Patents by Inventor Ching-Yao Chung

Ching-Yao Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Power supply layout for an integrated circuit
    Publication number: 20050071798
    Abstract: A power supply layout for an integrated circuit has a plurality of power pads, a plurality of ground pads, a plurality of first-type conductive wires directly connected to the power pad, a plurality of second-type conductive wires directly connected to the ground pad, and a core circuit electrically connected to the first-type and the second-type conductive wires for acquiring the operational power. The integrated circuit is made of a plurality of metal layers, wherein the first-type conductive wire and the second-type conductive wire are positioned at different metal layers. The power pad is positioned at the same metal layer as the first-type conductive wire, while the ground pad is positioned at the same metal layer as the second-type conductive wire.
    Type: Application
    Filed: November 25, 2003
    Publication date: March 31, 2005
    Applicant: GOYATEK TECHNOLOGY INC.
    Inventors: Ching-Yao Chung, Nai-Yin Sung, Yen-Hao Chen