Patents by Inventor Ching-Yang Chang
Ching-Yang Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240136291Abstract: Semiconductor devices and methods of forming the same are provided. In some embodiments, a method includes receiving a workpiece having a redistribution layer disposed over and electrically coupled to an interconnect structure. In some embodiments, the method further includes patterning the redistribution layer to form a recess between and separating a first conductive feature and a second conductive feature of the redistribution layer, where corners of the first conductive feature and the second conductive feature are defined adjacent to and on either side of the recess. The method further includes depositing a first dielectric layer over the first conductive feature, the second conductive feature, and within the recess. The method further includes depositing a nitride layer over the first dielectric layer. In some examples, the method further includes removing portions of the nitride layer disposed over the corners of the first conductive feature and the second conductive feature.Type: ApplicationFiled: January 12, 2023Publication date: April 25, 2024Inventors: Hsiang-Ku SHEN, Chen-Chiu HUANG, Chia-Nan LIN, Man-Yun WU, Wen-Tzu CHEN, Sean YANG, Dian-Hao CHEN, Chi-Hao CHANG, Ching-Wei LIN, Wen-Ling CHANG
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Patent number: 11966162Abstract: A photoresist composition includes a photoactive compound and a polymer. The polymer has a polymer backbone including one or more groups selected from: The polymer backbone includes at least one group selected from B, C-1, or C-2, wherein ALG is an acid labile group, and X is a linking group.Type: GrantFiled: May 22, 2023Date of Patent: April 23, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Tzu-Yang Lin, Ching-Yu Chang, Chin-Hsiang Lin
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Publication number: 20240113032Abstract: Interconnect structure packages (e.g., through silicon vias (TSV) packages, through interlayer via (TIV) packages) may be pre-manufactured as opposed to forming TIVs directly on a carrier substrate during a manufacturing process for a semiconductor die package at backend packaging facility. The interconnect structure packages may be placed onto a carrier substrate during manufacturing of a semiconductor device package, and a semiconductor die package may be placed on the carrier substrate adjacent to the interconnect structure packages. A molding compound layer may be formed around and in between the interconnect structure packages and the semiconductor die package.Type: ApplicationFiled: April 25, 2023Publication date: April 4, 2024Inventors: Kai-Fung CHANG, Chin-Wei LIANG, Sheng-Feng WENG, Ming-Yu YEN, Cheyu LIU, Hung-Chih CHEN, Yi-Yang LEI, Ching-Hua HSIEH
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Patent number: 9557780Abstract: Disclosed is a conductor pattern structure of a capacitive touch panel. First-axis conductor assemblies and second-axis conductor assemblies are formed on a surface of a substrate. Each first-axis conductor assembly includes a plurality of first-axis conductor cells that are interconnected by first-axis conduction lines. An insulation layer is formed on a surface of each first-axis conduction line. Each second-axis conductor assembly includes a plurality of second-axis conductor cells that are interconnected by second-axis conduction lines. Each second-axis conduction line extends across the insulation layer of the associated first-axis conduction line.Type: GrantFiled: September 30, 2013Date of Patent: January 31, 2017Assignee: TPK TOUCH SOLUTIONS INC.Inventors: Ching-Yang Chang, Shun-Ta Chien
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Patent number: 9423906Abstract: The present invention is directed to a drive system adaptable to a matrix scanning device. A number of first drive circuits are disposed on a first periphery along a first direction of a substrate with each said first drive circuit being coupled to at least one column wire of the matrix scanning device. A number of second drive circuits are disposed on a second periphery along a second direction of the substrate with each said second drive circuit being coupled to at least one row wire of the matrix scanning device. A master controller controls the first drive circuits and the second drive circuits. A bus is electrically coupled to the master controller, the first drive circuits and the second drive circuits.Type: GrantFiled: November 18, 2011Date of Patent: August 23, 2016Inventors: Ching-Yang Chang, Jui-Jung Chin, Ta-Kang Chou
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Publication number: 20160103467Abstract: Disclosed is a conductor pattern structure of a capacitive touch panel. First-axis conductor assemblies and second-axis conductor assemblies are formed on a surface of a substrate. Each first-axis conductor assembly includes a plurality of first-axis conductor cells that are interconnected by first-axis conduction lines. An insulation layer is formed on a surface of each first-axis conduction line. Each second-axis conductor assembly includes a plurality of second-axis conductor cells that are interconnected by second-axis conduction lines. Each second-axis conduction line extends across the insulation layer of the associated first-axis conduction line.Type: ApplicationFiled: September 30, 2013Publication date: April 14, 2016Applicant: TPK TOUCH SOLUTIONS INC.Inventors: Ching-Yang Chang, Shun-Ta Chien
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Publication number: 20150378401Abstract: Disclosed is a conductor pattern structure of a capacitive touch panel. First-axis conductor assemblies and second-axis conductor assemblies are formed on a surface of a substrate. Each first-axis conductor assembly includes a plurality of first-axis conductor cells that are interconnected by first-axis conduction lines. An insulator is formed on a surface of each adjacent first-axis conductor cell. Each second-axis conductor assembly includes a plurality of second-axis conductor cells that are interconnected by second-axis conduction lines. Each second-axis conduction line extends across the insulator disposed on the adjacent first-axis conductor cell.Type: ApplicationFiled: September 30, 2013Publication date: December 31, 2015Applicant: TPK TOUCH SOLUTIONS (XIAMEN) INC.Inventors: Ching-Yang Chang, Shun-Ta Chien, Hua Ding, Li Yang
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Patent number: 9213376Abstract: Disclosed is a conductor pattern structure of a capacitive touch panel. First-axis conductor assemblies and second-axis conductor assemblies are formed on a surface of a substrate. Each first-axis conductor assembly includes a plurality of first-axis conductor cells that are interconnected by first-axis conduction lines. An insulator is formed on a surface of each adjacent first-axis conductor cell. Each second-axis conductor assembly includes a plurality of second-axis conductor cells that are interconnected by second-axis conduction lines. Each second-axis conduction line extends across the insulator disposed on the adjacent first-axis conductor cell.Type: GrantFiled: September 30, 2013Date of Patent: December 15, 2015Assignee: TPK Touch Solutions (Xiamen) Inc.Inventors: Ching-Yang Chang, Shun-Ta Chien, Hua Ding, Li Yang
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Patent number: 8847904Abstract: Methods and systems for implementing gestures with touch sensing device are disclosed. A gesture recognition method includes: determining whether an input gesture matches a predefined universal gesture based on touch information on a touch panel; and generating a corresponding gesture command set according to an event signal when the input gesture matches the predefined universal gesture.Type: GrantFiled: May 16, 2012Date of Patent: September 30, 2014Assignee: TPK Touch Solutions Inc.Inventors: Ching-Yang Chang, Hsiang-Cheng Wu
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Patent number: 8754871Abstract: The present invention provides a capacitive touch sensing device and a scanning method thereof. The present invention divides a scanning procedure of an electrode matrix into two stages. First, it scans broadly for determining whether the potential signal of at least one driving line of the electrode matrix is changed or not. After that, the present invention is only directed to the driving line which the potential signal is changed to scan in detail, to determine whether the potential signal of each coupling node on the driving line is changed or not. Therefore, the present invention can achieve the purpose of improving sensing efficiency of the capacitive touch sensing device.Type: GrantFiled: August 9, 2011Date of Patent: June 17, 2014Assignee: TPK Touch Solutions Inc.Inventor: Ching-Yang Chang
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Publication number: 20140028929Abstract: Disclosed is a conductor pattern structure of a capacitive touch panel. First-axis conductor assemblies and second-axis conductor assemblies are formed on a surface of a substrate. Each first-axis conductor assembly includes a plurality of first-axis conductor cells that are interconnected by first-axis conduction lines. An insulator is formed on a surface of each adjacent first-axis conductor cell. Each second-axis conductor assembly includes a plurality of second-axis conductor cells that are interconnected by second-axis conduction lines. Each second-axis conduction line extends across the insulator disposed on the adjacent first-axis conductor cell.Type: ApplicationFiled: September 30, 2013Publication date: January 30, 2014Applicant: TPK TOUCH SOLUTIONS (XIAMEN) INC.Inventors: Ching-Yang Chang, Shun-Ta Chien, Hua Ding, Li Yang
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Publication number: 20140028930Abstract: Disclosed is a conductor pattern structure of a capacitive touch panel. First-axis conductor assemblies and second-axis conductor assemblies are formed on a surface of a substrate. Each first-axis conductor assembly includes a plurality of first-axis conductor cells that are interconnected by first-axis conduction lines. An insulation layer is formed on a surface of each first-axis conduction line. Each second-axis conductor assembly includes a plurality of second-axis conductor cells that are interconnected by second-axis conduction lines. Each second-axis conduction line extends across the insulation layer of the associated first-axis conduction line.Type: ApplicationFiled: September 30, 2013Publication date: January 30, 2014Applicant: TPK TOUCH SOLUTIONS INC.Inventors: Ching-Yang Chang, Shun-Ta Chien
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Patent number: 8610689Abstract: Disclosed is a conductor pattern structure of a capacitive touch panel. First-axis conductor assemblies and second-axis conductor assemblies are formed on a surface of a substrate. Each first-axis conductor assembly includes a plurality of first-axis conductor cells that are interconnected by first-axis conduction lines. An insulator is formed on a surface of each adjacent first-axis conductor cell. Each second-axis conductor assembly includes a plurality of second-axis conductor cells that are interconnected by second-axis conduction lines. Each second-axis conduction line extends across the insulator disposed on the adjacent first-axis conductor cell.Type: GrantFiled: April 12, 2012Date of Patent: December 17, 2013Assignee: TPK Touch Solutions (Xiamen) Inc.Inventors: Ching-Yang Chang, Shun-Ta Chien, Hua Ding, Li Yang
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Patent number: 8610687Abstract: Disclosed is a conductor pattern structure of a capacitive touch panel. First-axis conductor assemblies and second-axis conductor assemblies are formed on a surface of a substrate. Each first-axis conductor assembly includes a plurality of first-axis conductor cells that are interconnected by first-axis conduction lines. An insulation layer is formed on a surface of each first-axis conduction line. Each second-axis conductor assembly includes a plurality of second-axis conductor cells that are interconnected by second-axis conduction lines. Each second-axis conduction line extends across the insulation layer of the associated first-axis conduction line.Type: GrantFiled: February 22, 2012Date of Patent: December 17, 2013Assignee: TPK Touch Solutions Inc.Inventors: Ching-Yang Chang, Shun-Ta Chien
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Patent number: 8605050Abstract: Disclosed is a conductor pattern structure of a capacitive touch panel. First-axis conductor assemblies and second-axis conductor assemblies are formed on a surface of a substrate. Each first-axis conductor assembly includes a plurality of first-axis conductor cells that are interconnected by first-axis conduction lines. Each second-axis conductor assembly includes a plurality of second-axis conductor cells that are interconnected by second-axis conduction lines. At least part of each first-axis conduction lines is conductive in horizontal direction and insulating in vertical direction and each of the second-axis conduction lines respectively intersects with the at least part of corresponding first-axis conduction lines.Type: GrantFiled: April 11, 2012Date of Patent: December 10, 2013Assignee: TPK Touch Solutions (Xiamen) Inc.Inventors: Ching-Yang Chang, Shun-Ta Chien, Fan Zhong Zhang
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Publication number: 20130027327Abstract: Methods and systems for implementing gestures with touch sensing device are disclosed. A gesture recognition method includes: determining whether an input gesture matches a predefined universal gesture based on touch information on a touch panel; and generating a corresponding gesture command set according to an event signal when the input gesture matches the predefined universal gesture.Type: ApplicationFiled: May 16, 2012Publication date: January 31, 2013Inventors: Ching-Yang Chang, Hsiang-Cheng Wu
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Publication number: 20120293426Abstract: The present invention is directed to a drive system adaptable to a matrix scanning device. A number of first drive circuits are disposed on a first periphery along a first direction of a substrate with each said first drive circuit being coupled to at least one column wire of the matrix scanning device. A number of second drive circuits are disposed on a second periphery along a second direction of the substrate with each said second drive circuit being coupled to at least one row wire of the matrix scanning device. A master controller controls the first drive circuits and the second drive circuits. A bus is electrically coupled to the master controller, the first drive circuits and the second drive circuits.Type: ApplicationFiled: November 18, 2011Publication date: November 22, 2012Inventors: CHING-YANG CHANG, Jui-Jung Chin, Ta-Kang Chou
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Publication number: 20120242612Abstract: The present invention provides a capacitive touch sensing device and a scanning method thereof. The present invention divides a scanning procedure of an electrode matrix into two stages. First, it scans broadly for determining whether the potential signal of at least one driving line of the electrode matrix is changed or not. After that, the present invention is only directed to the driving line which the potential signal is changed to scan in detail, to determine whether the potential signal of each coupling node on the driving line is changed or not. Therefore, the present invention can achieve the purpose of improving sensing efficiency of the capacitive touch sensing device.Type: ApplicationFiled: August 9, 2011Publication date: September 27, 2012Inventor: Ching-Yang Chang
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Publication number: 20120194473Abstract: Disclosed is a conductor pattern structure of a capacitive touch panel. First-axis conductor assemblies and second-axis conductor assemblies are formed on a surface of a substrate. Each first-axis conductor assembly includes a plurality of first-axis conductor cells that are interconnected by first-axis conduction lines. Each second-axis conductor assembly includes a plurality of second-axis conductor cells that are interconnected by second-axis conduction lines. At least part of each first-axis conduction lines is conductive in horizontal direction and insulating in vertical direction and each of the second-axis conduction lines respectively intersects with the at least part of corresponding first-axis conduction lines.Type: ApplicationFiled: April 11, 2012Publication date: August 2, 2012Inventors: Ching-Yang Chang, Shun-Ta Chien, Fan Zhong Zhang
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Publication number: 20120194474Abstract: Disclosed is a conductor pattern structure of a capacitive touch panel. First-axis conductor assemblies and second-axis conductor assemblies are formed on a surface of a substrate. Each first-axis conductor assembly includes a plurality of first-axis conductor cells that are interconnected by first-axis conduction lines. An insulator is formed on a surface of each adjacent first-axis conductor cell. Each second-axis conductor assembly includes a plurality of second-axis conductor cells that are interconnected by second-axis conduction lines. Each second-axis conduction line extends across the insulator disposed on the adjacent first-axis conductor cell.Type: ApplicationFiled: April 12, 2012Publication date: August 2, 2012Inventors: Ching-Yang Chang, Shun-Ta Chien, Hua Ding, Li Yang