Abstract: The present invention discloses a data processing device and a motherboard thereof. The feature of the present invention is separating the motherboard thereof into two daughter boards. The first daughter board is fixed to the data processing device, and the second daughter board is connected to the first daughter board through a connector. The units that frequently be changed, such as a data processing component and data storing component, are disposed on the second daughter board. Besides, a hard disk signal bus of the data processing device, an optical disk drive signal bus, or a screen signal bus may be electrically connected to the first daughter board. As a result, when the data processing device is under maintenance or upgrade, the second daughter board can be removed without removing the casing, and also the plug-in and plug-out frequency of the connectors can be lower.

Abstract: An electronic device comprises a base, a system module, and at least one axle pivot structure. The axle pivot structure connects the base and the system module, and the axle pivot structure comprises an axle shaft, a first pivotal connection portion, and a second pivotal connection portion. The axle shaft comprises a first end portion and a second end portion. The first pivotal connection portion is pivotally disposed to the first end portion of the axle shaft and the center of the lateral side of the base. The second pivotal connection portion is pivotally disposed on the second end portion of the axle shaft and one lateral side of the system module. Besides, the axle shaft is rotated with respect to the base, and the system module is rotated with respect to the axle shaft, so the different disposed location and disposed angle of the system module can be formed.

Abstract: The present invention discloses a data processing device and a motherboard thereof. The feature of the present invention is separating the motherboard thereof into two daughter boards. The first daughter board is fixed to the data processing device, and the second daughter board is connected to the first daughter board through a connector. The units that frequently be changed, such as a data processing component and data storing component, are disposed on the second daughter board. Besides, a hard disk signal bus of the data processing device, an optical disk drive signal bus, or a screen signal bus may be electrically connected to the first daughter board. As a result, when the data processing device is under maintenance or upgrade, the second daughter board can be removed without removing the casing, and also the plug-in and plug-out frequency of the connectors can be lower.

Abstract: The present invention discloses a notebook computer and a motherboard module thereof. The notebook computer comprises a base module, a motherboard module, and a screen module. The base module comprises a base and a base casing. Besides, the screen module is pivotally connected to the base casing and is electrically connected to the base. Furthermore, the motherboard module comprises a motherboard and a motherboard cover, and the motherboard cover is integrated with the motherboard and disposed to cover one side of the motherboard. When the motherboard electrically connects to the base, the base casing is seamlessly connecting to the motherboard cover so as to establish an integral whole appearance. As a result, the difficulty of the removal can be surmounted, and the plug-in and unplugging frequency of the connectors of the notebook computer during the removal process can be lower.

Abstract: An electronic device comprises a base, a system module, and at least one axle pivot structure. The axle pivot structure connects the base and the system module, and the axle pivot structure comprises an axle shaft, a first pivotal connection portion, and a second pivotal connection portion. The axle shaft comprises a first end portion and a second end portion. The first pivotal connection portion is pivotally disposed to the first end portion of the axle shaft and the center of the lateral side of the base. The second pivotal connection portion is pivotally disposed on the second end portion of the axle shaft and one lateral side of the system module. Besides, the axle shaft is rotated with respect to the base, and the system module is rotated with respect to the axle shaft, so the different disposed location and disposed angle of the system module can be formed.

Abstract: A portable apparatus having an electronic control system and a control method thereof are provided. The portable apparatus comprises an operation system, an accessing device and a basic input/output system (BIOS), and the electronic control system comprises a G-sensor and an embedded controller (EC) for initializing the G-sensor, wherein the G-sensor senses the acceleration of the portable apparatus and compares the acceleration value with the threshold value. The operation system comprises an application program (AP) and an advanced configuration and power interface (ACPI). When the acceleration value is higher than the threshold value, the G-sensor sends out a first signal to the EC, and the EC sends out a second signal to the BIOS, and the BIOS sends out a third signal to the ACPI, and the ACPI sends out a fourth signal to the AP to give a park command for parking the reading head of the accessing apparatus.

Abstract: A method for fabricating an Al—Si—containing alloy line, which is adapted to form a conductive line on a substrate, is described. A first conductive layer, a second conductive layer and an Al—Si—containing alloy layer are sequentially formed on the substrate. Then, the substrate temperature is rapidly lowered to between about 0° C. and 25° C. in about 1 second to 10 seconds. A patterned photo-resist layer is formed on the third conductive layer. The patterned photo-resist layer is used as a mask, and the third conductive layer, the Al—Si—containing alloy layer, the second conductive layer and the first conductive layer are etched to form the conductive line.

Abstract: A method for contact profile improvement is described. The contact window is formed over a substrate having at least one element. A first oxide layer is formed on the substrate. A borophosphosilicate glass layer is formed on the first oxide layer and the borophosphosilicate glass layer is treated by a planarization process. The contact window is formed in the first oxide layer and the borophosphosilicate glass layer. The element on the substrate is exposed therein. A second oxide layer is formed on the borophosphosilicate glass layer, the sidewall and the bottom of the contact window, with overhangs formed at an opening of the contact window. A spacer on the sidewall of the contact window is formed by etching the second oxide layer to further expose the surface of the borophosphosilicate glass layer. Finally, a native oxide on the bottom of the contact window is removed by a wet etching process and the etching selectivity between the native oxide and the spacer is smaller than 1.

Abstract: A method for contact profile improvement is described. The contact window is formed over a substrate having at least one element. A first oxide layer is formed on the substrate. A borophosphosilicate glass layer is formed on the first oxide layer and the borophosphosilicate glass layer is treated by a planarization process. The contact window is formed in the first oxide layer and the borophosphosilicate glass layer. The element on the substrate is exposed therein. A second oxide layer is formed on the borophosphosilicate glass layer, the sidewall and the bottom of the contact window, with overhangs formed at an opening of the contact window. A spacer on the sidewall of the contact window is formed by etching the second oxide layer to further expose the surface of the borophosphosilicate glass layer. Finally, a native oxide on the bottom of the contact window is removed by a wet etching process and the etching selectivity between the native oxide and the spacer is smaller than 1.

Abstract: A method for fabricating Al—Si contained alloy line, which is adapted to form a conductive line on a substrate, is described. A first conductive layer, a second conductive layer and an Al—Si contained alloy layer are sequentially formed on the substrate. Then, the substrate temperature is rapidly lowered to between about 0° C. and 25° C. in about 1 second to 10 seconds. A patterned photo-resister layer is formed on the third conductive layer. The patterned photo-resister layer is used as a mask, and the third conductive layer, the Al—Si contained alloy layer, the second conductive layer and the first conductive layer are etched to form the conductive line.

Abstract: A method of cleaning and disinfecting contact lenses, including the steps of a) transmitting a ultrasonic energy field toward a pair of contact lenses being suspended in a solution medium in a cleaning cup, causing a cavitation to be produced to remove dirt from the contact lenses; b) keeping the solution medium to be maintained standing still in for about 3-5 minutes for permitting suspended substance to settle to the bottom of the solution medium; c) using heating means to heat the solution medium to about 90° C. for about 15-20 minutes so as to disinfect bacteria and degrade toxic substance carried on the contact lenses; and d) gradually cooling down the temperature of the solution medium to room temperature.