Patents by Inventor Ching-Wen Liao

Ching-Wen Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11934027
    Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: March 19, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
  • Patent number: 5702624
    Abstract: A heat treatment control system to cure a photoresist that is deposited upon a semiconductor substrate is described. The heat treatment system has a hot plate with a heating element and temperature sensing devices that are in close proximity to the semiconductor substrate. The heat treatment system also has a controlling device that will selectively provide an electrical power source to the heating element to heat the semiconductor wafer. The coupling of the heating element to an electrical power source is determined by an electrical signal from one of the temperature sensing devices that have been conditioned and compared to a set temperature signal to provide an error signal. The controlling device will examine the error signal and adjust the temperature. An over temperature alarm circuit is connected to the second temperature sensing device.
    Type: Grant
    Filed: October 9, 1996
    Date of Patent: December 30, 1997
    Assignee: Taiwan Semiconductors Manfuacturing Company, Ltd
    Inventors: Ching-Wen Liao, Chin-Chuan Kuo, Chi-Kang Peng, Tsun-Ching Lin