Patents by Inventor Ching-Yi Liu

Ching-Yi Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10680120
    Abstract: A semiconductor device includes a substrate, a well region formed in the substrate, first and second isolation regions formed in the substrate, a dielectric layer formed on the well region, a conductive layer formed on the dielectric layer, a first doped region, an insulating layer, and first and second contact vias. The dielectric layer is disposed between the first and second isolation regions. The first doped region is formed in the well region. The insulating layer is formed on the dielectric layer, the first and second isolation regions, and the first doped region. The first contact via is formed in the insulating layer and electrically connected to the conductive layer. The first contact via is disposed on an overlapping area between the dielectric layer and the conductive layer. The second contact via is formed in the insulating layer and electrically connected to the doped region.
    Type: Grant
    Filed: April 5, 2018
    Date of Patent: June 9, 2020
    Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION
    Inventors: Ching-Yi Hsu, Shih-Hao Liu, Wu-Hsi Lu, Yun-Chou Wei, Chih-Cherng Liao
  • Patent number: 10672729
    Abstract: A method of forming a package structure includes disposing a semiconductor device over a first dielectric layer, wherein a first redistribution line is in the first dielectric layer, forming a molding compound over the first dielectric layer and in contact with a sidewall of the semiconductor device, forming a second dielectric layer over the molding compound and the semiconductor device, forming a first opening in the second dielectric layer, the molding compound, and the first dielectric layer to expose the first redistribution line, and forming a first conductor in the first opening, wherein the first conductor is electrically connected to the first redistribution line.
    Type: Grant
    Filed: October 5, 2017
    Date of Patent: June 2, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Chih-Wei Lin, Hsiu-Jen Lin, Chih-Hua Chen, Ming-Da Cheng, Ching-Hua Hsieh, Hao-Yi Tsai, Chung-Shi Liu
  • Patent number: 10657303
    Abstract: This invention discloses a circuit encoding method and a circuit structure recognition method. The circuit encoding method is applied to a circuit structure recognition process of a circuit. The circuit is coupled to a voltage source and a reference voltage. The circuit encoding method includes: selecting a target transistor from the circuit; when a terminal of the target transistor is electrically connected to the voltage source or the reference voltage, adding a first value to a terminal value of the terminal; when the terminal of the target transistor is electrically connected to a terminal other than the voltage source and the reference voltage, adding a second value to the terminal value of the terminal; and taking a set of multiple terminal values of the target transistor as a transistor signature of the target transistor.
    Type: Grant
    Filed: March 22, 2018
    Date of Patent: May 19, 2020
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Yun-Jing Lin, Meng-Jung Lee, Yu-Lan Lo, Shu-Yi Kao, Chien-Nan Liu, Yu-Kang Lou, Ching-Ho Lin
  • Publication number: 20200082780
    Abstract: A display system and a method for forming an output buffer of a source driver are provided. The display system includes a plurality of pixels coupled to a plurality of gate lines and a plurality of source lines. A gate driver provides a plurality of gate signals to the plurality of gate lines. A source driver provides a plurality of image signals to the plurality of source lines. The source driver includes an output buffer. The output buffer includes a transistor. The transistor is either a native transistor device, a depletion-mode transistor device or a low-threshold transistor device.
    Type: Application
    Filed: November 12, 2019
    Publication date: March 12, 2020
    Applicant: Vanguard International Semiconductor Corporation
    Inventors: Yu-Lung CHIN, Ching-Yi HSU, Chang-He LIU, Chih-Cherng LIAO, Jun-Wei CHEN, Leuh FANG
  • Publication number: 20200070005
    Abstract: A muscle training equipment configured to train at least one target muscle of human body and including frame, at least one vibration detector, and at least one resistance adjustment assembly. The at least one vibration detector is configured to be disposed on the at least one target muscle so as to produce at least one muscle vibration signal based on the activity of the at least one target muscle. The at least one resistance adjustment assembly includes motor, handle and linkage assembly. The motor is disposed on the frame and has resistance-adjustable shaft. An end of the linkage assembly is fixed to the resistance-adjustable shaft, and another end of the linkage assembly is pivotally connected to the handle. The at least one resistance adjustment assembly is configured to adjust a resistance force applied on the resistance-adjustable shaft according to the at least one muscle vibration signal.
    Type: Application
    Filed: August 16, 2019
    Publication date: March 5, 2020
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Tsung-Chi LIN, Jyun-Liang PAN, Kai-Jen PAI, Zhong-We LIAO, Yen-Chung CHANG, Szu-Han TZAO, Ching Yi LIU
  • Publication number: 20200075488
    Abstract: A method includes forming a device structure, the method including forming a first redistribution structure over and electrically connected to a semiconductor device, forming a molding material surrounding the first redistribution structure and the semiconductor device, forming a second redistribution structure over the molding material and the first redistribution structure, the second redistribution structure electrically connected to the first redistribution structure, attaching an interconnect structure to the second redistribution structure, the interconnect structure including a core substrate, the interconnect structure electrically connected to the second redistribution structure, forming an underfill material on sidewalls of the interconnect structure and between the second redistribution structure and the interconnect structure.
    Type: Application
    Filed: May 14, 2019
    Publication date: March 5, 2020
    Inventors: Jiun Yi Wu, Ching-Hua Hsieh, Chen-Hua Yu, Chung-Shi Liu, Shou-Yi Wang, Chien-Hsun Chen
  • Patent number: 10556353
    Abstract: A robot arm control device includes a pressure sensing module, a workspace defining module and a control module. The pressure sensing module, arranged on a robot arm, detects whether an object hits or touches the robot arm to switch the operating mode of the robot arm. The workspace defining module includes a sensing region arranged on a peripheral area around the robot arm. The workspace defining module determines whether the object enters an operating space according to the position of the object in the sensing region, and sets the working range and the working mode of the robot arm according to which operating space the object has entered. The control module, connected to the robot arm, the pressure sensing module and the workspace defining module, switches the operating mode and outputs a motor driving signal to the robot arm according to the working mode of the robot arm.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: February 11, 2020
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jui-Yiao Su, Yan-Chen Liu, Chang-Yi Chen, Ching-Shun Chen, Wen-Ching Ko, Hung-Hsiu Yu, Jwu-Sheng Hu
  • Publication number: 20200020751
    Abstract: A display panel includes a pixel structure corresponding to a display area, and a receiver antenna structure disposed on the pixel structure. The receiver antenna structure includes multiple receiver antennas providing first signals to the pixels of the pixel structure. Each receiver antenna corresponds to at least one pixel, and has an induced decibel (dB). For each receiver antenna, the induced dB is determined by multiple parameters of the receiver antenna, such as a winding number of the receiver antenna; an outer diameter of the receiver antenna; an inner diameter of the receiver antenna; a line pitch of the receiver antenna; a line width of the receiver antenna; and a line thickness of the receiver antenna. The induced dB of at least one of the receiver antennas is greater than the induced dB of other receiver antennas. The display panel may be used in a tiled micro LED display apparatus.
    Type: Application
    Filed: February 21, 2019
    Publication date: January 16, 2020
    Inventors: Wei-Min Cho, Yu-Sheng Huang, Pin-Miao Liu, Ching-Yi Hsu
  • Publication number: 20190383990
    Abstract: A quantum dot composite material and a manufacturing method and an application thereof are provided. The quantum dot composite material includes an all-inorganic perovskite quantum dot and a modification protection on a surface of the all-inorganic perovskite quantum dot. The all-inorganic perovskite quantum dot has a chemical formula of CsPb(ClaBr1-a-bIb)3, wherein 0?a?1, 0?b?1.
    Type: Application
    Filed: August 23, 2019
    Publication date: December 19, 2019
    Inventors: Hung-Chia Wang, Xue-Jie Zhang, Shin-Ying Lin, An-Cih Tang, Ru-Shi Liu, Tzong-Liang Tsai, Yu-Chun Lee, Ching-Yi Chen, Hung-Chun Tong
  • Publication number: 20190312154
    Abstract: A semiconductor device includes a substrate, a well region formed in the substrate, first and second isolation regions formed in the substrate, a dielectric layer formed on the well region, a conductive layer formed on the dielectric layer, a first doped region, an insulating layer, and first and second contact vias. The dielectric layer is disposed between the first and second isolation regions. The first doped region is formed in the well region. The insulating layer is formed on the dielectric layer, the first and second isolation regions, and the first doped region. The first contact via is formed in the insulating layer and electrically connected to the conductive layer. The first contact via is disposed on an overlapping area between the dielectric layer and the conductive layer. The second contact via is formed in the insulating layer and electrically connected to the doped region.
    Type: Application
    Filed: April 5, 2018
    Publication date: October 10, 2019
    Applicant: Vanguard International Semiconductor Corporation
    Inventors: Ching-Yi HSU, Shih-Hao LIU, Wu-Hsi LU, Yun-Chou WEI, Chih-Cherng LIAO
  • Patent number: 10436973
    Abstract: A quantum dot composite material and a manufacturing method and an application thereof are provided. The quantum dot composite material includes an all-inorganic perovskite quantum dot and a modification protection on a surface of the all-inorganic perovskite quantum dot. The all-inorganic perovskite quantum dot has a chemical formula of CsPb(ClaBr1-a-bIb)3, wherein 0?a?1, 0?b?1.
    Type: Grant
    Filed: November 28, 2016
    Date of Patent: October 8, 2019
    Assignee: LEXTAR ELECTRONICS CORPORATION
    Inventors: Hung-Chia Wang, Xue-Jie Zhang, Shin-Ying Lin, An-Cih Tang, Ru-Shi Liu, Tzong-Liang Tsai, Yu-Chun Lee, Ching-Yi Chen, Hung-Chun Tong
  • Patent number: 10433368
    Abstract: A communications apparatus includes a radio transceiver and a processor. The radio transceiver is configured for transmitting or receiving wireless radio frequency signals to or from a peer device. The processor determines whether re-synchronization in a communication mode with the peer device is required according to a determination rule. When the re-synchronization is required, the processor transmits a message to the peer device via the radio transceiver to trigger a re-synchronization procedure. The processor determines whether the re-synchronization is required in a connected mode.
    Type: Grant
    Filed: November 18, 2015
    Date of Patent: October 1, 2019
    Assignee: MEDIATEK INC.
    Inventors: Shih-Hsin Chien, Chi-Chen Lee, Wen-Jiunn Liu, Ching-Yueh Kao, Shih-Chieh Liao, Yu-Tien Yeh, Sian-Jheng Wong, Tien-Yi Huang
  • Publication number: 20190273145
    Abstract: Certain embodiments of a semiconductor device and a method of forming a semiconductor device comprise forming a high-k gate dielectric layer over a short channel semiconductor fin. A work function metal layer is formed over the high-k gate dielectric layer. A seamless metal fill layer is conformally formed over the work function metal layer.
    Type: Application
    Filed: March 1, 2018
    Publication date: September 5, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shih-Hang CHIU, Chung-Chiang WU, Ching-Hwanq SU, Da-Yuan LEE, Ji-Cheng CHEN, Kuan-Ting LIU, Tai-Wei HWANG, Chung-Yi SU
  • Patent number: 10351766
    Abstract: The present disclosure provides a method for fabricating a phosphor. A first solution is formed by dissolving potassium hexafluorogermanate (K2GeF6) and either K2MnF6 or KMnO4 in a hydrofluoric acid solution. An anhydrous ethanol is added to the first solution to make a total concentration of fluoride ions of potassium hexafluorogermanate (K2GeF6), hydrofluoric acid, and either K2MnF6 or KMnO4 equal to or less than 48M to form a precipitate. Afterward, the precipitate is collected.
    Type: Grant
    Filed: November 29, 2016
    Date of Patent: July 16, 2019
    Assignee: Lextar Electronics Corporation
    Inventors: Wen-Li Zhou, Wei-Lun Wu, Ru-Shi Liu, Yu-Chun Lee, Ching-Yi Chen, Tzong-Liang Tsai
  • Publication number: 20190174351
    Abstract: A data unit processing method performed by a first communication device, comprising: configuring a data unit by the first communication device, the data unit comprising: a specific format preamble following a first packet format; and a symbol part, comprising at least one symbol and following a Wi-Fi long range packet format. The specific format preamble can be decoded according to a first communication standard and the symbol can be decoded according to a Wi-Fi long range mode. The symbol part can be identified according to the specific format preamble. A method can decode the above-mentioned data unit and a communication device can perform the methods are also disclosed.
    Type: Application
    Filed: November 30, 2018
    Publication date: June 6, 2019
    Inventors: Wei-Ping Chuang, Hsuan-Yu Liu, Hung-Tao Hsieh, Wen-Hsien Chiu, Ching-Chia Cheng, Hsin-Yi Lee
  • Publication number: 20180207901
    Abstract: The present invention provides a heat spreading structure comprising a first conductive layer and a composite layer that sequentially comprises a structured adhesive layer and a second conductive layer having a coating on the first conductive layer, wherein the structured adhesive layer comprises at least one polymeric region and at least one void region. The composite layer further has a grounding opening exposing a part of the first conductive layer for grounding purposes. The present invention also provides a heat spreading tape and a method for forming the same.
    Type: Application
    Filed: July 20, 2015
    Publication date: July 26, 2018
    Inventors: Pei Tien, Chao-Yuan Wang, Ching-Yi Liu
  • Publication number: 20160120068
    Abstract: The present invention provides a heat spreading tape including at least one heat spreading layer adapted for heat dissipation and at least one heat insulating layer adhesively attached to the heat spreading layer. Void regions are formed in the at least one heat insulating layer and are adapted for acting as heat transfer barriers in a direction perpendicular to the major surfaces of the heat spreading tape, i.e. the thickness tape.
    Type: Application
    Filed: May 12, 2014
    Publication date: April 28, 2016
    Inventors: Pei Tien, Mihee Lee, Chao-Yuan Wang, Han-Yi Chung, Ching-Yi Liu, Kuo-Chung Lin, Wei-Yu Chen
  • Patent number: 8315552
    Abstract: A body interactively learning method is disclosed, which comprises the steps of: turning on the power of a body interactively learning apparatus while selecting an operation mode for the same; attaching a motion sensor of the body interactively learning apparatus onto body of a user; using the motion sensor to detect vibrations of the body and consequently sending the detected vibration signals to a processing unit; enabling the processing unit to perform an evaluation for determining whether the vibration signals are valid.
    Type: Grant
    Filed: February 15, 2008
    Date of Patent: November 20, 2012
    Assignees: Industrial Technology Research Institute
    Inventors: Hung-Hsiu Yu, Ching-Yi Liu, Wei-Han Wang, Chiu-Sheng Tseng
  • Publication number: 20120264095
    Abstract: An emotion abreaction device including a body, a control unit, a man machine interacting module and an emotion abreaction unit is provided. The control unit, the man machine interacting module and the emotion abreaction unit are disposed in the body. The man machine interacting module is electrically connected to the control unit for the user to select an emotion abreaction mode. The emotion abreaction unit is electrically connected to the control unit and has at least one sensor to measure force and/or volume for the user to abreact by knocking and/or yelling. Moreover, a using method of an emotion abreaction device includes turning on the emotion abreaction device, and then, responding to the user with a voice and/or an image according to the sensing result of the magnitude of the volume and/or the force after the user knocks and/or yells to an emotion abreaction unit of the emotion abreaction device.
    Type: Application
    Filed: June 25, 2012
    Publication date: October 18, 2012
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Hung-Hsiu Yu, Yi-Yi Yu, Ching-Yi Liu, Kuo-Feng Hung
  • Patent number: 8122093
    Abstract: An instant messaging interaction system and method work by: analyzing communicative information sent by a remote user to create emotional messages and analyzing information about the remote user's identity; storage in a storage module behavior weight value preset and corresponding to the information about the remote user's identity; determining, by a learning module, interactive responses according to the emotional messages and the behavior weight values; outputting, by an output module, the interactive responses; detecting if receiving a feedback signal from an local user; if the feedback signal is not received, the learning module stores the behavior weight value in the storage module; if the feedback signal is received, the feedback module generates a modification value corresponding to different levels of the feedback signal; generating, by the learning module and according to a detection result, modification values for modifying the behavior weight values.
    Type: Grant
    Filed: July 17, 2009
    Date of Patent: February 21, 2012
    Assignee: Industrial Technology Research Institute
    Inventors: Hung-Hsiu Yu, Hsin-Yi Lin, Hsuan-Kuan Huang, Ching-Yi Kuo, Ching-Yi Liu