Patents by Inventor Ching-Wei Hsu
Ching-Wei Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250071288Abstract: A method and apparatus for video coding are disclosed. According to the method for the decoder side, encoded data associated with a current block comprising a first-colour block and a second-colour block are received. An inherited model parameter set is determined from a previously coded block coded in a first CCLM related mode, wherein the inherited model parameter set comprises a first scaling parameter associated with the first CCLM related mode. A final inherited model parameter set is derived if an update value for the inherited model parameter set is determined, where the final inherited model parameter set is determined based on the first scaling parameter and the update value. Then, the encoded data associated with the second-colour block are decoded using prediction data based on an updated CCLM related model associated with the final inherited model parameter set. A method and apparatus for the encoder side are also disclosed.Type: ApplicationFiled: January 18, 2023Publication date: February 27, 2025Inventors: Chia-Ming TSAI, Chun-Chia CHEN, Chih-Wei HSU, Ching-Yeh CHEN, Tzu-Der CHUANG
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Publication number: 20250071260Abstract: A method and apparatus for video coding are disclosed. According to the method, a set of MC (Motion Compensation) candidates with each MC candidate comprising predicted samples for coding boundary pixels of the current block are determined. The set of MC candidates comprises a first candidate, and wherein the first candidate corresponds to a weighted sum of first predicted pixels generated according to first motion information of the current block and second predicted pixels generated according to second motion information of a neighbouring boundary block of the current block. Boundary matching costs associated with the set of MC candidates are determined respectively. A final candidate is determined from the set of MC candidates based on the boundary matching costs. The current block is encoded or decoded using the final candidate.Type: ApplicationFiled: January 10, 2023Publication date: February 27, 2025Inventors: Chun-Chia CHEN, Olena CHUBACH, Chih-Wei HSU, Tzu-Der CHUANG, Ching-Yeh CHEN, Yu-Wen HUANG
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Publication number: 20250071331Abstract: A method and apparatus for video coding are disclosed. According to the method for the decoder side, a first syntax, related to whether the current block is coded in a CCLM related mode, is parsed from a bitstream comprising the encoded data for the current block. If the first syntax indicates the current block being coded in the CCLM related mode, a second syntax is parsed from the bitstream, wherein the second syntax is related to whether a multiple model CCLM mode is used or whether one or more model parameters are explicitly signalled or implicitly derived. The model parameters for the second-colour block are determined if the first syntax indicates the current block being coded in a CCLM related mode. The encoded data associated with the second-colour block is then decoded using prediction data comprising the cross-colour predictor for the second-colour block.Type: ApplicationFiled: January 18, 2023Publication date: February 27, 2025Inventors: Chia-Ming TSAI, Chun-Chia CHEN, Chih-Wei HSU, Ching-Yeh CHEN, Tzu-Der CHUANG
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Publication number: 20250063155Abstract: A method and apparatus for inter prediction in video coding system are disclosed. According to the method, input data associated with a current block comprising at least one colour block are received. A blending predictor is determined according to a weighted sum of at least two candidate predictions generated based on one or more first hypotheses of prediction, one or more second hypotheses of prediction, or both. The first hypotheses of prediction are generated based on one or more intra prediction modes comprising a DC mode, a planar mode or at least one angular modes. The second hypotheses of prediction are generated based on one or more cross-component modes and a collocated block of said at least one colour block. The input data associated with the colour block is encoded or decoded using the blending predictor.Type: ApplicationFiled: December 20, 2022Publication date: February 20, 2025Inventors: Man-Shu CHIANG, Olena CHUBACH, Chia-Ming TSAI, Yu-Ling HSIAO, Chun-Chia CHEN, Chih-Wei HSU, Tzu-Der CHUANG, Ching-Yeh CHEN, Yu-Wen HUANG
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Patent number: 12232425Abstract: A magnetoresistive random access memory (MRAM) device includes a first array region and a second array region on a substrate, a first magnetic tunneling junction (MTJ) on the first array region, a first top electrode on the first MTJ, a second MTJ on the second array region, and a second top electrode on the second MTJ. Preferably, the first top electrode and the second top electrode include different nitrogen to titanium (N/Ti) ratios.Type: GrantFiled: November 21, 2023Date of Patent: February 18, 2025Assignee: UNITED MICROELECTRONICS CORP.Inventors: Hui-Lin Wang, Si-Han Tsai, Dong-Ming Wu, Chen-Yi Weng, Ching-Hua Hsu, Ju-Chun Fan, Yi-Yu Lin, Che-Wei Chang, Po-Kai Hsu, Jing-Yin Jhang
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Patent number: 12231685Abstract: A method for video encoding and decoding using Low-Frequency Non-Separable Transform (LFNST) mode and apparatus thereof are disclosed. The input data correspond to primary transformed data at the encoder and the input data correspond to coded data of the current CU at the decoder. A CU is partitioned into one or more transform blocks (TBs). An LFNST syntax is determined at an encoder side or at a decoder side if one or more conditions are satisfied. The LFNST syntax indicates whether the LFNST mode is applied to the current CU and/or which LFNST kernel is applied when the LFNST mode is applied. The conditions comprise the CBF indications for the target TBs being false. The current CU is encoded or decoded according to the LFNST mode as indicated by the LFNST syntax.Type: GrantFiled: February 24, 2021Date of Patent: February 18, 2025Assignee: HFI INNOVATION INC.Inventors: Man-Shu Chiang, Chih-Wei Hsu, Tzu-Der Chuang, Ching-Yeh Chen
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Publication number: 20250056008Abstract: A video coding system that uses multiple models to predict chroma samples is provided. The video coding system receives data for a block of pixels to be encoded or decoded as a current block of a current picture of a video. The system constructs two or more chroma prediction models based on luma and chroma samples neighboring the current block. The system applies the two or more chroma prediction models to incoming or reconstructed luma samples of the current block to produce two or more model predictions. The system computes predicted chroma samples by combining the two or more model predictions. The system uses the predicted chroma samples to reconstruct chroma samples of the current block or to encode the current block.Type: ApplicationFiled: December 20, 2022Publication date: February 13, 2025Inventors: Yu-Ling HSIAO, Olena CHUBACH, Chun-Chia CHEN, Chia-Ming TSAI, Man-Shu CHIANG, Chih-Wei HSU, Tzu-Der CHUANG, Ching-Yeh CHEN, Yu-Wen HUANG
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Publication number: 20250035718Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, in which the MTJ includes a pinned layer on the substrate, a reference layer on the pinned layer, a barrier layer on the reference layer, and a free layer on the barrier layer. Preferably, the free layer and the barrier layer have same width and the barrier layer and the reference layer have different widths.Type: ApplicationFiled: October 15, 2024Publication date: January 30, 2025Applicant: UNITED MICROELECTRONICS CORP.Inventors: Hui-Lin Wang, Chen -Yi Weng, Che-Wei Chang, Si-Han Tsai, Ching-Hua Hsu, Jing-Yin Jhang, Yu-Ping Wang
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Publication number: 20250039356Abstract: A video coding system that uses multiple models to predict chroma samples is provided. The video coding system receives data for a block of pixels to be encoded or decoded as a current block of a current picture of a video. The video coding system derives multiple prediction linear models based on luma and chroma samples neighboring the current block. The video coding system constructs a composite linear model based on the multiple prediction linear models. The video coding system applies the composite linear model to incoming or reconstructed luma samples of the current block to generate a chroma predictor of the current block. The video coding system uses the chroma predictor to reconstruct chroma samples of the current block or to encode the current block.Type: ApplicationFiled: December 29, 2022Publication date: January 30, 2025Inventors: Chia-Ming TSAI, Chun-Chia CHEN, Yu-Ling HSIAO, Man-Shu CHIANG, Chih-Wei HSU, Olena CHUBACH, Tzu-Der CHUANG, Ching-Yeh CHEN, Yu-Wen HUANG
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Patent number: 12204163Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.Type: GrantFiled: February 5, 2024Date of Patent: January 21, 2025Assignee: TDK TAIWAN CORP.Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
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Publication number: 20250024072Abstract: A method and apparatus for video coding system that uses intra prediction based on cross-colour linear model are disclosed. According to the method, model parameters for a first-colour predictor model are determined and the first-colour predictor model provides a predicted first-colour pixel value according to a combination of at least two corresponding reconstructed second-colour pixel values. According to another method, the first-colour predictor model provides a predicted first-colour pixel value based on a second degree model or higher of one or more corresponding reconstructed second-colour pixel values. First-colour predictors for the current first-colour block are determined according to the first-colour prediction model. The input data are then encoded at the encoder side or decoded at the decoder side using the first-colour predictors.Type: ApplicationFiled: October 26, 2022Publication date: January 16, 2025Inventors: Olena CHUBACH, Ching-Yeh CHEN, Tzu-Der CHUANG, Chun-Chia CHEN, Man-Shu CHIANG, Chia-Ming TSAI, Yu-Ling HSIAO, Chih-Wei HSU, Yu-Wen HUANG
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Publication number: 20160276215Abstract: A method for manufacturing a semiconductor device is provided. The method comprises steps as follows. At least one trench is provided in a low-k dielectric layer on a substrate. The trench is filled with a copper (Cu) film. Pure cobalt (Co) is deposited on a surface of the Cu film by introducing a flow of a carrier gas carrying a Co-containing precursor and a reducing agent onto the surface of the Cu film. The flowrate of the flow is within a range from 5 to 19 sccm.Type: ApplicationFiled: March 18, 2015Publication date: September 22, 2016Applicant: UNITED MICROELECTRONICS CORPORATIONInventors: PEI-TING LEE, GUO-WEI CHEN, CHUN-LING LIN, CHI-MAO HSU, CHING-WEI HSU, HUEI-RU TSAI, JIA-RONG LI, SHANG NAN CHOU, PO CHIH WU
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Patent number: 9412653Abstract: A through silicon via structure is located in a recess of a substrate. The through silicon via structure includes a barrier layer, a buffer layer and a conductive layer. The barrier layer covers a surface of the recess. The buffer layer covers the barrier layer. The conductive layer is located on the buffer layer and fills the recess, wherein the contact surface between the conductive layer and the buffer layer is smoother than the contact surface between the buffer layer and the barrier layer. Moreover, a through silicon via process forming said through silicon via structure is also provided.Type: GrantFiled: August 4, 2015Date of Patent: August 9, 2016Assignee: UNITED MICROELECTRONICS CORP.Inventors: Jia-Jia Chen, Chi-Mao Hsu, Tsun-Min Cheng, Chun-Ling Lin, Huei-Ru Tsai, Ching-Wei Hsu, Chin-Fu Lin, Hsin-Yu Chen
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Publication number: 20150340280Abstract: A through silicon via structure is located in a recess of a substrate. The through silicon via structure includes a barrier layer, a buffer layer and a conductive layer. The barrier layer covers a surface of the recess. The buffer layer covers the barrier layer. The conductive layer is located on the buffer layer and fills the recess, wherein the contact surface between the conductive layer and the buffer layer is smoother than the contact surface between the buffer layer and the barrier layer. Moreover, a through silicon via process forming said through silicon via structure is also provided.Type: ApplicationFiled: August 4, 2015Publication date: November 26, 2015Inventors: Jia-Jia Chen, Chi-Mao Hsu, Tsun-Min Cheng, Chun-Ling Lin, Huei-Ru Tsai, Ching-Wei Hsu, Chin-Fu Lin, Hsin-Yu Chen
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Patent number: 9136170Abstract: A through silicon via structure is located in a recess of a substrate. The through silicon via structure includes a barrier layer, a buffer layer and a conductive layer. The barrier layer covers a surface of the recess. The buffer layer covers the barrier layer. The conductive layer is located on the buffer layer and fills the recess, wherein the contact surface between the conductive layer and the buffer layer is smoother than the contact surface between the buffer layer and the barrier layer. Moreover, a through silicon via process forming said through silicon via structure is also provided.Type: GrantFiled: May 30, 2012Date of Patent: September 15, 2015Assignee: UNITED MICROELECTRONICS CORP.Inventors: Jia-Jia Chen, Chi-Mao Hsu, Tsun-Min Cheng, Chun-Ling Lin, Huei-Ru Tsai, Ching-Wei Hsu, Chin-Fu Lin, Hsin-Yu Chen
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Patent number: 9012324Abstract: A through silicon via process includes the following steps. A substrate having a front side and a back side is provided. A passivation layer is formed on the back side of the substrate. An oxide layer is formed on the passivation layer.Type: GrantFiled: August 24, 2012Date of Patent: April 21, 2015Assignee: United Microelectronics Corp.Inventors: Jia-Jia Chen, Chi-Mao Hsu, Tsun-Min Cheng, Ching-Wei Hsu, Szu-Hao Lai, Huei-Ru Tsai, Tsai-Yu Wen, Ching-Li Yang, Chien-Li Kuo
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Publication number: 20150093893Abstract: In a process of forming a seed layer, particularly in a vertical trench or via, a semiconductor substrate having a dielectric structure and a hard mask structure thereon is provided. An opening is formed in the hard mask structure, and a trench or via is formed in the dielectric structure in communication with the opening, wherein an area of the opening is greater than that of an entrance of the trench or via. A seed layer is then deposited in the trench or via through the opening, and then subjected to a reflow process.Type: ApplicationFiled: October 2, 2013Publication date: April 2, 2015Applicant: UNITED MICROELECTRONICS CORPORATIONInventors: Yi-Fang Tao, Ching-Wei Hsu, Hsin-Yu Chen, Tsun-Min Cheng, Yung-Chien Kung, Chi-Mao Hsu, Guo-Wei Chen, Huei-Ru Tsai, Jia-Rong Li
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Publication number: 20140057434Abstract: A through silicon via process includes the following steps. A substrate having a front side and a back side is provided. A passivation layer is formed on the back side of the substrate. An oxide layer is formed on the passivation layer.Type: ApplicationFiled: August 24, 2012Publication date: February 27, 2014Inventors: Jia-Jia Chen, Chi-Mao Hsu, Tsun-Min Cheng, Ching-Wei Hsu, Szu-Hao Lai, Huei-Ru Tsai, Tsai-Yu Wen, Ching-Li Yang, Chien-Li Kuo
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Publication number: 20130320537Abstract: A through silicon via structure is located in a recess of a substrate. The through silicon via structure includes a barrier layer, a buffer layer and a conductive layer. The barrier layer covers a surface of the recess. The buffer layer covers the barrier layer. The conductive layer is located on the buffer layer and fills the recess, wherein the contact surface between the conductive layer and the buffer layer is smoother than the contact surface between the buffer layer and the barrier layer. Moreover, a through silicon via process forming said through silicon via structure is also provided.Type: ApplicationFiled: May 30, 2012Publication date: December 5, 2013Inventors: Jia-Jia Chen, Chi-Mao Hsu, Tsun-Min Cheng, Chun-Ling Lin, Huei-Ru Tsai, Ching-Wei Hsu, Chin-Fu Lin, Hsin-Yu Chen
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Patent number: 8264831Abstract: A mounting apparatus includes a mounting bracket, a mounting piece adapted to mount a PCI card to the mounting bracket, and a securing member. The mounting bracket includes a base and a blocking plate. The mounting piece includes an elongated body and a mounting end. The securing member includes a first pivoting portion pivotably attached to the mounting bracket, a pressing portion, and a mounting portion. The mounting portion includes a securing portion. The securing portion includes a handling portion and a second engaging portion extending from the handling portion. The second engaging portion engages the first engaging portion. The handling portion is configured to drive the second engaging portion to disengage the first engaging portion by pressing the handling portion.Type: GrantFiled: March 24, 2010Date of Patent: September 11, 2012Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Chung-Cheng Hsieh, Li-Ping Chen, Ching-Wei Hsu