Patents by Inventor Ching Wong

Ching Wong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200036207
    Abstract: A battery module including a rechargeable battery, a charging circuit for the rechargeable battery; and a switch adapted to connect the rechargeable battery to the charging circuit, or to output terminals of the battery system. The switch is adapted to change its switching status by a voltage applied to input terminals of the charging circuit. By de-centralizing the control of the switches in multiple battery modules, adding or removing a battery module from the group of battery modules becomes easy.
    Type: Application
    Filed: July 30, 2018
    Publication date: January 30, 2020
    Applicant: Hi-Cooler Company Limited
    Inventors: Ching Wong, Ka Yun Chan
  • Publication number: 20060211171
    Abstract: Disclosed are methods and substrates suitable for flip-chip assembly. Underfill processing used to produce the substrates provides for lead-free, eutectic solder, and other alloy reflow based flip-chip interconnects for 10-20 ?m peripheral and area array I/O pitch. The methods and substrates utilize underfill materials with tailored properties along with a variety of patterning techniques to produce openings in underfill material disposed on the substrates that are used as an alignment guide for flip-chip attachment to the substrates.
    Type: Application
    Filed: March 10, 2006
    Publication date: September 21, 2006
    Inventors: Rao Tummala, Verkatesh Sundaram, Jui-Yun Tsai, Ching Wong
  • Publication number: 20050268734
    Abstract: An electrical condition monitoring method utilizes measurements of electrical resistivity of an age sensor (303) made of a conductive matrix or composite disposed in a polymeric structure such as an electrical cable (301). The conductive matrix comprises a base polymer and conductive filler. The method comprises a means for communicating the resistivity to a measuring instrument (317) as a means to correlate resistivity of the conductive matrix of the polymeric structure with resistivity of an accelerated-aged conductive composite.
    Type: Application
    Filed: March 5, 2003
    Publication date: December 8, 2005
    Inventors: Kenneth Watkins Jr, Shelby Morris, Daniel Masakowski, Ching Wong
  • Publication number: 20050193422
    Abstract: The present invention is suitable for use in a communications system that downloads applications over a broadcast file system (BFS). An application services interface (ASI) provides the BFS an application file including a configuration file and an image file that are stored in a service manager in set-tops. Additionally, the ASI provides the BFS a content file that is included in the application file. The provided content file is separated into service files, where each service file is associated with a particular service. When a set-top requests a service, the associated service file is subsequently loaded onto the set-top. Alternatively, a service file is stored in memory until such time as another service is requested, which at that point the older service file is removed from memory to allow space for the newly requested service file.
    Type: Application
    Filed: February 27, 2004
    Publication date: September 1, 2005
    Inventors: Jeffrey Weyrich, Nitin Gupta, Rahul Gupta, Thomas Heagy, David Lutz, Aaron Lynch, Anthony Owens, Howard Soloway, Deborah Spencer, John DeBoard, Ching Wong, Yimin Zhang