Patents by Inventor Ching Yeh

Ching Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11991393
    Abstract: Video processing methods and apparatuses in a video encoding or decoding system for transforming residuals of transform blocks into final transform coefficients or inverse transforming final transform coefficients into residuals. In order to solve the latency issue, exemplary embodiments check if a width or height of a coding block is larger than a predefined threshold, and disable secondary transform or inverse secondary transform for any transform block within the coding block if the width or height of the coding block is larger than the predefined threshold. Another embodiment checks if there are multiple transform blocks in a coding block, and disables secondary transform or inverse secondary transform if the coding block contains multiple transform blocks.
    Type: Grant
    Filed: April 15, 2020
    Date of Patent: May 21, 2024
    Assignee: HFI INNOVATION INC.
    Inventors: Man-Shu Chiang, Chih-Wei Hsu, Tzu-Der Chuang, Ching-Yeh Chen
  • Patent number: 11990429
    Abstract: A method includes bonding a second package component to a first package component, bonding a third package component to the first package component, attaching a dummy die to the first package component, encapsulating the second package component, the third package component, and the dummy die in an encapsulant, and performing a planarization process to level a top surface of the second package component with a top surface of the encapsulant. After the planarization process, an upper portion of the encapsulant overlaps the dummy die. The dummy die is sawed-through to separate the dummy die into a first dummy die portion and a second dummy die portion. The upper portion of the encapsulant is also sawed through.
    Type: Grant
    Filed: November 28, 2022
    Date of Patent: May 21, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chih-Wei Wu, Ying-Ching Shih, Kung-Chen Yeh, Li-Chung Kuo, Pu Wang, Szu-Wei Lu
  • Patent number: 11990351
    Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, an encapsulant, a protection layer and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting the first and second surfaces. The semiconductor die is disposed on the first surface of interposer and electrically connected with the interposer. The encapsulant is disposed over the interposer and laterally encapsulating the at least one semiconductor die. The connectors are disposed on the second surface of the interposer and electrically connected with the at least one semiconductor die through the interposer. The protection layer is disposed on the second surface of the interposer and surrounding the connectors. The sidewalls of the interposer include slanted sidewalls connected to the second surface, and the protection layer is in contact with the slant sidewalls of the interposer.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: May 21, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jiun-Ting Chen, Chih-Wei Wu, Szu-Wei Lu, Tsung-Fu Tsai, Ying-Ching Shih, Ting-Yu Yeh, Chen-Hsuan Tsai
  • Patent number: 11985324
    Abstract: Exemplary video processing methods and apparatuses for encoding or decoding a current block by inter prediction are disclosed. Input data of a current block is received and partitioned into sub-partitions and motion refinement is independently performed on each sub-partition. A reference block for each sub-partition is obtained from one or more reference pictures according to an initial motion vector (MV). A refined MV for each sub-partition is derived by searching around the initial MV with N-pixel refinement. One or more boundary pixels of the reference block for a sub-partition is padded for motion compensation of the sub-partition. A final predictor for the current block is generated by performing motion compensation for each sub-partition according to its refined MV. The current block is then encoded or decoded according to the final predictor.
    Type: Grant
    Filed: March 13, 2020
    Date of Patent: May 14, 2024
    Assignee: HFI INNOVATION INC.
    Inventors: Yu-Cheng Lin, Chun-Chia Chen, Chih-Wei Hsu, Ching-Yeh Chen, Tzu-Der Chuang, Yu-Wen Huang
  • Patent number: 11985330
    Abstract: Methods and apparatus of for video coding using sub-block based affine mode are disclosed. In one method, if affine fallback is used or the control-point motion vectors are the same, the sub-block based affine mode is disabled in order to reduce computational complexity. According to another method for video coding using a coding tool belonging to a coding tool group comprising Prediction Refinement with Optical Flow (PROF) and Bi-Directional Optical Flow (BDOF), predictor refinement is derived for pixels of a target subblock of the current block, where a step to derive the predictor refinement comprises to derive gradients for the pixels of the target subblock of the current block and to right-shift the first gradients by a common shift.
    Type: Grant
    Filed: April 10, 2020
    Date of Patent: May 14, 2024
    Assignee: HFI INNOVATION INC.
    Inventors: Chen-Yen Lai, Tzu-Der Chuang, Ching-Yeh Chen
  • Patent number: 11985314
    Abstract: Video processing methods and apparatuses in a video encoding or decoding system for processing out-of-bounds nodes in a current picture. An out-of-bounds node is a coding tree node with a block region across a current picture boundary. The video processing method or apparatus determines an inferred splitting type, applies the inferred splitting type to split the out-of-bounds node into child blocks, adaptively splits each child block into one or multiple leaf blocks, and encodes or decodes the leaf blocks in the out-of-bounds node inside the current picture. The inferred splitting type for partitioning out-of-bounds nodes in an inter slice, picture, or tile is the same as the inferred splitting type for partitioning out-of-bounds nodes in an intra slice, picture, or tile.
    Type: Grant
    Filed: December 24, 2019
    Date of Patent: May 14, 2024
    Assignee: HFI INNOVATION INC.
    Inventors: Chia-Ming Tsai, Chih-Wei Hsu, Tzu-Der Chuang, Ching-Yeh Chen, Yu-Wen Huang, Shih-Ta Hsiang
  • Publication number: 20240154215
    Abstract: An aluminum plastic film for a lithium battery and a method for manufacturing the same are provided. The method includes steps as follows: preparing a polyolefin adhesive; coating the polyolefin adhesive onto one surface of an aluminum foil layer; disposing an inner polyolefin layer onto the polyolefin adhesive; and drying the polyolefin adhesive, so that a polyolefin adhesive layer is formed between the aluminum foil layer and the inner polyolefin layer. Components of the polyolefin adhesive include a modified polyolefin polymer and a hardener. The modified polyolefin polymer has a modified group, a structure of the modified group contains maleic anhydride, and a molecular weight of the modified polyolefin polymer ranges from 100,000 g/mol to 200,000 g/mol.
    Type: Application
    Filed: February 17, 2023
    Publication date: May 9, 2024
    Inventors: TE-CHAO LIAO, SHIOU-YEH SHENG, TENG-KO MA, CHING-YAO YUAN, Chao-Hsien Lin, CHIA-YU LIN, YUN-BIN HSI, HAN-YI LEE, SHUN-CHIEH YANG
  • Patent number: 11979593
    Abstract: Method and apparatus for affine CPMV or ALF refinement are mentioned. According to this method, statistical data associated with the affine CPMV or ALF refinement are collected over a picture area. Updated parameters for the affine CPMV refinement or the ALF refinement are then derived based on the statistical data, where a process to derive the updated parameters includes performing multiplication using a reduced-precision multiplier for the statistical data. The reduced-precision multiplier truncates at least one bit of the mantissa part. In another embodiment, the process to derive the updated parameters includes performing reciprocal for the statistical data using a lookup table with (m?k)-bit input by truncating k bits from the m-bit mantissa part, and contents of the lookup table includes m-bit outputs. m and k are positive integers.
    Type: Grant
    Filed: April 25, 2022
    Date of Patent: May 7, 2024
    Assignee: MEDIATEK INC.
    Inventors: Shih-Chun Chiu, Tzu-Der Chuang, Ching-Yeh Chen, Chun-Chia Chen, Chih-Wei Hsu, Yu-Wen Huang
  • Patent number: 11979613
    Abstract: Encoding methods and apparatuses include receiving input video data of a current block in a current picture and applying a Cross-Component Adaptive Loop Filter (CCALF) processing on the current block based on cross-component filter coefficients to refine chroma components of the current block according to luma sample values. The method further includes signaling two Adaptive Loop Filter (ALF) signal flags and two CCALF signal flags in an Adaptation Parameter Set (APS) with an APS parameter type equal to ALF or parsing two ALF signal flags and two CCALF signal flags from an APS with an APS parameter type equal to ALF, signaling or parsing one or more Picture Header (PH) CCALF syntax elements or Slice Header (SH) CCALF syntax elements, wherein both ALF and CCALF signaling are present either in a PH or SH, and encoding or decoding the current block in the current picture.
    Type: Grant
    Filed: June 28, 2022
    Date of Patent: May 7, 2024
    Assignee: HFI INNOVATION INC.
    Inventors: Ching-Yeh Chen, Olena Chubach, Chen-Yen Lai, Tzu-Der Chuang, Chih-Wei Hsu, Yu-Wen Huang
  • Patent number: 11978740
    Abstract: A layer stack including a first bonding dielectric material layer, a dielectric metal oxide layer, and a second bonding dielectric material layer is formed over a top surface of a substrate including a substrate semiconductor layer. A conductive material layer is formed by depositing a conductive material over the second bonding dielectric material layer. The substrate semiconductor layer is thinned by removing portions of the substrate semiconductor layer that are distal from the layer stack, whereby a remaining portion of the substrate semiconductor layer includes a top semiconductor layer. A semiconductor device may be formed on the top semiconductor layer.
    Type: Grant
    Filed: February 17, 2022
    Date of Patent: May 7, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Harry-Hak-Lay Chuang, Kuo-Ching Huang, Wei-Cheng Wu, Hsin Fu Lin, Henry Wang, Chien Hung Liu, Tsung-Hao Yeh, Hsien Jung Chen
  • Patent number: 11973958
    Abstract: Methods and apparatus of video coding using sub-block based affine mode are disclosed. According to this method, control-point motion vectors (MVs) associated with the affine mode are determined for a block. A sub-block MV is derived for a target sub-block of the block from the control-point MVs for the block. A prediction offset is determined for a target pixel of the target sub-block using information comprising a pixel MV offset from the sub-block MV for the target pixel according to Prediction Refinement with Optical Flow (PROF). The target pixel of the target sub-block is encoded or decoded using a modified predictor. The modified prediction is generated by clipping the prediction offset to a target range and combining the clipped prediction offset with an original predictor.
    Type: Grant
    Filed: September 22, 2020
    Date of Patent: April 30, 2024
    Assignee: HFI INNOVATION INC.
    Inventors: Tzu-Der Chuang, Ching-Yeh Chen, Zhi-Yi Lin
  • Patent number: 11973985
    Abstract: Various schemes pertaining to pre-encoding processing of a video stream with motion compensated temporal filtering (MCTF) are described. An apparatus determines a filtering interval for a received raw video stream having pictures in a temporal sequence. The apparatus selects from the pictures a plurality of target pictures based on the filtering interval, as well as a group of reference pictures for each target picture to perform pixel-based MCTF, which generates a corresponding filtered picture for each target picture. The apparatus subsequently transmits the filtered pictures as well as non-target pictures to an encoder for encoding the video stream. Subpictures of natural images and screen content images are separately processed by the apparatus.
    Type: Grant
    Filed: August 22, 2022
    Date of Patent: April 30, 2024
    Assignee: MediaTek Inc.
    Inventors: Chih-Yao Chiu, Chun-Chia Chen, Chih-Wei Hsu, Tzu-Der Chuang, Ching-Yeh Chen, Yu-Wen Huang
  • Publication number: 20240136905
    Abstract: A button mechanism is provided, including a button element, a magnet connected to the button, a hollow tube, a first coil, and a second coil. The first and second coils are disposed on the tube. When the first coil generates a first magnetic field, the magnet is magnetically attracted by the first coil, and the button element is positioned in the first position. When the second coil generates a second magnetic field, the magnet is attracted by the second coil, and the button element is positioned in the second position.
    Type: Application
    Filed: January 13, 2023
    Publication date: April 25, 2024
    Inventors: Chun-Lung CHEN, Chih-Ching HSIEH, Chun-Feng YEH
  • Publication number: 20240135023
    Abstract: The present disclosure relates to methods and systems to settle a transaction involving a plurality of digital assets, comprising receiving a notification of a proposed transaction comprising a plurality of proposed component atomic transactions that atomically transfer at least a portion of the plurality of digital assets from one or more transferring nodes to one or more receiving nodes. The method further comprises at least in part determining or verifying that each transferring and receiving computer node is cryptographically authorized to receive and/or transfer at least some of the plurality of digital assets, and that each transferring and receiving computer node has a sufficient amount of the plurality of digital assets. The method further comprises sending an authorization notification to at least one execution node to transfer the plurality of digital assets from the transferring computer nodes to the receiving computer nodes to settle the proposed transaction.
    Type: Application
    Filed: October 23, 2022
    Publication date: April 25, 2024
    Applicant: Digital Asset (Switzerland) GmbH
    Inventors: Walter Eric Saraniecki, Kelly Anne Mathieson, Ratko Goran Veprek, Johan Sjodin, Charng-Ching Yeh
  • Publication number: 20240126327
    Abstract: The present disclosure provides an electronic wearable device. The electronic wearable device includes a first module having a first contact and a second module having a second contact. The first contact is configured to keep electrical connection with the second contact in moving with respect to each other during a wearing period.
    Type: Application
    Filed: October 14, 2022
    Publication date: April 18, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chao Wei LIU, Wei-Hao CHANG, Yung-I YEH, Jen-Chieh KAO, Tun-Ching PI, Ming-Hung CHEN, Hui-Ping JIAN, Shang-Lin WU
  • Publication number: 20240128211
    Abstract: Some implementations described herein provide techniques and apparatuses for a stacked semiconductor die package. The stacked semiconductor die package may include an upper semiconductor die package above a lower semiconductor die package. The stacked semiconductor die package includes one or more rows of pad structures located within a footprint of a semiconductor die of the lower semiconductor die package. The one or more rows of pad structures may be used to mount the upper semiconductor die package above the lower semiconductor die package. Relative to another stacked semiconductor die package including a row of dummy connection structures adjacent to the semiconductor die that may be used to mount the upper semiconductor die package, a size of the stacked semiconductor die package may be reduced.
    Type: Application
    Filed: April 27, 2023
    Publication date: April 18, 2024
    Inventors: Chih-Wei WU, An-Jhih SU, Hua-Wei TSENG, Ying-Ching SHIH, Wen-Chih CHIOU, Chun-Wei CHEN, Ming Shih YEH, Wei-Cheng WU, Der-Chyang YEH
  • Publication number: 20240130257
    Abstract: Devices and method for forming a switch including a heater layer including a first heater pad, a second heater pad, and a heater line connecting the first heater pad and the second heater pad, a phase change material (PCM) layer positioned in a same vertical plane as the heater line, and a floating spreader layer including a first portion positioned in the same vertical plane as the heater line and the PCM layer, in which the first portion has a first width that is less than or equal to a distance between proximate sidewalls of the first heater pad and the second heater pad.
    Type: Application
    Filed: April 21, 2023
    Publication date: April 18, 2024
    Inventors: Fu-Hai LI, Yi Ching ONG, Hsin Heng WANG, Tsung-Hao YEH, Yu-Wei TING, Kuo-Pin CHANG, Hung-Ju LI, Kuo-Ching HUANG
  • Publication number: 20240118528
    Abstract: A microscope device for observing a sample. The microscope device and the sample are located on an optical route. The microscope device includes an objective lens unit and an additional light source set. The light source set includes a circuit substrate, a battery and a light-emitting unit. The circuit substrate has a power source portion and a light source portion electrically connected to the power source portion. A connecting member and the battery are arranged at opposite sides of the power source portion. The light-emitting unit is arranged on the light source portion, and the distance between the light-emitting unit and the center axis of the optical route is greater than the radius of the objective lens unit. The battery activates the light-emitting unit to generate a light beam, and the light beam irradiates toward the center axis of the optical route.
    Type: Application
    Filed: October 6, 2023
    Publication date: April 11, 2024
    Inventors: Chang-Ching YEH, Chang-Yu CHEN, Shu-Sheng LIN
  • Patent number: 11956469
    Abstract: Video processing methods and apparatuses implemented in a video encoding or decoding system with conditional secondary transform signaling. The video encoding system determines and applies a transform operation to residuals of a transform block to generate final transform coefficients, and adaptively signals a secondary transform index according to a position of a last significant coefficient in the transform block. A value of the secondary transform index is determined according to the transform operation.
    Type: Grant
    Filed: April 15, 2020
    Date of Patent: April 9, 2024
    Assignee: HFI INNOVATION INC.
    Inventors: Man-Shu Chiang, Chih-Wei Hsu, Tzu-Der Chuang, Ching-Yeh Chen
  • Patent number: 11956462
    Abstract: Video processing methods and apparatuses for coding a current block comprise receiving input data of a current block, partitioning the current block into multiple sub-blocks, deriving sub-block MVs for the current block according to a sub-block motion compensation coding tool, constraining the sub-block MVs to form constrained sub-block MVs, and encoding or decoding the current block using the constrained sub-block MVs, and applying motion compensation to the current block using the constrained sub-block MVs to encode or decode the current block. The sub-block MVs may be constrained according to a size, width, or height of the current block or a sub-block, an inter prediction direction of one of control point MVs of the current block, the current block, or current sub-block, the control point MVs, or a combination of the above.
    Type: Grant
    Filed: December 8, 2021
    Date of Patent: April 9, 2024
    Assignee: HFI INNOVATION INC.
    Inventors: Tzu-Der Chuang, Ching-Yeh Chen, Chen-Yen Lai, Chih-Wei Hsu