Patents by Inventor Ching-Yi CHIU

Ching-Yi CHIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Aggregation of semiconductor devices and the method thereof
    Patent number: 9881907
    Abstract: An aggregation of semiconductor devices comprises a first layer, a second layer adhered to the first layer, and a plurality of semiconductor devices arranged between the first layer and the second layer to form a shape, wherein the shape comprises a curve and a mark, and the first layer is flexible.
    Type: Grant
    Filed: June 20, 2016
    Date of Patent: January 30, 2018
    Assignee: EPISTAR CORPORATION
    Inventors: Hsu-Cheng Lin, Pei-Shan Fang, Ching-Yi Chiu, Chun-Chang Chen
  • AGGREGATION OF SEMICONDUCTOR DEVICES AND THE METHOD THEREOF
    Publication number: 20160300822
    Abstract: An aggregation of semiconductor devices comprises a first layer, a second layer adhered to the first layer, and a plurality of semiconductor devices arranged between the first layer and the second layer to form a shape, wherein the shape comprises a curve and a mark, and the first layer is flexible.
    Type: Application
    Filed: June 20, 2016
    Publication date: October 13, 2016
    Inventors: Hsu-Cheng LIN, Pei-Shan FANG, Ching-Yi CHIU, Chun-Chang CHEN
  • Aggregation of semiconductor devices and the method thereof
    Patent number: 9397275
    Abstract: A method of manufacturing an aggregation of semiconductor devices comprising the steps of providing a first layer; sequentially addressing and adhering a plurality of semiconductor devices to the first layer to form a shape having a curve; providing a second layer; and adhering the second layer to the first layer.
    Type: Grant
    Filed: March 19, 2015
    Date of Patent: July 19, 2016
    Assignee: EPISTAR CORPORATION
    Inventors: Hsu-Cheng Lin, Ching-Yi Chiu, Pei-Shan Fang, Chun-Chang Chen
  • AGGREGATION OF SEMICONDUCTOR DEVICES AND THE METHOD THEREOF
    Publication number: 20150194581
    Abstract: A method of manufacturing an aggregation of semiconductor devices comprising the steps of providing a first layer; sequentially addressing and adhering a plurality of semiconductor devices to the first layer to form a shape having a curve; providing a second layer; and adhering the second layer to the first layer.
    Type: Application
    Filed: March 19, 2015
    Publication date: July 9, 2015
    Inventors: Hsu-Cheng LIN, Ching-Yi CHIU, Pei-Shan FANG, Chun-Chang CHEN
  • Aggregation of semiconductor devices and the method thereof
    Patent number: 9006756
    Abstract: An aggregation of semiconductor devices, comprising: a first layer comprising a first surface and a second surface; a second layer comprising a first region and a second region; and a plurality of semiconductor devices disposed between the first layer and the second region wherein a shape of the second region comprises a curve and a mark.
    Type: Grant
    Filed: June 5, 2013
    Date of Patent: April 14, 2015
    Assignee: Epistar Corporation
    Inventors: Hsu-Cheng Lin, Ching-Yi Chiu, Pei-Shan Fang, Chun-Chang Chen
  • AGGREGATION OF SEMICONDUCTOR DEVICES AND THE METHOD THEREOF
    Publication number: 20140027790
    Abstract: An aggregation of semiconductor devices, comprising: a first layer comprising a first surface and a second surface; a second layer comprising a first region and a second region; and a plurality of semiconductor devices disposed between the first layer and the second region wherein a shape of the second region comprises a curve and a mark.
    Type: Application
    Filed: June 5, 2013
    Publication date: January 30, 2014
    Inventors: Hsu-Cheng LIN, Ching-Yi CHIU, Pei-Shan FANG, Chun-Chang CHEN