Patents by Inventor Ching-Wen Hwang

Ching-Wen Hwang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • THERMAL RADIATION HEAT DISSIPATION DEVICE FOR ELECTRONIC COMPONENT AND PREPARATION METHOD THEREOF
    Publication number: 20230139367
    Abstract: A thermal radiation heat dissipation device for an electronic component includes a heat dissipation substrate including a heat dissipation surface having a heat dissipation surface emissivity; and an emissivity modulation layer disposed on the heat dissipation surface including an emissivity modulation layer surface having an emissivity modulation layer surface emissivity. The emissivity modulation layer surface emissivity is greater the heat dissipation surface emissivity.
    Type: Application
    Filed: May 18, 2022
    Publication date: May 4, 2023
    Inventors: Ching-Wen Hwang, Sih-Wei Chang, Yen-Jen Chen, De-hui Wan, Hsuen-Li Chen