Abstract: A semiconductor structure includes a die embedded in a molding material, the die having die connectors on a first side; a first redistribution structure at the first side of the die, the first redistribution structure being electrically coupled to the die through the die connectors; a second redistribution structure at a second side of the die opposing the first side; and a thermally conductive material in the second redistribution structure, the die being interposed between the thermally conductive material and the first redistribution structure, the thermally conductive material extending through the second redistribution structure, and the thermally conductive material being electrically isolated.

Abstract: An embodiment composite material for semiconductor package mount applications may include a first component including a tin-silver-copper alloy and a second component including a tin-bismuth alloy or a tin-indium alloy. The composite material may form a reflowed bonding material having a room temperature tensile strength in a range from 80 MPa to 100 MPa when subjected to a reflow process. The reflowed bonding material may include a weight fraction of bismuth that is in a range from approximately 4% to approximately 15%. The reflowed bonding material may an alloy that is solid solution strengthened by a presence of bismuth or indium that is dissolved within the reflowed bonding material or a solid solution phase that includes a minor component of bismuth dissolved within a major component of tin. In some embodiments, the reflowed bonding material may include intermetallic compounds formed as precipitates such as Ag3Sn and/or Cu6Sn5.

Abstract: A method includes depositing solder paste over first contact pads of a first package component. Spring connectors of a second package component are aligned to the solder paste. The solder paste is reflowed to electrically and physically couple the spring connectors of the second package component to the first contact pads of the first package component. A device includes a first package component and a second package component electrically and physically coupled to the first package component by way of a plurality of spring coils. Each of the plurality of spring coils extends from the first package component to the second package component.

Abstract: The present invention discloses a cone material in endodontic treatment. The cone material comprises a thermoplastic polyurethane and a filler. The thermoplastic polyurethane is formed by a. isophorone diisocyanate (IPDI) or hexamethylene diisocyanate (HDI), b. poly(butyleneadipate) glycol (PBA) and c. chain extender, wherein the molar ratio of PBA and the diisocyanate is equal to or more than 0.8. By changing the molar composition of the components such as polyol and diisocyanate, physical and chemical property of the disclosed cone material in endodontic treatment can be adjusted.

Abstract: The present invention discloses a cone material in endodontic treatment. The cone material comprises a thermoplastic polyurethane and a filler. The thermoplastic polyurethane is formed by a. isophorone diisocyanate (IPDI) or hexamethylene diisocyanate (HDI), b. poly(butyleneadipate) glycol (PBA) and c. chain extender, wherein the molar ratio of PBA and the diisocyanate is equal to or more than 0.8. By changing the molar composition of the components such as polyol and diisocyanate, physical and chemical property of the disclosed cone material in endodontic treatment can be adjusted.