Patents by Inventor Ching-Yen Peng

Ching-Yen Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8742442
    Abstract: A method for patterning an epitaxial substrate includes: (a) forming an etch mask layer over an epitaxial substrate, and patterning the etch mask layer using a patterned cover mask layer to form the etch mask layer into a plurality of spaced apart mask patterns; and (b) etching the epitaxial substrate that is exposed from the mask patterns, and removing the mask patterns such that the epitaxial substrate is formed with a plurality of spaced apart substrate patterns.
    Type: Grant
    Filed: April 18, 2012
    Date of Patent: June 3, 2014
    Assignee: Sino-American Silicon Products Inc.
    Inventors: Cheng-Hung Wei, Bo-Wen Lin, Ching-Yen Peng, Hao-Chung Kuo, Wen-Ching Hsu
  • Publication number: 20120273821
    Abstract: A method for patterning an epitaxial substrate includes: (a) forming an etch mask layer over an epitaxial substrate, and patterning the etch mask layer using a patterned cover mask layer to form the etch mask layer into a plurality of spaced apart mask patterns; and (b) etching the epitaxial substrate that is exposed from the mask patterns, and removing the mask patterns such that the epitaxial substrate is formed with a plurality of spaced apart substrate patterns.
    Type: Application
    Filed: April 18, 2012
    Publication date: November 1, 2012
    Applicant: SINO-AMERICAN SILICON PRODCUTS INC.
    Inventors: Cheng-Hung Wei, Bo-Wen Lin, Ching-Yen Peng, Hao-Chung Kuo, Wen-Ching Hsu