Abstract: A package structure includes a wiring structure, a first electronic device, a second electronic device and a reinforcement structure. The wiring structure includes at least one dielectric layer, and at least one circuit layer in contact with the dielectric layer. The at least one circuit layer includes at least one interconnection portion. The first electronic device and the second electronic device are electrically connected to the wiring structure. The second electronic device is electrically connected to the first electronic device through the at least one interconnection portion of the at least one circuit layer. The reinforcement structure is disposed above the at least one interconnection portion of the at least one circuit layer.

Abstract: A semiconductor structure including a first dielectric layer and a conductive pattern is provided. The conductive pattern is disposed in the first dielectric layer, wherein the conductive pattern comprises an alloy layer and a first conductive layer, the alloy layer surrounds sidewalls and a bottom surface of the first conductive layer, a material of the alloy layer comprises an alloy of at least two metals, and at least one of the at least two metals relative to the rest of the at least two metals tends to be reacted with a dielectric material of the first dielectric layer.

Abstract: A pad device includes a hole formed in the edge portion for engaging with a screw. A board has an opening engaged with the screw and has two legs and a gap formed between the legs. The legs each has a recess formed in the bottom portion. A knob is threaded to the screw for securing the board to the pad. A rule has a shaft engaged in the recesses of the legs such that the rule may rotate relative to the board and such that the rule may be disengaged from the pad when the board is secured to the pad. The rule includes one or two edges each having a metal strip for protecting the rule from being cut.