Abstract: A power diode device includes a substrate. The substrate includes a core layer of a first conductive type, a first diffusion layer of the first conductive type, a second diffusion layer of a second conductive type, and a heavily doped region of the second conductive type. The core layer is located between the first diffusion layer and the second diffusion layer. A thickness of the core layer is greater than that of the second diffusion layer. The heavily doped region is located in the second diffusion layer and extends toward the core layer to form a PN junction between the heavily doped region and the core layer. A method for manufacturing the power diode device is also provided.

Abstract: A display module is provided, which includes a display panel and an ESD protection member. The display panel includes a rear substrate, a front substrate, a front polarizer, and an electrical connection layer. The front substrate is stacked on the rear substrate and includes a manifesting area and a perimeter area surrounding the display area. The front polarizer is relative to the manifesting area and is disposed on the front surface of the front substrate. The electrical connection layer is relative to the manifesting area and the perimeter area and is sandwiched between the front polarizer and the front substrate. The ESD protection member, a flexible printed circuit, is connected to the electrical connection layer and is electrically grounded.

Abstract: A display module is provided, which includes a display panel and an ESD protection member. The display panel includes a rear substrate, a front substrate, a front color filter, and an electrical connection layer. The front substrate is stacked on the rear substrate and includes a manifesting area and a perimeter area surrounding the display area. The front color filter is relative to the manifesting area and is disposed on the front surface of the front substrate. The electrical connection layer is relative to the manifesting area and the perimeter area and is sandwiched between the front color filter and the front substrate. The ESD protection member, a flexible printed circuit, is connected to the electrical connection layer and is electrically grounded.