Patents by Inventor Ching-Wen Weng

Ching-Wen Weng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090111327
    Abstract: The present invention relates to a HDMI snap-in coupler, which comprises a circuit board, a first HDMI connection port module, a second HDMI connection port module, a top housing, and bottom housing. The first and second HDMI connection port modules are set on the circuit board. The top housing accommodates the circuit board, and the first and second HDMI connection port modules. The top housing has a first opening. The first HDMI connection port module is placed in the first opening. The bottom housing lodges in the top housing and has a second opening. The second HDMI connection port module is placed in the second opening. The present invention provides a HDMI snap-in coupler with double-side HDMI interfaces suitable for installing on current common socket panels (such as: information panels or multimedia information panels) without the need of modifying the design of the socket panels. Thereby, market universality and integration purposes can be achieved.
    Type: Application
    Filed: October 26, 2007
    Publication date: April 30, 2009
    Inventors: Ching Wen Weng, Chiao Lan Yeh
  • Publication number: 20050130505
    Abstract: The present invention relates to an assembled structure of a connector, which comprises a printed circuit board (PCB), an I/O port, a connector socket configured on a jack frame, wherein spring jackwires in the I/O port and beam contacts in the connector socket form spring plates, so that the spring plates can get a close contact with corresponding terminals and the jackwire block and the connector block can be fixed on the PCB when the jackwire block in the I/O port and the slot in the connector socket joins corresponding terminals on the PCB respectively.
    Type: Application
    Filed: December 10, 2003
    Publication date: June 16, 2005
    Inventor: Ching-Wen Weng
  • Publication number: 20050099243
    Abstract: A transmission line structure on base board is proposed to arrange an elliptical or, paper-clip shaped lead-wire wound pattern adjacent to the output end of every independent lead wire to thereby enlarge the area enclosed by the lead wires and accordingly to enhance the capacitance of the base board, compensate the circuit signals, and make shrinkage of the circuit board possible.
    Type: Application
    Filed: November 11, 2003
    Publication date: May 12, 2005
    Inventor: Ching-Wen Weng