Abstract: A semiconductor structure includes a die embedded in a molding material, the die having die connectors on a first side; a first redistribution structure at the first side of the die, the first redistribution structure being electrically coupled to the die through the die connectors; a second redistribution structure at a second side of the die opposing the first side; and a thermally conductive material in the second redistribution structure, the die being interposed between the thermally conductive material and the first redistribution structure, the thermally conductive material extending through the second redistribution structure, and the thermally conductive material being electrically isolated.

Abstract: A meniscus tear assisted determination system includes an image capturing device and a processor. The image capturing device is for capturing a target protocol of a subject, and the target protocol includes a plurality of target knee joint image sequences. The processor is signally connected to the image capturing device and includes a data preprocessing module and a meniscus tear assisted determination program. The data preprocessing module is for grouping the plurality of target knee joint image sequences and extracting a plurality of target coronal plane image sequences and a plurality of target sagittal plane image sequences. The meniscus tear assisted determination program includes a meniscus location detector and a meniscus tear predictor.

Abstract: A semiconductor device and method of manufacturing the same are provided. The semiconductor device includes a substrate and a first gate electrode disposed on the substrate and located in a first region of the semiconductor device. The semiconductor device also includes a first sidewall structure covering the first gate electrode. The semiconductor device further includes a protective layer disposed between the first gate electrode and the first sidewall structure. In addition, the semiconductor device includes a second gate electrode disposed on the substrate and located in a second region of the semiconductor device. The semiconductor device also includes a second sidewall structure covering a lateral surface of the second gate electrode.

Abstract: An embodiment composite material for semiconductor package mount applications may include a first component including a tin-silver-copper alloy and a second component including a tin-bismuth alloy or a tin-indium alloy. The composite material may form a reflowed bonding material having a room temperature tensile strength in a range from 80 MPa to 100 MPa when subjected to a reflow process. The reflowed bonding material may include a weight fraction of bismuth that is in a range from approximately 4% to approximately 15%. The reflowed bonding material may an alloy that is solid solution strengthened by a presence of bismuth or indium that is dissolved within the reflowed bonding material or a solid solution phase that includes a minor component of bismuth dissolved within a major component of tin. In some embodiments, the reflowed bonding material may include intermetallic compounds formed as precipitates such as Ag3Sn and/or Cu6Sn5.

Abstract: A quantum dot oil-based ink is provided. The quantum dot oil-based ink includes a quantum dot material, a dispersing solvent, a viscosity modifier, and a surface tension modifying solution. The dispersing solvent includes a linear alkane having 6 to 14 carbon atoms. The viscosity modifier includes an aromatic hydrocarbon having 10 to 18 carbon atoms or a linear olefin having 16 to 20 carbon atoms. The surface tension modifying solution includes a hydrophobic polymer material and a nonpolar solvent.

Abstract: A method for evaluating a risk of a subject getting a specific disease includes steps of: storing a reference database that contains original parameter sets; selecting target alleles from an SNP profile derived from genome sequencing data of a subject; selecting target parameter sets from among the original parameter sets; calculating, for each of the target parameter sets, a race factor based on a global risk allele frequency and a group-specific risk allele frequency included in the target parameter set; calculating a genetic factor based on statistics, global reference allele frequencies, the race factors for the target parameter sets, and numbers of chromosomes in homologous chromosome pairs included in the target parameter sets; calculating a citation factor based on numbers of citation times included in the target parameter sets; and calculating a risk score based on the genetic factor and the citation factor.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: A method includes depositing solder paste over first contact pads of a first package component. Spring connectors of a second package component are aligned to the solder paste. The solder paste is reflowed to electrically and physically couple the spring connectors of the second package component to the first contact pads of the first package component. A device includes a first package component and a second package component electrically and physically coupled to the first package component by way of a plurality of spring coils. Each of the plurality of spring coils extends from the first package component to the second package component.

Abstract: A portable laser engraving/cutting apparatus includes a casing, a working laser source, a lens unit, a first axis galvanometric unit and a second axis galvanometric unit. The working laser source, the lens unit, the first axis galvanometric unit and the second axis galvanometric unit all are installed within the casing to implement the portable laser engraving cutting apparatus with a small volume.

Abstract: The invention discloses a portable laser engraving/cutting apparatus including a casing, a working laser source, a lens unit, a first axis galvanometric unit and a second axis galvanometric unit. The working laser source, the lens unit, the first axis galvanometric unit and the second axis galvanometric unit all are installed within the casing to implement the portable laser engraving cutting apparatus with a small volume.

Abstract: A press-key structure is disclosed, which comprises: a keycap; a scissors-type supporting part; a substrate; and an elastic part. In an exemplary embodiment, the scissors-type supporting part is configured with a first and a second pivot axes; the press-key structure further comprises a first clasp part formed with a guiding ramp, a second clasp part formed as an inversed L-shaped structure, and at least a guiding block formed with a ramp, all being disposed on the substrate in a manner that the ramp of the at least one guiding block is configured to lean toward the second clasp part, while connecting the first and the second pivot axes respectively to the first clasp part and the second clasp part for enabling the keycap to move up and down relative to the substrate.

Abstract: A press key structure is disclosed, which comprises: a keycap, configured with a bottom surface; a substrate; a first movable panel; and a second movable panel; wherein the substrate is arranged at a position underneath the keycap while disposing the first and the second movable panels in a space sandwiched between the substrate and the keycap and pivotally coupling the two by the use of a flange and a groove formed respectively on the two neighboring edges of the first and the second movable panels in a manner that the flange is slidably inset into the groove; and the each of the first and the second movable panels is coupled to the substrate by the center thereof while enabling the two edges of the first and the second movable panels that are away from each other to pivotally coupled to the bottom surface of the keycap.

Abstract: A press key structure is disclosed, which comprises: a keycap, configured with a bottom surface; a substrate; a first movable panel; and a second movable panel; wherein the substrate is arranged at a position underneath the keycap while disposing the first and the second movable panels in a space sandwiched between the substrate and the keycap and pivotally coupling the two by the use of a flange and a groove formed respectively on the two neighboring edges of the first and the second movable panels in a manner that the flange is slidably inset into the groove; and the each of the first and the second movable panels is coupled to the substrate by the center thereof while enabling the two edges of the first and the second movable panels that are away from each other to pivotally coupled to the bottom surface of the keycap.

Abstract: A keyboard structure includes a base, a circuit board, at least two keycaps and at least two linkages. The circuit board is disposed on the base. The two keycaps are adjacent to each other and disposed on the circuit board. Each keycap has a soft and a hard film. The soft film covers the hard film, the soft film has a pressing part penetrating the hard film, and the two soft films of the two keycaps are connected to each other. The two linkages are respectively disposed between the two keycaps and the base. Each of the linkages has two bars connected to each other, and each of the bars has one end connected to the base and the other connected to the hard film. The two keycaps can move up and down via the two linkages and press the two pressing parts to trigger the circuit board.