Abstract: Pattern discovery in sequential data mining is valuable for many applications, such as genomic signature (biomarker) identification, trend analysis, sequential logs analysis, user action (behavior) analysis and production line analysis. An approach can extract maximal repeat patterns from tagged sequences based on MapReduce programming model, and meanwhile compute the frequency distribution of these patterns according to the tags. Most of all, the components of sequences may be characters, words or records while the types of tags may be timestamps or classes given by users.

Abstract: Pattern discovery in sequential data mining is valuable for many applications, such as genomic signature (biomarker) identification, trend analysis, sequential logs analysis, user action (behavior) analysis and production line analysis. An approach can extract maximal repeat patterns from tagged sequences based on MapReduce programming model, and meanwhile compute the frequency distribution of these patterns according to the tags. Most of all, the components of sequences may be characters, words or records while the types of tags may be timestamps or classes given by users.

Abstract: A finished product structure formed by In-mold decoration process includes an electromagnetic protective material, a bearing layer and a formed plastic material. The electromagnetic protective material includes a metal film, a structure reinforced layer and an electromagnetic isolation layer. The structure reinforced layer is located between the metal film and electromagnetic isolation layer to enhance physical strength of the electromagnetic protective material. The bearing layer includes an adhesive surface laid with an adhesive layer and a bearing surface. The adhesive surface faces the electromagnetic protective material. The electromagnetic protective material and bearing layer are disposed in a mold, and plastic material is injected onto the bearing surface through a plastic material runner to form the formed plastic material. The formed plastic material includes a first surface bonded to the bearing surface and a second surface on another side opposite to the first surface.

Abstract: A heat dissipation structure mounted onto an electronic element to dissipate heat. The heat dissipation structure includes a heat absorber connected with the electronic element and a heat sink. The heat absorber has a hollow first chamber to hold a working fluid. The heat absorber and heat sink are interposed by a plurality of first conduits. When the heat absorber absorbs heat generated by the electronic element through a contact surface, the working fluid held therein is vaporized into vapor. The vapor enters a second chamber of the heat sink through the first conduits and performs heat exchange with a cooling surface of the heat sink to be converted into the working fluid again. The working fluid is conveyed via a capillary structure in the second conduit to the first chamber to form a thermal cycle. The structure of the invention is simpler and can rapidly absorb and dissipate heat.

Abstract: A method for fabricating a composite material for in-mold decoration is to fabricate a composite material comprising a biomaterial layer and a protective layer adhering to the biomaterial layer. The method comprises the steps of: providing the biomaterial layer which is transferred in a predetermined transport path; hot-extruding the fused protective layer, wherein the hot-extruded protective layer is combined with the biomaterial layer in the transport path; and solidify and adhering the hot-extruded protective layer to the biomaterial layer to form the composite material. According to the method of the present invention, the composite material is formed via combining the protective layer with the biomaterial layer in a fused state, and via solidify and adhering the hot-extruded protective layer to the biomaterial layer, so as to reduce the bubbles between the protective layer and the biomaterial layer.

Abstract: An industrial product structure combined with organic material is formed in an injection mold which has a mold cavity and at least one injection port to allow an injection material to be injected into the mold cavity. The industrial product formed in the mold includes an organic material layer on the surface, a bottom layer having at least one orifice and an injection material layer located between the organic material layer and bottom layer. The organic material layer and bottom layer are placed in advance in the mold cavity with the orifice of the bottom layer positioned above the injection port of the mold cavity. The injection material is injected through the injection port and orifice to form the injection material layer. The injection material layer has two sides bonded to the organic material layer and bottom layer.

Abstract: A method of manufacturing an in-mold forming film with a metal surface provides a metal sheet layer having a coupling surface predetermining at least one etching area, and then applies an etching measure to the etching area at the coupling surface, such that recessed structures are formed inwardly on a surface of the etching area, and then injects a plastic material to the coupling surface of the metal sheet layer by an injection pressure after the metal sheet layer is etched, such that the plastic material is forced to cover the recessed structures in the etching area, and finally cures the plastic material to carry the metal sheet layer and form a tight connection relation between the cured plastic material and the recessed structures.

Abstract: A finished product structure formed by In-mold decoration process includes an electromagnetic protective material, a bearing layer and a formed plastic material. The electromagnetic protective material includes a metal film, a structure reinforced layer and an electromagnetic isolation layer. The structure reinforced layer is located between the metal film and electromagnetic isolation layer to enhance physical strength of the electromagnetic protective material. The bearing layer includes an adhesive surface laid with an adhesive layer and a bearing surface. The adhesive surface faces the electromagnetic protective material. The electromagnetic protective material and bearing layer are disposed in a mold, and plastic material is injected onto the bearing surface through a plastic material runner to form the formed plastic material. The formed plastic material includes a first surface bonded to the bearing surface and a second surface on another side opposite to the first surface.

Abstract: A multi-layer structure including a buffer layer is to couple with a substrate in a die. The multi-layer structure includes a biological material layer, a bonding layer and a thermoplastic buffer layer. The biological material layer has a first surface attached to the bonding layer. The buffer layer has one side boned with the bonding layer. The buffer layer has a compressed surface to withstand high pressure and be bonded to the substrate. The bonding layer and buffer layer are made of thermoplastic material, and are bonded together firmly through thermal fusion. The compressed surface of the buffer layer directly withstands the injection temperature and pressure exerting to the substrate in the mold, therefore can alleviate the temperature and pressure withstood by the biological material layer. Hence the biological material layer is protected without being damaged in the mold, and bonding between the multi-layer structure and substrate has longer lifespan.