Patents by Inventor Ching-Wei Chiu

Ching-Wei Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190190607
    Abstract: The invention provides a small form factor pluggable transceiver module comprising a housing, a transmission line and at least one connector, wherein the frond surface of the housing has a connecting hole, and the housing is dimensioned according to a SFPSFP+XFPXenpakQSFPQSFP+CFP or CPAK. One end of the transmission line is disposed in the connecting hole on the front surface of the housing, and the other end of the transmission line is connected to a connector, so that the small form factor pluggable transceiver module can be disposed a larger number of connectors.
    Type: Application
    Filed: December 14, 2018
    Publication date: June 20, 2019
    Inventors: Hui-Tsuo Chou, Ching-Wei Chiu, Pei-Hsiang Hsu
  • Patent number: 10320482
    Abstract: The invention provides a connector module and optical signal processing device connected thereto. The optical signal processing device and the connector module are connected together via at least one fiber cable, they are allowed to transmit at least one optical signal therebetween. The connector module comprises a circuit board, a high frequency connector, and at least one photoelectric transducer. The high frequency connector and the photoelectric transducer are configured on the circuit board in a way of COB. Accordingly, the high frequency connector and the photoelectric transducer are implemented on the circuit board in the way of COB, which can effectively reduce the volume and the manufacture cost of the connector module. Besides, the connector module is capable of transmitting signals in the way of optical communication so as to improve the data transfer rate and transmission distance of the connector module.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: June 11, 2019
    Assignee: Optomedia Technology Inc.
    Inventors: Hui-Tsuo Chou, Ching-Wei Chiu, Pei-Hsiang Hsu
  • Publication number: 20180278329
    Abstract: The invention provides a connector module and optical signal processing device connected thereto. The optical signal processing device and the connector module are connected together via at least one fiber cable, they are allowed to transmit at least one optical signal therebetween. The connector module comprises a circuit board, a high frequency connector, and at least one photoelectric transducer. The high frequency connector and the photoelectric transducer are configured on the circuit board in a way of COB. Accordingly, the high frequency connector and the photoelectric transducer are implemented on the circuit board in the way of COB, which can effectively reduce the volume and the manufacture cost of the connector module. Besides, the connector module is capable of transmitting signals in the way of optical communication so as to improve the data transfer rate and transmission distance of the connector module.
    Type: Application
    Filed: March 13, 2018
    Publication date: September 27, 2018
    Inventors: HUI-TSUO CHOU, CHING-WEI CHIU, PEI-HSIANG HSU
  • Publication number: 20110272727
    Abstract: A light-emitting diode and method for manufacturing the same are described. The light-emitting diode comprises: a conductive substrate including a first surface and a second surface opposite to the first surface; a reflector structure comprising a conductive reflector layer bonding to the first surface of the conductive substrate and a conductive distributed Bragg reflector (DBR) structure stacked on the conductive reflector layer; an illuminant epitaxial structure disposed on the reflector structure; a first electrode disposed on a portion of the illuminant epitaxial structure; and a second electrode bonded to the second surface of the conductive substrate.
    Type: Application
    Filed: July 19, 2011
    Publication date: November 10, 2011
    Applicant: Epistar Corporation
    Inventors: Chih-Tsung Su, Chun-Lung Tseng, Ching-Wei Chiu, Tao-Chi Chang, Chan-Yang Lu, Jia-Ming Yu, Yi-Chang Yu, Yu-Chen Yang