Patents by Inventor Ching-Yi Hu

Ching-Yi Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of affixing a heat sink to a substrate and package thereof
    Patent number: 6677185
    Abstract: A method of affixing a heat sink to a substrate and package thereof having a substrate with a position for receiving a semiconductor chip, at least a semiconductor chip for affixing on the position and electrically connecting the substrate, an appropriate thickness of adhesive agent by scraping by means of screen printing technology, a heat sink for covering the semiconductor chip and provided with a plurality of dimples for affixing to the substrate, the method including steps of affixing the semiconductor to the substrate and utilizing a scraper to apply a layer of adhesive agent with an appropriate thickness of adhesive on a platform from the adhesive agent; utilizing a sucker to move the heat sink to a position above the layer of adhesive agent, and dipping the dimples of the heat sink into the adhesive layer so as to adhere some adhesive agent onto the dimples, and then moving the heat sink above the semiconductor chip; affixing the heat sink to the substrate to cover the semiconductor chip; and enclosin
    Type: Grant
    Filed: June 3, 2002
    Date of Patent: January 13, 2004
    Assignee: Orient Semiconductor Electronics Limited
    Inventors: Hung Chin, Ching-Yi Hu
  • Method of affixing a heat sink to a substrate and package thereof
    Publication number: 20030100147
    Abstract: A method of affixing a heat sink to a substrate and package thereof having a substrate with a position for receiving a semiconductor chip, at least a semiconductor chip for affixing on the position and electrically connecting the substrate, an appropriate thickness of adhesive agent by scraping by means of screen printing technology, a heat sink for covering the semiconductor chip and provided with a plurality of dimples for affixing to the substrate, the method comprising steps of affixing the semiconductor to the substrate and utilizing a scraper to apply a layer of adhesive agent with an appropriate thickness of adhesive on a platform from the adhesive agent; utilizing a sucker to move the heat sink to a position above the layer of adhesive agent, and dipping the dimples of the heat sink into the adhesive layer so as to adhere some adhesive agent onto the dimples, and then moving the heat sink above the semiconductor chip; affixing the heat sink to the substrate to cover the semiconductor chip; and enclosi
    Type: Application
    Filed: June 3, 2002
    Publication date: May 29, 2003
    Inventors: Hung Chin, Ching-Yi Hu