Abstract: A package structure includes a wiring structure, a first electronic device and a reinforcement structure. The first electronic device is disposed over the top surface of the wiring structure, and has a bottom surface facing the top surface of the wiring structure. The first electronic device includes a plurality of first wires. The reinforcement structure is disposed over the top surface of the wiring structure, and includes a plurality of second wires directly contacting the plurality of first wires to reduce a variation of an elevation of the bottom surface of the first electronic device with respect to the top surface of the wiring structure.

Abstract: A tool includes a nut and a bearing module. The nut is engageable with a screw connected to a spacer to allow a hammer to hit the nut to remove the screw from the spacer. The bearing middle is located between the nut and the spacer to allow smooth rotation of the nut relative to the screw to extend the screw through the spacer, thereby connecting the screw to the spacer.

Abstract: A tool is devised to peel a weight from a rim of a wheel. The peeling tool includes a handle and a string supported on the handle. The string is loaded with an adequate tension so that the handle is maneuverable to use the string to peel the weight from the rim.

Abstract: A semiconductor device includes a plurality of channel layers vertically separated from one another. The semiconductor device also includes an active gate structure comprising a lower portion and an upper portion. The lower portion wraps around each of the plurality of channel layers. The semiconductor device further includes a gate spacer extending along a sidewall of the upper portion of the active gate structure. The gate spacer has a bottom surface. Moreover, a dummy gate dielectric layer is disposed between the gate spacer and a topmost channel layer of plurality of channel layers. The dummy gate dielectric layer is in contact with a top surface of the topmost channel layer, the bottom surface of the gate spacer, and the sidewall of the gate structure.

Abstract: A drug conjugate includes a structure shown by the following formula: Z-(linker-[R]m)n. In the formula, Z is a drug compound, R is a sugar, and m and n are independently an integer from 1 to 6. The drug compound Z is a hepatitis virus targeting drug, a hepatitis B virus (HBV) drug, an inhibitor of apoptosis protein (IAP) antagonist, a multidrug resistance (MDR) inhibitor, or analogues, precursors, prodrugs, derivatives thereof.

Abstract: A semiconductor fabrication method includes: forming an epitaxial stack including at least one sacrificial epitaxial layer and at least one channel epitaxial layer; forming a plurality of fins in the epitaxial stack; performing tuning operations to prevent a width of the sacrificial epitaxial layer expanding beyond a width of the channel epitaxial layer during operations to form isolation features; forming the isolation features between the plurality of fins, wherein the width of the sacrificial epitaxial layer does not expand beyond the width of the channel epitaxial layer; forming a sacrificial gate stack; forming gate sidewall spacers on sidewalls of the sacrificial gate stack; forming inner spacers around the sacrificial epitaxial layer and the channel epitaxial layer; forming source/drain features; removing the sacrificial gate stack and sacrificial epitaxial layer; and forming a replacement metal gate, wherein the metal gate is shielded from the source/drain features.

Abstract: An inspection system with a thermal interface, and an electronic component inspection device and method are provided. First, a temperature regulator contacts an electronic component to be tested, where there is a thermal interface between the temperature regulator and the electronic component to be tested, and the electronic component to be tested includes a plurality of temperature sensing units. Then, the temperature regulator heats or cools the electronic component to be tested to a specific temperature, and the plurality of temperature sensing units of the electronic component to be tested detect temperatures at locations of the temperature sensing units. In this way, a contact condition between the temperature regulator and the electronic component to be tested, and quality or an aging status of the thermal interface can be determined.

Abstract: A low thermal shrinkage separator and a method for manufacturing thereof is disclosed. The method comprises providing a porous polyolefin substrate with a plurality of porous structures on surfaces and interiors thereof, and applying a prescursor solution comprising a titanium alkoxide and hexamethyldisilazane and subsequently applying an alcohol solution to form a low thermal shrinkage thin film formed on the surfaces and the sidewalls of the porous structures of the porous polyolefin substrate. The present method can enhance the low thermal shrinkage and electrolyte wettability of the separator.

Abstract: Some embodiments relate to a semiconductor structure including a dielectric layer over a substrate. A conductive body is disposed within the dielectric layer. The conductive body has a bottom surface continuously extending between opposing sidewalls. A first liner layer is disposed between the conductive body and the dielectric layer. The first liner layer extends along the opposing sidewalls of the conductive body. The first liner layer is laterally offset from a central region of the bottom surface of the conductive body by a non-zero distance.

Abstract: A method according to the present disclosure includes receiving a workpiece that includes a first source/drain feature, a first dielectric layer over the first source/drain feature, and a source/drain contact disposed in the first dielectric layer and over the first source/drain feature. The method further includes depositing a second dielectric layer over the source/drain contact and the first dielectric layer, forming a source/drain contact via opening through the second dielectric layer to expose the source/drain contact, depositing a sacrificial plug in the source/drain contact via opening, depositing a third dielectric layer over the second dielectric layer and the sacrificial plug, forming a trench in the third dielectric layer to expose the sacrificial plug, removing the sacrificial plug to expose the source/drain contact via opening, and after the removing of the sacrificial plug, forming an integrated conductive feature into the trench and the exposed source/drain contact via opening.

Abstract: A health care device illustrated has a low-frequency wave emitter, a low-frequency waveguide and a plant essential oil carrier disposed between the low-frequency wave emitter and the low-frequency waveguide. The low-frequency wave emitter emits a low-frequency wave with a predetermined frequency, and the low-frequency wave firstly passes through the plant essential oil carrier, and then propagates to the low-frequency waveguide. Next, energy of the low-frequency wave is focused in the low-frequency waveguide, and then the low-frequency wave is emitted out from the low-frequency waveguide. A health care method illustrated emits the low-frequency wave with the predetermined frequency to a belly button of a user by using the health care device. The health care device and method increase contents of NAD+ in blood of the user, and achieve effects of convenient operation, accurate use position identification, and non-invasive and non-contact health care.

Abstract: This application is directed to a display assistant device that acts as a voice-activated user interface device. The display assistant device includes a base, a screen and a speaker. The base is configured for sitting on a surface. The screen has a rear surface and is supported by the base at the rear surface. A bottom edge of the screen is configured to be held above the surface by a predefined height, and the base is substantially hidden behind the screen from a front view of the display assistant device. The speaker is concealed inside the base and configured to project sound substantially towards the front view of the display assistant device.

Abstract: In a display assistant device, a speaker is mounted in a waveguide structure which is at least partially disposed beneath a display screen. The waveguide structure is mounted in an exterior housing which includes speaker grills distributed on a plurality of surfaces of the exterior housing, permitting sound waves from the speaker to be projected outside the exterior housing. A cover structure is disposed on top of the waveguide structure to conceal the waveguide structure and speaker within the exterior housing. The cover structure has a tilted bottom surface configured to be suspended above the waveguide structure and to be separated by a first space. Sound waves projected from an upper portion of the speaker are reflected by the tilted bottom surface and are guided through the first space to exit the device from a speaker grill portion located on a rear side of the exterior housing.

Abstract: An antenna structure includes a metal mechanism element, a ground element, a feeding radiation element, a first radiation element, a second radiation element, a parasitic radiation element, a tuning circuit, and a nonconductive support element. The metal mechanism element has a slot. The metal mechanism element includes a first grounding portion and a second grounding portion. The slot is positioned between the first grounding portion and the second grounding portion. The feeding radiation element has a feeding point. The first radiation element is coupled to the feeding radiation element. The second radiation element is coupled to the feeding radiation element. The parasitic radiation element is coupled to the ground element. The parasitic radiation element is adjacent to the first radiation element and the second radiation element. The tuning circuit is coupled between the first grounding portion and the second grounding portion of the metal mechanism element.

Abstract: In a display assistant device, a speaker is mounted in a waveguide structure which is at least partially disposed beneath a display screen. The waveguide structure is mounted in an exterior housing which includes speaker grills distributed on a plurality of surfaces of the exterior housing, permitting sound waves from the speaker to be projected outside the exterior housing. A cover structure is disposed on top of the waveguide structure to conceal the waveguide structure and speaker within the exterior housing. The cover structure has a tilted bottom surface configured to be suspended above the waveguide structure and to be separated by a first space. Sound waves projected from an upper portion of the speaker are reflected by the tilted bottom surface and are guided through the first space to exit the device from a speaker grill portion located on a rear side of the exterior housing.

Abstract: A health care device and a health care method are illustrated, the health care method is used to arrange the health care device at a predetermined location in front of a belly button of a user with a predetermined distance, and to emit the low-frequency wave with a predetermined frequency to the belly button by using a low-frequency wave emitter. The health care device is formed by the low-frequency wave emitter and a cone/pyramid part. The predetermined frequency is 1.27 Hz to 1.81 Hz, and the predetermined distance is 5 cm to 8 cm. The above health care device and method can increase contents of active T cells and B cells in blood and increase an ability of NK cell strains for poisoning cancer cell strains (K562). In short, the above health care device and method have health benefits without a risk of excessive energy causing harm.

Abstract: A slide rail assembly adapted to dispose to a first casing is provided. The slide rail assembly includes an outer slide rail, an inner slide rail, and first and second engaging components. The outer slide rail includes a first hook. The inner slide rail is slidably disposed to the outer slide rail and includes first and second ends and positioning slots. First fixing portions of the first casing is engaged with several of the positioning slots. The first engaging component is partially overlapped with a critical positioning slot of the positioning slots and includes a second hook. The second engaging component includes a third hook. When the first casing is set on the inner slide rail, the second hook leaves an engaging path with the first hook, and the first casing and the inner slide rail slide to a position where the third hook is engaged with the first hook.

Abstract: A method for treating pleural effusion includes: administering a Chinese medicine composition to a subject in need thereof; wherein, the Chinese medicine composition is an extract of a first mixture comprising Poria, Polyporus, Rhizoma Alismatis, Atractylodis Rhizoma, Pimenta Officinalis, Zingiberis Rhizoma, Aconiti Lateralis Radix Praeparata, Phellodendron Amurense, Angelica Sinensis, Astragalus Membranaceus, Stephaniae Tetrandrae Radix, Descurainiea Semen, Ephedra Sinica, Armeniacae Semen Amarum, Ginseng Radix et Rhizoma, Anredera Cordifolia and Velvet Antler.

Abstract: The present invention relates to a method for treating a coronavirus infectious disease and a complication thereof, including: administering a Chinese medicine composition to a subject in need thereof; wherein, the Chinese medicine composition is an extract of a first mixture including Ephedra sinica, Armeniacae Semen amarum, Glycyrrhizae radix et rhizoma, Gypsum fibrosum, Descurainiea semen, stephaniae Tetrandrae radix, Scutellariae radix, Poria, rhizoma alismatis, Polyporus umbellatus, Atractylodis rhizoma, Asteris radix et rhizoma, Tussilago farfara, Pinelliae rhizoma, and Rhei radix et rhizoma.

Abstract: A method includes implanting impurities in a semiconductor substrate to form an etch stop region within the semiconductor substrate; forming a transistor structure on a front side of the semiconductor substrate; forming a front-side interconnect structure over the transistor structure; performing a thinning process on a back side of the semiconductor substrate to reduce a thickness of the semiconductor substrate, wherein the thinning process is slowed by the etch stop region; and forming a back-side interconnect structure over the back side of the semiconductor substrate.