Patents by Inventor Ching Yang

Ching Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060197392
    Abstract: A motor structure comprises a rotor having a driving portion and a magnetic element; the magnetic element being assembled to a lower end of the driving portion; and a stator including an electrode sheet, a coil, and a seat; the coil winding around a stator flame assembling the seat; a magnetic induction portion being protruded from the electrode sheet; and the electrode sheet being installed to the seat. The rotor is pivotally installed to the stator and the magnetic induction portion of the electrode sheet is arranged corresponding to the magnetic element so that after conduction, the coil is interacted with the magnetic element by using phase differences therebetween.
    Type: Application
    Filed: March 2, 2005
    Publication date: September 7, 2006
    Inventors: Ching Yang, Chin Chen
  • Publication number: 20060043553
    Abstract: A chip package mainly includes a substrate, a stiffener, a chip, a thermal interface material (TIM) and a heat spreader. The stiffener is disposed on the substrate and has a receiving portion. The chip is disposed on the substrate. The thermal interface material (TIM) is formed on a surface of the chip. The heat spreader has a resilient-buckling portion, which is snapped into the receiving portion of the stiffener, whereby the heat spreader can contact the thermal interface material (TIM), the bond line thickness of the thermal interface material between the chip and the heat spreader can be controlled, and the heat spreader is prevented from sliding during a packaging process.
    Type: Application
    Filed: September 2, 2005
    Publication date: March 2, 2006
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Ching Yang, Chun Huang