Abstract: A multilayer chip-type triplexer is provided. It uses four-session matching transmission lines to integrate three band-pass filters at different frequency bands for simplifying triplexer design. A band-pass filter may be composed of a two-stage combline band-pass filter. The transmission zero generated by the two-stage combline band-pass filter is to increase the isolation and performance of the triplexer. The triplexer uses low-loss materials to reduce the insertion loss of the circuit Moreover, a multilayer structure is adopted to minimize the size of the triplexer. The triplexer is applicable to multiband radio-frequency modules, and meets the multimodule requirement for wireless communication products.

Abstract: A multilayer chip-type triplexer is provided. It uses four-session matching transmission lines to integrate three band-pass filters at different frequency bands for simplifying triplexer design. A band-pass filter may be composed of a two-stage combline band-pass filter. The transmission zero generated by the two-stage combline band-pass filter is to increase the isolation and performance of the triplexer. The triplexer uses low-loss materials to reduce the insertion loss of the circuit Moreover, a multilayer structure is adopted to minimize the size of the triplexer. The triplexer is applicable to multiband radio-frequency modules, and meets the multimodule requirement for wireless communication products.

Abstract: A multi-layer radio frequency chip balun comprises a multi-layer dielectric structure. The equivalent circuit of the multi-layer dielectric structure comprises mainly an input port, first and second output ports, and a few even sections of broadside coupled lines. Each section of the coupled line is wired in a particular shape and is composed of two coupled lines. Each section of coupled line corresponds to a coupled coefficient. The sections of the coupled lines have completely symmetric structures on two sides with respect to the center geometrically. Both phase and amplitude are well balanced at the balanced ports. Moreover, the balance of phase and power can be adjusted by inserting a transmission line between two broadside coupled lines to achieve more complicated impedance match. The balun can be fabricated with low dielectric constant materials. In addition to the reduction in cost, the stability of the balun is also improved.

Abstract: A multi-layer LC resonance balun includes at least a section of broadside coupled lines connected to an input port and two balanced output ports through transmission lines. Each section of coupled lines has two coupled lines. The first embodiment has at least two sections of coupled lines connected to a transmission line and coupled in parallel with at least one capacitor. The coupled lines are connected to an input port and two balanced output ports. The second embodiment has at least a section of coupled lines coupled in parallel with capacitors and then connected to an input port and two balanced output ports through transmission lines. By means of a multiple layer dielectric structure and meandered coupled lines, the size of the blaun is decreased and the frequency bandwidth is increased.

Abstract: A multi-layer LC resonance balun includes at least a section of broadside coupled lines connected to an input port and two balanced output ports through transmission lines. Each section of coupled lines has two coupled lines. The first embodiment has at least two sections of coupled lines connected to a transmission line and coupled in parallel with at least one capacitor. The coupled lines are connected to an input port and two balanced output ports. The second embodiment has at least a section of coupled lines coupled in parallel with capacitors and then connected to an input port and two balanced output ports through transmission lines. By means of a multiple layer dielectric structure and meandered coupled lines, the size of the blaun is decreased and the frequency bandwidth is increased.

Abstract: A plurality of ceramic substrates are used to manufacture and integrate a highly integrated multi-layer circuit module. Integrated circuit devices are mounted on one or both surfaces of the circuit module whose multi-layer structure is divided into three types of integration regions including inter-connection integration regions, basic passive device integration regions and high frequency passive device integration regions. Connection layers are formed in the inter-connection integration regions for connecting integrated circuits. Basic passive device integration regions include capacitor, resistor and inductor layers. Filters, couplers and baluns are fabricated in the high frequency passive device integration regions. Shielding ground planes are provided for the isolation of devices to prevent electromagnetic interference. Standard input and output contacts are formed on the bottom surface so that the circuit module can be used as a modularized device.