Abstract: A semiconductor package includes a conductive pillar and a solder. The conductive pillar has a first sidewall and a second sidewall opposite to the first sidewall, wherein a height of the first sidewall is greater than a height of the second sidewall. The solder is disposed on and in direct contact with the conductive pillar, wherein the solder is hanging over the first sidewall and the second sidewall of conductive pillar.

Abstract: Provided is a pharmaceutical composition including gastrodin and a use thereof for the prevention or the treatment of amyotrophic lateral sclerosis. The pharmaceutical composition is effective in reducing neuronal axon degeneration and neurofibromin accumulation, improving symptoms of amyotrophic lateral sclerosis and extending life of patients of amyotrophic lateral sclerosis.

Abstract: Integrated fan-out packages and methods of forming the same are disclosed. An integrated fan-out package includes two dies, an encapsulant, a first metal line and a plurality of dummy vias. The encapsulant is disposed between the two dies. The first metal line is disposed over the two dies and the encapsulant, and electrically connected to the two dies. The plurality of dummy vias is disposed over the encapsulant and aside the first metal line.

Abstract: An intelligent power module packaging structure includes an insulated heat dissipation substrate, a plurality of power devices, a control chip, a lead frame, and an encapsulant. The insulated heat dissipation substrate has a first surface and a second surface opposite to the first surface. The power devices are disposed on the first surface. The control chip is disposed on the first surface. The control chip provides a gate driver function for driving the power devices and a pulse width modulation function. The lead frame is bonded onto the first surface. The power devices are electrically connected to the control chip and the lead frame. The encapsulant at least encapsulates the power devices, the control chip, and a portion of the lead frame, and the second surface is entirely or partially exposed outside the encapsulant.

Abstract: A 3D cell culture gel kit and a 3D cell culture method using the same are provided. The 3D cell culture gel kit includes a gel material A, a buffer solution C, and a buffer solution D. The 3D cell culture method includes the steps of adding cells into a mixed solution containing the gel material A and setting the mixed solution at low temperature to get gel containing the cells. Then adding the buffer solution C to the gel for performing crosslinking. Next removing the buffer solution C and adding a growth medium. Let stand until the cells form spheroids in the gel. Moreover, the buffer solution D is used to dissolve the gel and the cells cultured are taken out for analysis. Thereby the 3D cell culture gel kit is convenient to use and suitable for 3D culture of a plurality of cell lines.

Abstract: An electrostatic-precipitator air cleaner includes a base, a shell, a fan, a barrel, a high-voltage discharge module, a distribution module and a precipitation module. The shell is connected to the base. The fan is connected to an upper portion of the shell. The barrel is connected to the shell above the base. The high-voltage discharge module is connected to the base and inserted in the barrel. The distribution module is connected to the high-voltage discharge module. The precipitation module is inserted in the barrel.

Abstract: An intelligent power module packaging structure includes an insulated heat dissipation substrate, a plurality of power devices, a control chip, a lead frame, and an encapsulant. The insulated heat dissipation substrate has a first surface and a second surface opposite to the first surface. The power devices are disposed on the first surface. The control chip is disposed on the first surface. The control chip provides a gate driver function for driving the power devices and a pulse width modulation function. The lead frame is bonded onto the first surface. The power devices are electrically connected to the control chip and the lead frame. The encapsulant at least encapsulates the power devices, the control chip, and a portion of the lead frame, and the second surface is entirely or partially exposed outside the encapsulant.

Abstract: A power device package structure including a first substrate, a second substrate, at least one power device, and a package is provided. A heat conductivity of the first substrate is greater than 200 Wm?1K?1. The power device is disposed on the first substrate, and the second substrate is disposed under the first substrate. A heat capacity of the second substrate is greater than that of the first substrate. The package encapsulates the first substrate, the second substrate, and the power device.

Abstract: A package structure for power devices includes a heat dissipation insulating substrate, a plurality of power devices, a heat dissipation baseplate, and a thermal interface layer. The heat dissipation insulating substrate has a first surface and a second surface which are opposite to each other, and the power devices are coupled to the first surface of the heat dissipation insulating substrate. The heat dissipation baseplate is disposed at the second surface of the heat dissipation insulating substrate, wherein at least one of a surface of the heat dissipation baseplate and the second surface of the heat dissipation insulating substrate has at least one plateau, and the plateau is at least disposed within a projected area of the plurality of power devices. The thermal interface layer is disposed between the second surface of the heat dissipation insulating substrate and the surface of the heat dissipation baseplate.

Abstract: A chip packaging structure includes a heat dissipation substrate, a pre-molded chipset, an interconnection and a second encapsulant. The pre-molded chipset is located on the heat dissipation substrate. The interconnection is located in the packaging structure and electrically connects the heat dissipation substrate and the pre-molded chipset. The second encapsulant covers part of the heat dissipation substrate, part or all of the interconnection, and part or all of the pre-molded chipset. The pre-molded chipset includes a thermally conductive substrate, at least two chips, a patterned circuit, and a first encapsulant. The patterned circuit is located in the pre-molded chipset. At least two chips are electrically connected by the patterned circuit. The first encapsulant covers at least two chips and part or all of the patterned circuit. A manufacturing method of a chip packaging structure is also provided.

Abstract: Disclosed is a thermal insulating container with a combination inner liner, which includes a cup, surrounded with a storage space and forming an open end. The inner edge of the open end has an inner locking part. An inner liner is surrounded with a bearing space and forms an opening end, wherein the inner liner is fitted in the storage space, and the opening end is provided with a screw thread section. There is a connecting part under the screw thread section. An external member is assembled on the connecting part, and there is an outer locking part on the external surface of the external member. The outer locking part is assembled with the inner locking part of the cup body. A cover has an edge which is a circumferential wall extended downwards, and is provided with a ridge section screwed on/off the screw thread section of the inner liner.

Abstract: A package structure for power devices includes a heat dissipation insulating substrate, a plurality of power devices, a heat dissipation baseplate, and a thermal interface layer. The heat dissipation insulating substrate has a first surface and a second surface which are opposite to each other, and the power devices are coupled to the first surface of the heat dissipation insulating substrate. The heat dissipation baseplate is disposed at the second surface of the heat dissipation insulating substrate, wherein at least one of a surface of the heat dissipation baseplate and the second surface of the heat dissipation insulating substrate has at least one plateau, and the plateau is at least disposed within a projected area of the plurality of power devices. The thermal interface layer is disposed between the second surface of the heat dissipation insulating substrate and the surface of the heat dissipation baseplate.

Abstract: An assembly of a blade assembly bracket and a blade of a ceiling fan includes a blade assembly bracket, an adaptor, and a fan blade. The adaptor is pivoted to the blade assembly bracket, and the fan blade is pivoted to the adaptor. When the adaptor is pivoted relative to the blade assembly bracket, the adaptor can drive the rotatable holder simultaneously to switch a position of the fan blade between an initial position and a rotational position, so as to change an inclination angle of the fan blade, and make the fan blade unfold outwardly. When the operation of the ceil fan is stopped, the adaptor is operated reversely to make the fan blade fold from the outwardly-unfolded state.

Abstract: A package structure for power devices includes a heat dissipation insulating substrate, a plurality of power devices, at least one conductive clip, and a heat dissipation baseplate. The heat dissipation insulating substrate has a first surface and a second surface opposite thereto, and the power devices form a bridge circuit topology and are disposed on the first surface, wherein active regions of at least one of the power devices are flip-chip bonded to the first surface. The conductive clip is configured to electrically connect at least one of the power devices to the first surface, and the heat dissipation baseplate is disposed at the second surface of the heat dissipation insulating substrate.

Abstract: An electrostatic-precipitator air cleaner includes a base, a shell, a fan, a barrel, a high-voltage discharge module, a distribution module and a precipitation module. The shell is connected to the base. The fan is connected to an upper portion of the shell. The barrel is connected to the shell above the base. The high-voltage discharge module is connected to the base and inserted in the barrel. The distribution module is connected to the high-voltage discharge module. The precipitation module is inserted in the barrel.

Abstract: A power device package structure including a first substrate, a second substrate, at least one power device, and a package is provided. A heat conductivity of the first substrate is greater than 200 Wm?1K?1. The power device is disposed on the first substrate, and the second substrate is disposed under the first substrate. A heat capacity of the second substrate is greater than that of the first substrate. The package encapsulates the first substrate, the second substrate, and the power device.

Abstract: A ceiling fan lighting system includes a fan assembly, a light assembly and a lift mechanism. The fan assembly includes a motor and a plurality of fan blades being operationally coupled to the motor to permit rotation of the fan blades when the motor is supplied with power. The light assembly is coupled to the fan assembly and has at least one light source and a lamp shade enclosing the light source. Moreover, the lift mechanism is configured to move the light assembly in a vertical plane with respect to the fan assembly in order to have the lamp shade of the light assembly enclose or disclose the fan blades of the fan assembly.

Abstract: A ceiling fan lighting system includes a fan assembly, a light assembly and a lift mechanism. The fan assembly includes a motor and a plurality of fan blades being operationally coupled to the motor to permit rotation of the fan blades when the motor is supplied with power. The light assembly is coupled to the fan assembly and has at least one light source and a lamp shade enclosing the light source. Moreover, the lift mechanism is configured to move the light assembly in a vertical plane with respect to the fan assembly in order to have the lamp shade of the light assembly enclose or disclose the fan blades of the fan assembly.