Patents by Inventor Ching-Yu Chu

Ching-Yu Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260223710
    Abstract: An electronic device includes a core layer, a first circuit structure, a second circuit structure, an electronic unit, and a connecting component. The core layer includes a conductive through via, an embedding portion, and a peripheral heat-dissipating portion surrounding the embedding portion. The conductive through via passes through the core layer and extends to the upper surface and the lower surface. The first circuit structure is disposed on an upper surface of the core layer and is electrically connected to the conductive through via. The second circuit structure is disposed on a lower surface of the core layer and is electrically connected to the conductive through via. The electronic unit is disposed on the first circuit structure and is electrically connected to the first circuit structure. The connecting component is disposed on the second circuit structure and is electrically connected to the second circuit structure.
    Type: Application
    Filed: December 26, 2025
    Publication date: July 30, 2026
    Applicants: Innolux Corporation, nD-HI Technologies Lab, Inc.
    Inventors: Ho-Ming Tong, Chun-Yu Chien, Chih-Chao Chuang, Ching-Yu Chu, Shu-Hsien Wu
  • Publication number: 20260223697
    Abstract: A composite circuit laminate including a first redistribution layer, a second redistribution layer, and a core composite layer is provided. The second redistribution layer is disposed opposite to the first redistribution layer. The core composite layer is located between the first redistribution layer and the second redistribution layer. The core composite layer at least includes a first core sublayer, a second core sublayer, and a third core sublayer. The first core sublayer, the second core sublayer, and the third core sublayer have unequal physical properties. A manufacturing method of the composite circuit laminate is also provided.
    Type: Application
    Filed: December 19, 2025
    Publication date: July 30, 2026
    Applicants: Innolux Corporation, nD-HI Technologies Lab, Inc.
    Inventors: Ching-Yu Chu, Chih-Chao Chuang, Shu-Fen Ku, Szu-Yen Yu, Ho-Ming Tong
  • Publication number: 20260173912
    Abstract: The present disclosure provides an electronic device, an interposer and a method for manufacturing the same. The interposer includes a package structure including a plurality of connection units spaced apart from each other and arranged in an array, a first package layer surrounding the plurality of connection units, and a first circuit structure disposed at a first side of the first package layer and electrically connected to the plurality of connection units. Each connection unit includes a base layer and a first conductive element disposed in the base layer.
    Type: Application
    Filed: November 25, 2025
    Publication date: June 18, 2026
    Applicants: Innolux Corporation, nD-HI Technologies Lab, Inc.
    Inventors: Ho-Ming Tong, Chun-Yu Chien, Chih-Chao Chuang, Ching-Yu Chu, Shu-Hsien Wu, Tsung-Yuan Wu
  • Publication number: 20260173974
    Abstract: A composite circuit laminate is provided. The composite circuit laminate includes a first redistribution layer and a second redistribution layer. The first redistribution layer includes at least one first pad and at least one second pad. The second redistribution layer is disposed opposite to the first redistribution layer. The second redistribution layer includes at least one third pad. When the at least one first pad is bonded to the at least one third pad, the at least one first pad is electrically connected to the at least one third pad to transmit electrical signals. The at least one second pad has a functional material.
    Type: Application
    Filed: November 10, 2025
    Publication date: June 18, 2026
    Applicants: Innolux Corporation, nD-HI Technologies Lab, Inc.
    Inventors: Ho-Ming Tong, Chih-Chao Chuang, Shu-Hsien Wu, Szu-Yen Yu, Ching-Yu Chu
  • Patent number: 8582283
    Abstract: A fixing mechanism for fixing a display device includes a display casing whereon a hole is formed, a shielding wall connected to a side of the display casing, and a bracket wedged inside the shielding wall in a detachable manner and installed on the side of the display casing. An opening is formed on the bracket. The fixing mechanism further includes a screwing component. An end of the screwing component passes through the hole on the display casing and is screwed inside the opening on the bracket. The other end of the screwing component is installed inside a wall mount. The shielding wall is for shielding the end of the screwing component.
    Type: Grant
    Filed: July 19, 2011
    Date of Patent: November 12, 2013
    Assignee: Wistron Corporation
    Inventors: Yung-Fu Chen, Bing-Ying Li, Chun-Yi Lin, Ching-Yu Chu, Ku-Chou Wu
  • Publication number: 20120037770
    Abstract: A fixing mechanism for fixing a display device includes a display casing whereon a hole is formed, a shielding wall connected to a side of the display casing, and a bracket wedged inside the shielding wall in a detachable manner and installed on the side of the display casing. An opening is formed on the bracket. The fixing mechanism further includes a screwing component. An end of the screwing component passes through the hole on the display casing and is screwed inside the opening on the bracket. The other end of the screwing component is installed inside a wall mount. The shielding wall is for shielding the end of the screwing component.
    Type: Application
    Filed: July 19, 2011
    Publication date: February 16, 2012
    Inventors: Yung-Fu Chen, Bing-Ying Li, Chun-Yi Lin, Ching-Yu Chu, Ku-Chou Wu