Abstract: A fan module including a body and a plurality of blades is provided. The body has a rotating axis and the body is telescopic along the rotating axis to have an elongated state and a shortened state. The blades are respectively disposed on the body and rotate along with the body along the rotating axis. At least a portion of each blade is flexible and a bending state of each blade is changed along with the elongated state or the shortened state of the body. An axial size of each blade along the rotating axis when the body is in the elongated state is greater than the axial size of each blade along the rotating axis when the body is in the shortened state.

Abstract: A fan module including a first body, a second body, a first fan assembly, a power module, and a second fan assembly is provided. The second body is slidably disposed at the first body to form a circulation space together. The first fan assembly is rotatably disposed at the first body and has sliding grooves. The power module is disposed in the first body and connected to the first fan assembly. The second fan assembly is rotatably disposed at the second body and has sliding portions, respectively and slidably disposed in corresponding sliding grooves. The power module is adapted to drive the first and second fan assemblies to rotate relative to the first body. A link module is adapted to drive the first and second bodies to relatively slide along an axial direction, so that the first and second fan assemblies are relatively separated or overlapped along the axial direction.

Abstract: A thermal module including a first body, a second body, a first fan assembly, a second fan assembly, and a shaft is provided. The first body and the second body are slidably connected to each other and form an accommodating space together. The first fan assembly is disposed in the accommodating space and has a first hub and a plurality of first fan blades. The first hub is connected to the first body. The second fan assembly is disposed in the accommodating space and has a second hub and a plurality of second fan blades, and the second hub is connected to the second body. The first hub and the second hub overlap each other. The shaft is pivotally disposed in the first body and the second body and is engaged with the first fan assembly and the second fan assembly.

Abstract: An electronic device and a method for controlling a fan operation are provided. A containing space of the electronic device has a fan module and a deformation sensor. The deformation sensor detects whether a fan housing of the fan module is deformed. The deformation sensor transmits a deformation signal to a controller when detecting that the fan housing is deformed. The controller drives a fan blade of the fan module to stop running after receiving the deformation signal.

Abstract: A thermal module including a first body, a second body, a first fan assembly, a second fan assembly, and a shaft is provided. The first body and the second body are slidably connected to each other and form an accommodating space together. The first fan assembly is disposed in the accommodating space and has a first hub and a plurality of first fan blades. The first hub is connected to the first body. The second fan assembly is disposed in the accommodating space and has a second hub and a plurality of second fan blades, and the second hub is connected to the second body. The first hub and the second hub overlap each other. The shaft is pivotally disposed in the first body and the second body and is engaged with the first fan assembly and the second fan assembly.

Abstract: A fan module including a body and a plurality of blades is provided. The body has a rotating axis and the body is telescopic along the rotating axis to have an elongated state and a shortened state. The blades are respectively disposed on the body and rotate along with the body along the rotating axis. At least a portion of each blade is flexible and a bending state of each blade is changed along with the elongated state or the shortened state of the body. An axial size of each blade along the rotating axis when the body is in the elongated state is greater than the axial size of each blade along the rotating axis when the body is in the shortened state.

Abstract: A fan module including a first body, a second body, a first fan assembly, a power module, and a second fan assembly is provided. The second body is slidably disposed at the first body to form a circulation space together. The first fan assembly is rotatably disposed at the first body and has sliding grooves. The power module is disposed in the first body and connected to the first fan assembly. The second fan assembly is rotatably disposed at the second body and has sliding portions, respectively and slidably disposed in corresponding sliding grooves. The power module is adapted to drive the first and second fan assemblies to rotate relative to the first body. A link module is adapted to drive the first and second bodies to relatively slide along an axial direction, so that the first and second fan assemblies are relatively separated or overlapped along the axial direction.

Abstract: A heat dissipation module adapted for an electronic device is provided. The heat dissipation module includes a heat dissipation structure and a heat dissipation fan. The heat dissipation structure is disposed in a casing of the electronic device and has a heat dissipation portion and an extending portion, wherein the extending portion has a slot, and a heat dissipation flow channel is formed between the heat dissipation portion and the casing. The heat dissipation fan is detachably assembled to the extending portion to be adjacent to the heat dissipation portion, wherein the heat dissipation fan covers the slot, the slot is connected to the heat dissipation flow channel, the heat dissipation fan is adapted to provide a heat dissipation air flow, and a part of the heat dissipation air flow passes through the slot and the heat dissipation flow channel in sequence.

Abstract: An electronic device and a method for controlling a fan operation are provided. A containing space of the electronic device has a fan module and a deformation sensor. The deformation sensor detects whether a fan housing of the fan module is deformed. The deformation sensor transmits a deformation signal to a controller when detecting that the fan housing is deformed. The controller drives a fan blade of the fan module to stop running after receiving the deformation signal.

Abstract: A heat dissipation structure includes a first heat-conducting sheet, a second heat-conducting sheet and a meshed heat-conducting layer. The meshed heat-conducting layer is adhered between the first heat-conducting sheet and the second heat-conducting sheet. The meshed heat-conducting layer includes a plurality of first heat-conducting mediums and a plurality of second heat-conducting mediums, the first heat-conducting mediums and the second heat-conducting mediums are alternately arranged, and the thermal conductivity of each of the first heat-conducting mediums is less than the thermal conductivity of each of the second heat-conducting mediums.

Abstract: A docking station suitable for a portable electronic device includes a base, a supporting component and a first fan. The base includes an airflow guiding slope. The supporting component is disposed on the base and has an airflow guiding structure, in which the portable electronic device is configured to be supported on the supporting component. The first fan is disposed in the base and provides a cooling airflow, in which the airflow guiding slope and the airflow guiding structure guide the cooling airflow to flow into the portable electronic device.

Abstract: A heat dissipation structure includes a first heat-conducting sheet, a second heat-conducting sheet and a meshed heat-conducting layer. The meshed heat-conducting layer is adhered between the first heat-conducting sheet and the second heat-conducting sheet. The meshed heat-conducting layer includes a plurality of first heat-conducting mediums and a plurality of second heat-conducting mediums, the first heat-conducting mediums and the second heat-conducting mediums are alternately arranged, and the thermal conductivity of each of the first heat-conducting mediums is less than the thermal conductivity of each of the second heat-conducting mediums.

Abstract: A docking station suitable for a portable electronic device includes a base, a supporting component and a first fan. The base includes an airflow guiding slope. The supporting component is disposed on the base and has an airflow guiding structure, in which the portable electronic device is configured to be supported on the supporting component. The first fan is disposed in the base and provides a cooling airflow, in which the airflow guiding slope and the airflow guiding structure guide the cooling airflow to flow into the portable electronic device.

Abstract: An electronic device includes a main body and a rotating base. The rotating base has a first vent and is pivoted at the main body and adapted to rotate between an operating position and a retracted position relatively to the main body. When the rotating base is located at the operating position, the first vent is exposed out of the main body, and when the rotating base is located at the retracted position, the first vent is retracted into the main body.

Abstract: A touch panel device includes a display module with a touch function and an anti-solar radiation film. The anti-solar radiation film is disposed on a side of the display module and in the touch panel device, so as to prevent solar radiation that passes through the display module to increase an inside temperature of a housing of the touch panel device.

Abstract: A thermal conducting medium protector is applicable for being assembled to a carrier, so as to protect a thermal conducting medium disposed on the carrier. The thermal conducting medium protector includes a shell and a cover plate. The shell has a first buckling portion on one side of the shell, and an opening. When the carrier is placed on a side surface of the shell, the thermal conducting medium is located in the opening. The cover plate has a second buckling portion, a first side, on which the second buckling portion is located, and a second side opposite to the first side and pivoted to the shell. When the cover plate rotates along the second side and then span across the carrier placed on the side surface of the shell, the buckling portions are buckled with each other to hold the carrier between the shell and the cover plate.

Abstract: A thermal conducting medium protector is applicable for being assembled to a carrier, so as to protect a thermal conducting medium disposed on the carrier. The thermal conducting medium protector includes a shell and a cover plate. The shell has a first buckling portion on one side of the shell, and an opening. When the carrier is placed on a side surface of the shell, the thermal conducting medium is located in the opening. The cover plate has a second buckling portion, a first side, on which the second buckling portion is located, and a second side opposite to the first side and pivoted to the shell. When the cover plate rotates along the second side and then span across the carrier placed on the side surface of the shell, the buckling portions are buckled with each other to hold the carrier between the shell and the cover plate.