Patents by Inventor Ching-Ya Yeh

Ching-Ya Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10134709
    Abstract: A light emitting diode package including a circuit layer, a light-shielding layer, a plurality of light emitting diodes and an encapsulation layer is provided. A thickness of the circuit layer is less than 100 ?m. The light-shielding layer is disposed on a first surface of the circuit layer and the light-shielding layer has a plurality of apertures. The light emitting diodes are disposed on the first surface of the circuit layer and in the apertures of the light-shielding layer. The light emitting diodes are electrically connected to the circuit layer. The encapsulation layer covers the light-shielding layer. A refractive index of the encapsulation layer is 1.4 and to 1.7. The Young's modulus of the encapsulation layer is larger than or equal to 1 GPa. A thickness of the encapsulation layer is greater than thicknesses of the light emitting diodes.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: November 20, 2018
    Assignee: Industrial Technology Research Institute
    Inventors: Ming-Hsien Wu, Yao-Jun Tsai, Chia-Hsin Chao, Yen-Hsiang Fang, Yi-Chen Lin, Ching-Ya Yeh