Patents by Inventor Ching-Yi Kuo

Ching-Yi Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200294944
    Abstract: A package structure includes a semiconductor device, a molding compound, a first dielectric layer, and a through-via. The molding compound is in contact with a sidewall of the semiconductor device. The first dielectric layer is over the molding compound and the semiconductor device. The through-via is in the molding compound and the first dielectric layer. The through-via is a continuous element and in contact with the first dielectric layer.
    Type: Application
    Filed: May 31, 2020
    Publication date: September 17, 2020
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Hsuan TAI, Ting-Ting KUO, Yu-Chih HUANG, Chih-Wei LIN, Hsiu-Jen LIN, Chih-Hua CHEN, Ming-Da CHENG, Ching-Hua HSIEH, Hao-Yi TSAI, Chung-Shi LIU
  • Publication number: 20200292438
    Abstract: A particle detecting device is provided. The particle detecting device includes a base, a detecting element, a micro pump and a drive control board. The base includes a detecting channel, a beam channel and a light trapping region. The detecting element includes a microprocessor, a particle sensor and a laser transmitter. The particle sensor is disposed at an orthogonal position where the detecting channel intersects the beam channel. When the micro pump, the particle sensor and the laser transmitter are enabled under the control of the microprocessor, the gas outside the detecting channel is inhaled into the detecting channel. When the gas flows to the orthogonal position where the detecting channel intersects the beam channel, the gas is irradiated by the projecting light source from the laser transmitter, and projecting light spots generated are projected on the particle sensor for detecting the size and the concentration of suspended particles.
    Type: Application
    Filed: March 11, 2020
    Publication date: September 17, 2020
    Applicant: Microjet Technology Co., Ltd.
    Inventors: Hao-Jan Mou, Chin-Chuan Wu, Chih-Kai Chen, Ching-Sung Lin, Chi-Feng Huang, Yung-Lung Han, Chun-Yi Kuo
  • Patent number: 10775276
    Abstract: A portable gas detecting device includes at least one detecting chamber, at least one gas sensor and at least one actuator. The gas sensor is disposed in the detecting chamber and configured for monitoring gas inside the detecting chamber. The actuator is disposed in the detecting chamber and includes a piezoelectric actuator. When an actuating signal is applied to the piezoelectric actuator and the piezoelectric actuator generates a resonance effect, the gas outside the detecting chamber is introduced into the detecting chamber for sampling. The actuator is driven by an instantaneous sampling pulse to control a trace of gas to flow into the detecting chamber for forming a stable airflow environment. In the stable airflow environment, a gas molecule is dissolved in or bonded to a reaction material on a surface of the gas sensor for reacting.
    Type: Grant
    Filed: May 8, 2019
    Date of Patent: September 15, 2020
    Assignee: MICROJET TECHNOLOGY CO., LTD.
    Inventors: Hao-Jan Mou, Shih-Chang Chen, Chiu-Lin Lee, Ching-Sung Lin, Chi-Feng Huang, Yung-Lung Han, Chun-Yi Kuo
  • Publication number: 20200284875
    Abstract: A vehicle radar detection angle adjustment system and angularly adjustable radar thereof are provided. The system comprises a transmission unit, a processing unit, and a receiving unit. The transmission unit generates a radar beam according to an operation frequency. The processing unit, by the adjustment of the operation frequency, changes a dip angle of the transmission of the radar beam from the transmission unit, and generates a feedback signal after receiving the radar beam through the receiving unit. The processing unit is electrically connected with the receiving unit for receiving the feedback signal, so as to compare the beam frequency of the received feedback signal, and select an operation frequency corresponding to the radar beam having the predetermined energy. Therefore, the radar beam is launched at an optimal angle.
    Type: Application
    Filed: June 12, 2019
    Publication date: September 10, 2020
    Inventors: SAN-CHUAN YU, SHYH-JONG CHUNG, CHING-HAN TSAI, CHUAN-TING KUO, BO-YI WANG, TZU-CHUAN HUANG
  • Publication number: 20200268999
    Abstract: The present invention discloses a respiratory mask to connect a user and a breathing tube for receiving a first gas and releasing a second gas, so as to provide an user's respiratory system to exchange gas. It comprises a main part, an air chamber exchange part, an insert and a clamping part. The main part provides a first, second, and third openings that are communicated each other. The first opening connects to the breathing tube to receive the first gas from the breathing tube. The air chamber exchange part provides an exhaust assembly to relieve pressure according to an internal air pressure of the air chamber exchange part. The insert connects to the user's nose so as to direct the first gas to the user or direct the second gas from the user to the air chamber exchange part. The clamping part connects to the user's mouth.
    Type: Application
    Filed: January 29, 2020
    Publication date: August 27, 2020
    Inventors: Wen-Han CHANG, Shih-Yi LEE, Ren-Jei CHUNG, Ching-Yu KUO
  • Publication number: 20200247101
    Abstract: A method for preparing a bifunctional film, including: (a) drying a first polymer solution to form a film to form an anti-adhesion layer; and (b) drying a second polymer solution over the anti-adhesion layer to form a film to form an attachment layer. The first polymer solution includes a first hydrophobic solution and a first hydrophilic solution, and in the first polymer solution, the weight ratio of the solute of the first hydrophobic solution to the solute of the first hydrophilic solution 1:0.01-1. Moreover, the second polymer solution consists of a second hydrophilic solution.
    Type: Application
    Filed: November 6, 2019
    Publication date: August 6, 2020
    Applicant: Industrial Technology Research Institute
    Inventors: Hsin-Hsin SHEN, Yu-Chi WANG, Ming-Chia YANG, Yu-Bing LIOU, Wei-Hong CHANG, Yun-Han LIN, Hsin-Yi HSU, Yun-Chung TENG, Chia-Jung LU, Yi-Hsuan LEE, Jian-Wei LIN, Kun-Mao KUO, Ching-Mei CHEN
  • Patent number: 10734328
    Abstract: A semiconductor package includes a first redistribution structure, a semiconductor die disposed on the first redistribution structure, a die attach material disposed between the first redistribution structure and the semiconductor die, and an insulating encapsulant disposed on the first redistribution structure. A first shortest distance from a midpoint of a bottom edge of the semiconductor die to a midpoint of an bottom edge of an extruded region of the die attach material in a width direction of the semiconductor die is greater than a second shortest distance between an endpoint of the bottom edge of the semiconductor die to an endpoint of the bottom edge of the extruded region of the die attach material. The insulating encapsulant encapsulates the semiconductor die and the die attach material. An inclined interface is between the insulating encapsulant and the extruded region of the die attach material.
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: August 4, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Po-Yuan Teng, Hao-Yi Tsai, Tin-Hao Kuo, Ching-Yao Lin, Teng-Yuan Lo, Chih Wang
  • Patent number: 10672729
    Abstract: A method of forming a package structure includes disposing a semiconductor device over a first dielectric layer, wherein a first redistribution line is in the first dielectric layer, forming a molding compound over the first dielectric layer and in contact with a sidewall of the semiconductor device, forming a second dielectric layer over the molding compound and the semiconductor device, forming a first opening in the second dielectric layer, the molding compound, and the first dielectric layer to expose the first redistribution line, and forming a first conductor in the first opening, wherein the first conductor is electrically connected to the first redistribution line.
    Type: Grant
    Filed: October 5, 2017
    Date of Patent: June 2, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Chih-Wei Lin, Hsiu-Jen Lin, Chih-Hua Chen, Ming-Da Cheng, Ching-Hua Hsieh, Hao-Yi Tsai, Chung-Shi Liu
  • Publication number: 20200167924
    Abstract: A method, an apparatus and a system for cell detection are provided. In the apparatus, a hyperspectrum module is used to capture information across electromagnetic spectrums from an image, a stereo camera module is used to capture three-dimensional image information, and the hyperspectrum module and the stereo camera module form a trinocular micro spectrometer. A microscopic optical module is provided for the two modules to form hyperspectrum and three-dimensional image information from a cell and its split cells via a lens. In the method, a series of continuous images are obtained within a time period. An observation image array with a plurality of observation image zones are provided to retrieve coordinates of a plurality of feature points at different times. Finally, a holistic cellular activity can be obtained by analyzing continuous hyperspectrum and 3D image information from the images over time.
    Type: Application
    Filed: November 14, 2019
    Publication date: May 28, 2020
    Inventors: WEI-CHUNG WANG, YUNG-HSIANG CHEN, CHUAN-YI TANG, CHING-HUAN KUO
  • Publication number: 20200129122
    Abstract: A wearable health monitoring includes a monitoring main-body, a wearable component and a biometric monitoring module. The wearable component is connected with the monitoring main-body. The biometric monitoring module is disposed within the monitoring main-body and includes a photoelectric sensor, a pressure sensor and an air-pressure-based blood pressure meter. The air-pressure-based blood pressure meter is embedded and positioned in the embedding slot portion of the embedding seat, and includes a gas-collecting actuator and an elastic air-bag. The gas-collecting actuator transports a gas to the elastic air-bag, and the elastic air-bag is inflated and elastically protrudes to attach to a skin tissue of a wearing user. The pressure sensor measures vasoconstriction pulsation under the skin tissue. A detection signal is generated and converted into health data information, which is outputted to the photoelectric sensor for calibrating a calculation of detection thereof to output precise health data information.
    Type: Application
    Filed: October 17, 2019
    Publication date: April 30, 2020
    Applicant: Microjet Technology Co., Ltd.
    Inventors: Hao-Jan Mou, Ching-Sung Lin, Chi-Feng Huang, Yung-Lung Han, Chun-Yi Kuo
  • Publication number: 20200118945
    Abstract: A semiconductor package includes a first redistribution structure, a semiconductor die disposed on the first redistribution structure, a die attach material disposed between the first redistribution structure and the semiconductor die, and an insulating encapsulant disposed on the first redistribution structure. A first shortest distance from a midpoint of a bottom edge of the semiconductor die to a midpoint of an bottom edge of an extruded region of the die attach material in a width direction of the semiconductor die is greater than a second shortest distance between an endpoint of the bottom edge of the semiconductor die to an endpoint of the bottom edge of the extruded region of the die attach material. The insulating encapsulant encapsulates the semiconductor die and the die attach material. An inclined interface is between the insulating encapsulant and the extruded region of the die attach material.
    Type: Application
    Filed: December 16, 2019
    Publication date: April 16, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Po-Yuan Teng, Hao-Yi Tsai, Tin-Hao Kuo, Ching-Yao Lin, Teng-Yuan Lo, Chih Wang
  • Publication number: 20200091091
    Abstract: A manufacturing method of a semiconductor package includes at least the following steps. A dielectric layer is formed on a conductive pattern and in a space between the conductive pattern, where a concave area of the dielectric layer is formed corresponding to the space between the conductive pattern. A semiconductor die is disposed on the concave area of the dielectric layer with a die attach material interposed therebetween. A pressure is applied to the die attach material so that the concave area of the dielectric layer is filled with the die attach material, and a portion of the die attach material is extruded from the concave area to expand wider than an area of the semiconductor die. An insulating encapsulant is formed on the dielectric layer to cover the semiconductor die. Other methods for forming a semiconductor package are also provided.
    Type: Application
    Filed: November 21, 2019
    Publication date: March 19, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Po-Yuan Teng, Hao-Yi Tsai, Tin-Hao Kuo, Ching-Yao Lin, Teng-Yuan Lo, Chih Wang
  • Patent number: 10581179
    Abstract: A symmetric leaky wave antenna includes a dielectric substrate, an electric wall, and two reflection bore arrays. The dielectric substrate has a first and a second metal layers disposed on two opposite faces thereof. The first metal layer has a feed end and two travelling wave sides. The electric wall is disposed between two travelling wave sides, with the two travelling wave sides symmetrically disposed with respect to the electric wall. The two reflection bore arrays are symmetrically disposed along the two travelling wave sides, respectively, with the electric wall arranged at a central line between the two reflection bore arrays. The two reflection bore arrays pass through the first metal layer, the second metal layer, and the dielectric substrate. The reflection bore array and the electric wall reduce the leakage rate of the electromagnetic wave, thus increasing the gain value of the antenna.
    Type: Grant
    Filed: July 23, 2018
    Date of Patent: March 3, 2020
    Assignee: CUBTEK INC.
    Inventors: San-Chuan Yu, Shyh-Jong Chung, Ching-Han Tsai, Chuan-Ting Kuo, Bo-Yi Wang, Tzu-Chuan Huang
  • Patent number: 10530080
    Abstract: An electronic device includes a ground element, a conductive assembly, a circuit board, an insulating element and a conductive element. The conductive assembly includes a base and a screw element. The base is disposed at the ground element and contacts the ground element. The screw element has a fixing portion and a clamping portion connected to the fixing portion. The outer diameter of the clamping portion is larger than the outer diameter of the fixing portion, and the fixing portion is fixed to the base. The circuit board is disposed between the base and the clamping portion of the screw element. The insulating element is disposed between part of the clamping portion and the circuit board. The conductive element is disposed at the circuit board and contacts the conductive assembly. The circuit board is electrically connected to the ground element through the conductive element and the conductive assembly.
    Type: Grant
    Filed: July 12, 2018
    Date of Patent: January 7, 2020
    Assignee: PEGATRON CORPORATION
    Inventors: Yu-Ti Kuo, Yen-Hsing Chu, Chien-Yi Lee, Ching-Jen Wang
  • Patent number: 10510686
    Abstract: A semiconductor package and a manufacturing method thereof are provided with the following steps, attaching a rear surface of a semiconductor die on a first redistribution structure by a die attach material, wherein the semiconductor die is pressed so that the die attach material is extruded laterally out and climbs upwardly to cover a sidewall of the semiconductor die, and after attaching, the die attach material comprises an extruded region surrounding the semiconductor die, a first shortest distance from a midpoint of an bottom edge of semiconductor die to a midpoint of an bottom edge of extruded region in a width direction is greater than a second shortest distance between an endpoint of the bottom edge of semiconductor die to an endpoint of the bottom edge of extruded region; and forming an insulating encapsulant on the first redistribution structure to encapsulate the semiconductor die and the die attach material.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: December 17, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Po-Yuan Teng, Hao-Yi Tsai, Tin-Hao Kuo, Ching-Yao Lin, Teng-Yuan Lo, Chih Wang
  • Publication number: 20190376877
    Abstract: A portable gas detecting device includes at least one detecting chamber, at least one gas sensor and at least one actuator. The gas sensor is disposed in the detecting chamber and configured for monitoring gas inside the detecting chamber. The actuator is disposed in the detecting chamber and includes a piezoelectric actuator. When an actuating signal is applied to the piezoelectric actuator and the piezoelectric actuator generates a resonance effect, the gas outside the detecting chamber is introduced into the detecting chamber for sampling. The actuator is driven by an instantaneous sampling pulse to control a trace of gas to flow into the detecting chamber for forming a stable airflow environment. In the stable airflow environment, a gas molecule is dissolved in or bonded to a reaction material on a surface of the gas sensor for reacting.
    Type: Application
    Filed: May 8, 2019
    Publication date: December 12, 2019
    Applicant: Microjet Technology Co., Ltd.
    Inventors: Hao-Jan MOU, Shih-Chang CHEN, Chiu-Lin LEE, Ching-Sung LIN, Chi-Feng HUANG, Yung-Lung HAN, Chun-Yi KUO
  • Publication number: 20190341523
    Abstract: A light-emitting element having a light-emitting unit, a transparent layer and a wavelength conversion layer formed on the transparent layer. The transparent layer covers the light-emitting unit. The wavelength conversion layer includes a phosphor layer having a phosphor and a stress release layer without the phosphor.
    Type: Application
    Filed: July 17, 2019
    Publication date: November 7, 2019
    Inventors: Ching-Tai CHENG, Ju-Lien KUO, Min-Hsun HSIEH, Shau-Yi CHEN, Shih-An LIAO, Jhih-Hao CHEN
  • Publication number: 20190334251
    Abstract: A symmetric leaky wave antenna includes a dielectric substrate, an electric wall, and two reflection bore arrays. The dielectric substrate has a first and a second metal layers disposed on two opposite faces thereof. The first metal layer has a feed end and two travelling wave sides. The electric wall is disposed between two travelling wave sides, with the two travelling wave sides symmetrically disposed with respect to the electric wall. The two reflection bore arrays are symmetrically disposed along the two travelling wave sides, respectively, with the electric wall arranged at a central line between the two reflection bore arrays. The two reflection bore arrays pass through the first metal layer, the second metal layer, and the dielectric substrate. The reflection bore array and the electric wall reduce the leakage rate of the electromagnetic wave, thus increasing the gain value of the antenna.
    Type: Application
    Filed: July 23, 2018
    Publication date: October 31, 2019
    Inventors: SAN-CHUAN YU, SHYH-JONG CHUNG, CHING-HAN TSAI, CHUAN-TING KUO, BO-YI WANG, TZU-CHUAN HUANG
  • Publication number: 20190333869
    Abstract: A semiconductor package and a manufacturing method thereof are provided with the following steps, attaching a rear surface of a semiconductor die on a first redistribution structure by a die attach material, wherein the semiconductor die is pressed so that the die attach material is extruded laterally out and climbs upwardly to cover a sidewall of the semiconductor die, and after attaching, the die attach material comprises an extruded region surrounding the semiconductor die, a first shortest distance from a midpoint of an bottom edge of semiconductor die to a midpoint of an bottom edge of extruded region in a width direction is greater than a second shortest distance between an endpoint of the bottom edge of semiconductor die to an endpoint of the bottom edge of extruded region; and forming an insulating encapsulant on the first redistribution structure to encapsulate the semiconductor die and the die attach material.
    Type: Application
    Filed: April 27, 2018
    Publication date: October 31, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Po-Yuan Teng, Hao-Yi Tsai, Tin-Hao Kuo, Ching-Yao Lin, Teng-Yuan Lo, Chih Wang
  • Publication number: 20190312963
    Abstract: An internet phone system includes an internet phone main body, an expansion device and a multiple-layer connecting card. The internet phone main body includes a first connecting port. The at least one expansion device includes a second connecting port. One end of the multiple-layer connecting card is connected to the first connecting port, and the other end is connected to the second connecting port such that the internet phone main body can be electrically connected to the expansion device via the multiple-layer connecting card. The expansion device is capable of combining with another expansion device by another multiple-layer connecting card.
    Type: Application
    Filed: June 24, 2019
    Publication date: October 10, 2019
    Inventors: Yu-Ti KUO, Wen-Hsieh HSIEH, Chao-Tang CHIU, Chien-Yi LEE, Hsiao-Wen LEE, Ching-Jen WANG