Patents by Inventor Ching-Ya Huang

Ching-Ya Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220081854
    Abstract: A wedge-shaped pushing device for bridge and construction method thereof includes a base, a lifter and a pushing mechanism. The top of the base has a platform with a wedge-shaped block; the wedge-shaped block has a top side formed into an upper slope; the top of the lifter has a pad; the pushing mechanism has an upper wedge-shaped seat, hydraulic cylinders and a support seat; the upper wedge-shaped seat has top with a cushion and a bottom formed into a lower slope; the hydraulic cylinder has a piston rod; the support seat has a top fixed and combined with the hydraulic cylinder by a pivot. By the wedge-shaped pushing device, the box girder can be displaced and pushed to achieve the effects of lowering the construction cost, facilitating the installation, and improving the stability and safety of the displacement and pushing of the box girder.
    Type: Application
    Filed: June 25, 2021
    Publication date: March 17, 2022
    Inventors: Kun-Te Lin, Ching-Ya Huang
  • Patent number: 11037287
    Abstract: A method for measuring critical dimension is provided. The method includes the steps of: receiving a critical-dimension scanning electron microscopy (CD-SEM) image of a semiconductor wafer; performing an image-sharpening process and an image de-noise process on the CD-SEM image to generate a first image; performing an edge detection process on the first image to generate a second image; performing a connected-component labeling process on the second image to generate an output image; and calculating a critical-dimension information table of the semiconductor wafer according to the output image.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: June 15, 2021
    Assignee: WINBOND ELECTRONICS CORP.
    Inventors: Ching-Ya Huang, Tso-Hua Hung
  • Patent number: 10916006
    Abstract: A recognition method of pattern feature is provided, where a recognition result thereof is applied to optical proximity correction, the method includes: providing a plurality of reference images with a reference pattern feature; recognizing and classifying the reference images by an image recognition device, and storing the recognition result; comparing the image with the actual pattern feature with the stored recognition result by the image recognition device to recognize and classify the image with the actual pattern feature; and calculating an angle feature value and/or a distance feature value of the actual pattern feature by the image recognition device according to a classification result to obtain the recognition result of the pattern feature.
    Type: Grant
    Filed: April 16, 2019
    Date of Patent: February 9, 2021
    Assignee: Winbond Electronics Corp.
    Inventors: Ching-Ya Huang, Tso-Hua Hung
  • Publication number: 20200334799
    Abstract: A recognition method of pattern feature is provided, where a recognition result thereof is applied to optical proximity correction, the method includes: providing a plurality of reference images with a reference pattern feature; recognizing and classifying the reference images by an image recognition device, and storing the recognition result; comparing the image with the actual pattern feature with the stored recognition result by the image recognition device to recognize and classify the image with the actual pattern feature; and calculating an angle feature value and/or a distance feature value of the actual pattern feature by the image recognition device according to a classification result to obtain the recognition result of the pattern feature.
    Type: Application
    Filed: April 16, 2019
    Publication date: October 22, 2020
    Applicant: Winbond Electronics Corp.
    Inventors: Ching-Ya Huang, Tso-Hua Hung
  • Publication number: 20190347781
    Abstract: A method for measuring critical dimension is provided. The method includes the steps of: receiving a critical-dimension scanning electron microscopy (CD-SEM) image of a semiconductor wafer; performing an image-sharpening process and an image de-noise process on the CD-SEM image to generate a first image; performing an edge detection process on the first image to generate a second image; performing a connected-component labeling process on the second image to generate an output image; and calculating a critical-dimension information table of the semiconductor wafer according to the output image.
    Type: Application
    Filed: April 29, 2019
    Publication date: November 14, 2019
    Inventors: Ching-Ya HUANG, Tso-Hua HUNG
  • Publication number: 20120007510
    Abstract: A lamp with power supply detection includes a power supply unit, a control module and a lighting module. The power supply unit provides a direct current (DC) voltage. The control module is coupled to the power supply unit, receives and stores the DC power, and generates a control signal according to whether the DC power is terminated or regained. The lighting module is coupled to the power supply unit and the control module, receives the DC power and adjusts brightness of the lighting module according to the control signal.
    Type: Application
    Filed: July 7, 2010
    Publication date: January 12, 2012
    Inventors: Alex Horng, Kuan-Yin Hou, Chung-Ken Cheng, Ching-Ya Huang, Li-Yang Lyu