Abstract: The invention provides a method for dynamically adjusting user interface, an electronic device and a computer-readable storage medium. The method includes: displaying a user interface, wherein the user interface partially displays a first block, and the first block includes at least one layer; monitoring a first moving direction of a first specific object; in response to determining that the first specific object moves toward the first block, moving at least one of the at least one layer in the first block toward a reference point in the user interface.

Abstract: The invention provides a method for dynamically adjusting user interface, an electronic device and a computer-readable storage medium. The method includes: displaying a user interface, wherein the user interface partially displays a first block, and the first block includes at least one layer; monitoring a first moving direction of a first specific object; in response to determining that the first specific object moves toward the first block, moving at least one of the at least one layer in the first block toward a reference point in the user interface.

Abstract: An electronic device, method for displaying an augmented reality scene and non-transitory computer-readable medium are provided in this disclosure. The electronic device includes a camera unit, a displayer, and a processor. The processor electrically connected to the camera unit and the displayer. The camera unit is configured for capturing a plurality of images of the physical environment. The displayer is configured for displaying an AR image. The processor is configured for stitching the plurality of images to generate an environment image; calculating an environment light and a reflection of the physical environment corresponding to the virtual object according to the environment image; analyzing direction of a lighting to calculate a shadow corresponding to the virtual object according to the environment image; and rendering the virtual object on the AR image according to the environment light, the reflection, and the shadow.

Abstract: An electronic device, method for displaying an augmented reality scene and non-transitory computer-readable medium are provided in this disclosure. The electronic device includes a camera unit, a displayer, and a processor. The processor electrically connected to the camera unit and the displayer. The camera unit is configured for capturing a plurality of images of the physical environment. The displayer is configured for displaying an AR image. The processor is configured for stitching the plurality of images to generate an environment image; calculating an environment light and a reflection of the physical environment corresponding to the virtual object according to the environment image; analyzing direction of a lighting to calculate a shadow corresponding to the virtual object according to the environment image; and rendering the virtual object on the AR image according to the environment light, the reflection, and the shadow.

Abstract: The present disclosure provides a virtual reality (VR) device, an image processing method, and a non-transitory computer readable storage medium. The VR device includes a display and a processor. The display is configured to display a VR object. The processor is configured to receive a control instruction, and acquire, on the VR object, an indicating region according to the control instruction; acquire, on the indicating region, a control region associated with a 2D image; acquire a 3D normal mapping data corresponding to the indicating region; calibrate a range of the control region according to a position information of the control instruction and the 3D normal mapping data; and edit, on the calibrated range, the control region according to the received control instruction.

Abstract: A fan-out semiconductor package includes a layer of adhesive covering a temporary carrier, a first redistribution layer disposed on the layer of adhesive, the first redistribution layer including a first metal layer having recessed areas. Metal pillars are plated to a first group of the recessed areas in the first metal layer. A semiconductor chip next is bonded to a second group of the recessed areas and a molding compound covers the semiconductor chip. The molding compound is then ground to expose tops of the metal pillars. A second redistribution layer including a second passivation layer adhering to the molding compound and a second metal layer covering openings exposing the tops of the metal pillars are then added.

Abstract: A manufacturing method of a package structure is provided. The method includes the following steps. A redistribution circuit layer is formed on a first carrier. A die is disposed on the redistribution circuit layer. An encapsulant is formed to encapsulate the die. The first carrier is removed to expose a surface of the redistribution circuit layer. A plurality of recesses are formed on the surface of the redistribution circuit layer. A plurality of conductive terminals are formed corresponding to the recesses on the redistribution circuit layer. Another manufacturing method of a package structure is also provided.