of the second semiconductor package is substantially free of the first molding material.

Abstract: In an embodiment, a method includes: aligning a first package component with a second package component, the first package component having a first region and a second region, the first region including a first conductive connector, the second region including a second conductive connector; performing a first laser shot on a first portion of a top surface of the first package component, the first laser shot reflowing the first conductive connector of the first region, the first portion of the top surface of the first package component completely overlapping the first region; and after performing the first laser shot, performing a second laser shot on a second portion of the top surface of the first package component, the second laser shot reflowing the second conductive connector of the second region, the second portion of the top surface of the first package component completely overlapping the second region.

Abstract: A hand brake mechanism for a central processing unit cabinet comprising a base and a handle, wherein the base is fixed on the bottom of the cabinet and located between two wheels provided on the cabinet. A pair of engaging rods, each engaging rod having a guide pin at one end, are provided on both sides of the base. The handle is combined with the base, and is slidable thereon. There are a pair of guide plates provided on the handle at a location corresponding respectively to each of the engaging rods. The guide pin of the engaging rod comes into contact with the edge of the guide plate. When pushing or pulling the handle, the guide pin slides along the guide plate, and the engaging rod moves axially, to engage or disengage the wheels of the CPU cabinet.