Patents by Inventor Ching-Wen Hung

Ching-Wen Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210109307
    Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
    Type: Application
    Filed: October 9, 2020
    Publication date: April 15, 2021
    Inventors: Chao-Chang HU, Chih-Wei WENG, Chia-Che WU, Chien-Yu KAO, Hsiao-Hsin HU, He-Ling CHANG, Chao-Hsi WANG, Chen-Hsien FAN, Che-Wei CHANG, Mao-Gen JIAN, Sung-Mao TSAI, Wei-Jhe SHEN, Yung-Ping YANG, Sin-Hong LIN, Tzu-Yu CHANG, Sin-Jhong SONG, Shang-Yu HSU, Meng-Ting LIN, Shih-Wei HUNG, Yu-Huai LIAO, Mao-Kuo HSU, Hsueh-Ju LU, Ching-Chieh HUANG, Chih-Wen CHIANG, Yu-Chiao LO, Ying-Jen WANG, Shu-Shan CHEN, Che-Hsiang CHIU
  • Publication number: 20210063339
    Abstract: A urine testing strip and a urine testing system are provided. The urine testing system includes the urine test strip and a detection device. The urine test strip includes a working electrode, a counter electrode, a reference electrode, a trigger circuit and a protection layer. The protection layer covers the working electrode, the counter electrode and the reference electrode, and portions of the working electrode, the counter electrode and the reference electrode are exposed through an opening of the protection layer. The detection device includes a test strip receiving module and a wireless transmission module. The test strip receiving module is used to receive the test strip and to provide electric power to the test strip for obtaining a detection result. The wireless transmission module is used to transmit the detection result to a mobile computer device.
    Type: Application
    Filed: August 25, 2020
    Publication date: March 4, 2021
    Inventors: Yu-Chia KUO, Ching-Yuan CHEN, Po-Ming YANG, Shun-Wei SHIH, Cho-Wen HUANG, Jen-Chieh CHIEN, Wei-San CHANG, Mu-Yi HUA, Ching-Fu CHEN, Yu-Cheng CHEN, Wan-Tun HUNG, Chin-Lien HUANG
  • Publication number: 20210020832
    Abstract: A method for fabricating semiconductor device includes the steps of first providing a substrate having a magnetic tunnel junction (MTJ) region and an edge region, forming an first inter-metal dielectric (IMD) layer on the substrate, and then forming a first MTJ and a second MTJ on the first IMD layer, in which the first MTJ is disposed on the MTJ region while the second MTJ is disposed on the edge region. Next, a second IMD layer is formed on the first MTJ and the second MTJ.
    Type: Application
    Filed: October 7, 2020
    Publication date: January 21, 2021
    Inventors: Ching-Wen Hung, Yu-Ping Wang
  • Patent number: 10840437
    Abstract: A method for fabricating semiconductor device includes the steps of first providing a substrate having a magnetic tunnel junction (MTJ) region and an edge region, forming an first inter-metal dielectric (IMD) layer on the substrate, and then forming a first MTJ and a second MTJ on the first IMD layer, in which the first MTJ is disposed on the MTJ region while the second MTJ is disposed on the edge region. Next, a second IMD layer is formed on the first MTJ and the second MTJ.
    Type: Grant
    Filed: June 4, 2018
    Date of Patent: November 17, 2020
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Ching-Wen Hung, Yu-Ping Wang
  • Publication number: 20200335597
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a fin structure formed over a semiconductor substrate and a gate structure formed over the fin structure. The semiconductor device structure also includes an isolation feature over a semiconductor substrate and below the gate structure. The semiconductor device structure further includes two spacer elements respectively formed over a first sidewall and a second sidewall of the gate structure. The first sidewall is opposite to the second sidewall and the two spacer elements have hydrophobic surfaces respectively facing the first sidewall and the second sidewall. The gate structure includes a gate dielectric layer and a gate electrode layer separating the gate dielectric layer from the hydrophobic surfaces of the two spacer elements.
    Type: Application
    Filed: June 29, 2020
    Publication date: October 22, 2020
    Inventors: Min-Hsiu HUNG, Yi-Hsiang CHAO, Kuan-Yu YEH, Kan-Ju LIN, Chun-Wen NIEH, Huang-Yi HUANG, Chih-Wei CHANG, Ching-Hwanq SU
  • Patent number: 10763357
    Abstract: A semiconductor device includes a substrate, a first dielectric layer on the substrate, a hard mask layer on the first dielectric layer, a trench in the hard mask layer and the first dielectric layer, a first source/drain electrode layer on a sidewall of the trench, a second dielectric layer on the first source/drain electrode layer in the trench, a second source/drain electrode layer on the second dielectric layer in the trench, a third dielectric layer on the second source/drain electrode layer in the trench, an ILD layer overlying the trench, an nFET disposed over the trench, and a pFET disposed over the trench and spaced apart from the nFET.
    Type: Grant
    Filed: March 24, 2020
    Date of Patent: September 1, 2020
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventor: Ching-Wen Hung
  • Publication number: 20200227550
    Abstract: A semiconductor device includes a substrate, a first dielectric layer on the substrate, a hard mask layer on the first dielectric layer, a trench in the hard mask layer and the first dielectric layer, a first source/drain electrode layer on a sidewall of the trench, a second dielectric layer on the first source/drain electrode layer in the trench, a second source/drain electrode layer on the second dielectric layer in the trench, a third dielectric layer on the second source/drain electrode layer in the trench, an ILD layer overlying the trench, an nFET disposed over the trench, and a pFET disposed over the trench and spaced apart from the nFET.
    Type: Application
    Filed: March 24, 2020
    Publication date: July 16, 2020
    Inventor: Ching-Wen Hung
  • Patent number: 10700177
    Abstract: A method for forming a semiconductor device structure is provided. The method includes providing a semiconductor substrate including a conductive region made of silicon, germanium or a combination thereof. The method also includes forming an insulating layer over the semiconductor substrate and forming an opening in the insulating layer to expose the conductive region. The method also includes performing a deposition process to form a metal layer over a sidewall and a bottom of the opening, so that a metal silicide or germanide layer is formed on the exposed conductive region by the deposition process. The method also includes performing a first in-situ etching process to etch at least a portion of the metal layer and forming a fill metal material layer in the opening.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: June 30, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Min-Hsiu Hung, Yi-Hsiang Chao, Kuan-Yu Yeh, Kan-Ju Lin, Chun-Wen Nieh, Huang-Yi Huang, Chih-Wei Chang, Ching-Hwanq Su
  • Patent number: 10658296
    Abstract: A method for semiconductor manufacturing is disclosed. The method includes receiving a device having a first surface through which a first metal or an oxide of the first metal is exposed. The method further includes depositing a dielectric film having Si, N, C, and O over the first surface such that the dielectric film has a higher concentration of N and C in a first portion of the dielectric film near the first surface than in a second portion of the dielectric film further away from the first surface than the first portion. The method further includes forming a conductive feature over the dielectric film. The dielectric film electrically insulates the conductive feature from the first metal or the oxide of the first metal.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: May 19, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Cheng-Yi Wu, Li-Hsuan Chu, Ching-Wen Wen, Chia-Chun Hung, Chen Liang Chang, Chin-Szu Lee, Hsiang Liu
  • Publication number: 20200136015
    Abstract: A method for fabricating semiconductor device includes the steps of: forming a first inter-metal dielectric (IMD) layer on a substrate; forming a metal interconnection in the first IMD layer; forming a bottom electrode layer and a pinned layer on the first IMD layer; forming a sacrificial layer on the pinned layer; patterning the sacrificial layer, the pinned layer, and the bottom electrode layer to form a first magnetic tunneling junction (MTJ); forming a second IMD layer around the first MTJ; and removing the sacrificial layer.
    Type: Application
    Filed: December 3, 2018
    Publication date: April 30, 2020
    Inventors: Ching-Wen Hung, Ya-Sheng Feng
  • Patent number: 10636903
    Abstract: A semiconductor device includes a first dielectric layer on a substrate, a hard mask layer on the first dielectric layer, a trench in the hard mask layer and the first dielectric layer, a first source/drain electrode layer on a sidewall of the trench, a second dielectric layer on the first source/drain electrode layer in the trench, a second source/drain electrode layer on the second dielectric layer in the trench, a third dielectric layer on the second source/drain electrode layer in the trench, a 2D material layer overlying the hard mask layer, the first source/drain electrode layer, the second dielectric layer, the second source/drain electrode layer, and the third dielectric layer, a gate dielectric layer on the 2D material layer, and a gate electrode on the gate dielectric layer.
    Type: Grant
    Filed: April 23, 2019
    Date of Patent: April 28, 2020
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventor: Ching-Wen Hung
  • Patent number: 10608045
    Abstract: A semiconductor device and method of forming the same, the semiconductor device includes a substrate, first plug, a magnetoresistive random access memory (MRAM) structure, a spacer layer, a seal layer and a first conductive pattern. The substrate has a first region and a second region, and the first plug is disposed on a dielectric layer disposed on the substrate, within the first region. The MRAM structure is disposed in the dielectric layer and electrically connected to the first plug. The spacer layer is disposed both within the first region and the second region, to cover the MRAM structure. The seal layer is disposed on the MRAM structure and the first plug, only within the first region. The first conductive pattern penetrates through the seal layer to electrically connect the MRAM structure.
    Type: Grant
    Filed: March 10, 2019
    Date of Patent: March 31, 2020
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Ching-Wen Hung, Yu-Ping Wang
  • Publication number: 20200098584
    Abstract: A manufacturing method of a semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate having an active component region and a non-active component region, a first dielectric layer, a second dielectric layer, high resistivity metal segments, dummy stacked structures and a metal connection structure. The high resistivity metal segments are formed in the second dielectric layer and located in the non-active component region. The dummy stacked structures are located in the non-active component region, and at least one dummy stacked structure penetrates through the first dielectric layer and the second dielectric layer and is located between two adjacent high resistivity metal segments. The metal connection structure is disposed on the second dielectric layer, and the high resistivity metal segments are electrically connected to one another through the metal connection structure.
    Type: Application
    Filed: November 22, 2019
    Publication date: March 26, 2020
    Inventor: Ching-Wen Hung
  • Patent number: 10600882
    Abstract: A semiconductor structure is disclosed. The semiconductor structure includes a substrate, and an interlayer dielectric disposed on the substrate which has agate structure therein. The gate structure further includes a gate electrode with a protruding portion, and a gate dielectric layer disposed between the gate electrode and the substrate. A spacer is disposed between the interlayer dielectric and the gate electrode. An insulating cap layer is disposed atop the gate electrode and encompasses the top and the sidewall of the protruding portion.
    Type: Grant
    Filed: October 11, 2015
    Date of Patent: March 24, 2020
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Ching-Wen Hung, Chih-Sen Huang, Yi-Wei Chen, Chun-Hsien Lin
  • Publication number: 20200083168
    Abstract: A method for semiconductor manufacturing is disclosed. The method includes receiving a device having a first surface through which a first metal or an oxide of the first metal is exposed. The method further includes depositing a dielectric film having Si, N, C, and O over the first surface such that the dielectric film has a higher concentration of N and C in a first portion of the dielectric film near the first surface than in a second portion of the dielectric film further away from the first surface than the first portion. The method further includes forming a conductive feature over the dielectric film. The dielectric film electrically insulates the conductive feature from the first metal or the oxide of the first metal.
    Type: Application
    Filed: November 12, 2019
    Publication date: March 12, 2020
    Inventors: Cheng-Yi Wu, Li-Hsuan Chu, Ching-Wen Wen, Chia-Chun Hung, Chen Liang Chang, Chin-Szu Lee, Hsiang Liu
  • Patent number: 10553576
    Abstract: A method for filling patterns includes the steps of: providing a substrate having a cell region defined thereon; forming main patterns on the substrate and within the cell region; and filling first dummy patterns adjacent to the main patterns. Preferably, each of the first dummy patterns comprises a first length along X-direction between 2 ?m to 5 ?m and a second length along Y-direction between 3 ?m to 5 ?m.
    Type: Grant
    Filed: February 7, 2018
    Date of Patent: February 4, 2020
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Ching-Wen Hung, Chih-Sen Huang, Yi-Wei Chen
  • Publication number: 20200020583
    Abstract: A method for forming a semiconductor device structure is provided. The method includes forming a fin structure over a semiconductor substrate and forming a gate stack over the fin structure. The method also includes forming an epitaxial structure over the fin structure, and the epitaxial structure is adjacent to the gate stack. The method further includes forming a dielectric layer over the epitaxial structure and forming an opening in the dielectric layer to expose the epitaxial structure. In addition, the method includes applying a metal-containing material on the epitaxial structure while the epitaxial structure is heated so that a portion of the epitaxial structure is transformed to form a metal-semiconductor compound region.
    Type: Application
    Filed: July 13, 2018
    Publication date: January 16, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yi-Hsiang CHAO, Min-Hsiu HUNG, Chun-Wen NIEH, Ya-Huei LI, Yu-Hsiang LIAO, Li-Wei CHU, Kan-Ju LIN, Kuan-Yu YEH, Chi-Hung CHUANG, Chih-Wei CHANG, Ching-Hwanq SU, Hung-Yi HUANG, Ming-Hsing TSAI
  • Patent number: 10535817
    Abstract: A method of manufacturing an embedded magnetoresistive random access memory including the following steps is provided. A memory cell stack structure is formed on a substrate structure. The memory cell stack structure includes a first electrode, a second electrode, and a magnetic tunnel junction structure. A first dielectric layer covering the memory cell stack structure is formed. A metal nitride layer is formed on the first dielectric layer. A second dielectric layer is formed on the metal nitride layer. A first CMP process is performed on the second dielectric layer to expose the metal nitride layer by using the metal nitride layer as a stop layer. An etch back process is performed to completely remove the metal nitride layer and expose the first dielectric layer. A second CMP process is performed to expose the second electrode. The manufacturing method can have a better planarization effect.
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: January 14, 2020
    Assignee: United Microelectronics Corp.
    Inventors: Ching-Wen Hung, Kun-Ju Li
  • Patent number: 10529837
    Abstract: A bipolar junction transistor (BJT) includes an emitter region, abase region on one side of the emitter region, and a collector region on the other side of the base region. The emitter region includes first fins extending along a first direction, a first metal gate extending across the first fins along a second direction, a second metal gate in parallel with the first metal gate, and an emitter contact plug on the first fins between the first metal gate and the second metal gate. The base region includes second fins extending along the first direction, the first metal gate and the second metal gate extending across the second fins along the second direction, and a base contact plug on the second fins between the first metal gate and the second metal gate. The emitter contact plug is aligned with the base contact plug.
    Type: Grant
    Filed: September 2, 2018
    Date of Patent: January 7, 2020
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Ching-Wen Hung, Meng-Chi Chiang, Yen-Chih Lin
  • Patent number: 10529580
    Abstract: A semiconductor device structure and a manufacturing method thereof are provided. The semiconductor device structure includes a semiconductor substrate having an active component region and a non-active component region, a first dielectric layer, a second dielectric layer, high resistivity metal segments, dummy stacked structures and a metal connection structure. The high resistivity metal segments are formed in the second dielectric layer and located in the non-active component region. The dummy stacked structures are located in the non-active component region, and at least one dummy stacked structure penetrates through the first dielectric layer and the second dielectric layer and is located between two adjacent high resistivity metal segments. The metal connection structure is disposed on the second dielectric layer, and the high resistivity metal segments are electrically connected to one another through the metal connection structure.
    Type: Grant
    Filed: September 8, 2017
    Date of Patent: January 7, 2020
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventor: Ching-Wen Hung