Abstract: A light adjustment film is provided. The light adjustment film includes a substrate and a first light adjustment structure layer. The substrate has a first surface and a second surface opposite to each other. The first light adjustment structure layer is disposed on the first surface of the substrate. The first light adjustment structure layer includes a plurality of light adjustment structures. Each of the light adjustment structures has a long axis, a short axis and a thickness. The long axis of the light adjusting structures is parallel to an extending direction. The light adjusting structures are composed of at least 100 types of structures having different shapes from each other. A backlight module having the aforementioned light adjustment film is also provided.

Abstract: A transfer printing apparatus includes a mold, a stamper, a pressing roller and a curing unit. The mold has a first surface with first and second concavities, the second concavity has first and second planes, the first plane is perpendicular to the first surface, and the second plane is inclined to the first surface. The stamper having a second surface is disposed in the first concavity. The first and second surfaces are coplanar, and the second surface has transfer printing microstructures. The first and second surfaces are suitable for coated an adhesive layer. The pressing roller presses a base film onto the adhesive layer, such that the adhesive layer is integrated with the base film. The curing unit cures the adhesive layer on the base film, such that a taper corresponding to the second concavity and optical microstructures corresponding to the transfer printing microstructures are formed on the adhesive layer.

Abstract: A transfer printing apparatus includes a mold, a stamper, a pressing roller and a curing unit. The mold has a first surface with first and second concavities, the second concavity has first and second planes, the first plane is perpendicular to the first surface, and the second plane is inclined to the first surface. The stamper having a second surface is disposed in the first concavity. The first and second surfaces are coplanar, and the second surface has transfer printing microstructures. The first and second surfaces are suitable for coated an adhesive layer. The pressing roller presses a base film onto the adhesive layer, such that the adhesive layer is integrated with the base film. The curing unit cures the adhesive layer on the base film, such that a taper corresponding to the second concavity and optical microstructures corresponding to the transfer printing microstructures are formed on the adhesive layer.

Abstract: The present invention relates to an arc processing method and device with simultaneous chemical etching wherein the device comprises a conductive electrode, being the cathode, an auxiliary electrode, being the anode, an conductive fluid, and an non-conductive work piece for processing. Processing, and precision processing in particular, of non-conductive materials is obtained by simultaneous arc discharge and etching that are brought about by chemical reactions associated with cathode and anode. Moreover, the present invention discloses simultaneous arc processing and chemical etching that offers improved processing efficiency over conventional arc processing.

Abstract: The present invention relates to an electrochemical discharge method and device with self-acting bubble layers, wherein the device comprises an electrode, being the cathode, capable of supplying self-acting bubble layers, an auxiliary electrode, being the anode, an conducting fluid, and an non-conductive work piece for processing. Processing, and precision processing in particular, of non-conductive materials is obtained by arc discharge caused by high voltage application and chemical reactions associated with cathode and anode.

Abstract: The present invention relates to an electrochemical discharge method and device with self-acting bubble layers, wherein the device comprises an electrode, being the cathode, capable of supplying self-acting bubble layers, an auxiliary electrode, being the anode, an conducting fluid, and an non-conductive work piece for processing. Processing, and precision processing in particular, of non-conductive materials is obtained by arc discharge caused by high voltage application and chemical reactions associated with cathode and anode.

Abstract: The present invention relates to an arc processing method and device with simultaneous chemical etching wherein the device comprises a conductive electrode, being the cathode, an auxiliary electrode, being the anode, an conductive fluid, and an non-conductive work piece for processing. Processing, and precision processing in particular, of non-conductive materials is obtained by simultaneous arc discharge and etching that are brought about by chemical reactions associated with cathode and anode. Moreover, the present invention discloses simultaneous arc processing and chemical etching that offers improved processing efficiency over conventional arc processing.

Abstract: A method for making a probe device makes use of the main shaft of an electrodischarge machining machine to mount thereon a probe for effecting the drilling operation of a PCB board. Upon completion of the drilling operation, the probe is severed and then fastened with the PCB board.