Abstract: An electronic device including a composite circuit stack is provided. The composite circuit stack includes a core substrate, at least one first heat transfer element, a first redistribution layer, a driving module, and an encapsulation layer. The at least one first heat transfer element is embedded in the core substrate. The first redistribution layer is disposed on the core substrate. The driving module is disposed on the first redistribution layer. The encapsulation layer surrounds the driving module.

Abstract: An electronic device includes a heat dissipation component, a through hole, a package structure, a heat dissipation cover, and a connecting component. The through hole extends through the heat dissipation component. The package structure is disposed on a first surface of the heat dissipation component, and includes a circuit structure and an electronic unit. The circuit structure includes a metal layer, and a thermal conductivity of the heat dissipation component is different from a thermal conductivity of the metal layer. The electronic unit is disposed on the circuit structure and is electrically connected to the circuit structure. The heat dissipation cover is attached to the package structure. The connecting component electrically connects the circuit structure of the package structure, and extends through the through hole of the heat dissipation component beyond the second surface of the heat dissipation component.

Abstract: An electronic device includes a core layer, a first circuit structure, a second circuit structure, an electronic unit, and a connecting component. The core layer includes a conductive through via, an embedding portion, and a peripheral heat-dissipating portion surrounding the embedding portion. The conductive through via passes through the core layer and extends to the upper surface and the lower surface. The first circuit structure is disposed on an upper surface of the core layer and is electrically connected to the conductive through via. The second circuit structure is disposed on a lower surface of the core layer and is electrically connected to the conductive through via. The electronic unit is disposed on the first circuit structure and is electrically connected to the first circuit structure. The connecting component is disposed on the second circuit structure and is electrically connected to the second circuit structure.

Abstract: A composite circuit laminate including a first redistribution layer, a second redistribution layer, and a core composite layer is provided. The second redistribution layer is disposed opposite to the first redistribution layer. The core composite layer is located between the first redistribution layer and the second redistribution layer. The core composite layer at least includes a first core sublayer, a second core sublayer, and a third core sublayer. The first core sublayer, the second core sublayer, and the third core sublayer have unequal physical properties. A manufacturing method of the composite circuit laminate is also provided.

Abstract: The present disclosure provides an electronic device, an interposer and a method for manufacturing the same. The interposer includes a package structure including a plurality of connection units spaced apart from each other and arranged in an array, a first package layer surrounding the plurality of connection units, and a first circuit structure disposed at a first side of the first package layer and electrically connected to the plurality of connection units. Each connection unit includes a base layer and a first conductive element disposed in the base layer.

Abstract: A composite circuit laminate is provided. The composite circuit laminate includes a first redistribution layer and a second redistribution layer. The first redistribution layer includes at least one first pad and at least one second pad. The second redistribution layer is disposed opposite to the first redistribution layer. The second redistribution layer includes at least one third pad. When the at least one first pad is bonded to the at least one third pad, the at least one first pad is electrically connected to the at least one third pad to transmit electrical signals. The at least one second pad has a functional material.

Abstract: A fixing mechanism for fixing a display device includes a display casing whereon a hole is formed, a shielding wall connected to a side of the display casing, and a bracket wedged inside the shielding wall in a detachable manner and installed on the side of the display casing. An opening is formed on the bracket. The fixing mechanism further includes a screwing component. An end of the screwing component passes through the hole on the display casing and is screwed inside the opening on the bracket. The other end of the screwing component is installed inside a wall mount. The shielding wall is for shielding the end of the screwing component.

Abstract: A fixing mechanism for fixing a display device includes a display casing whereon a hole is formed, a shielding wall connected to a side of the display casing, and a bracket wedged inside the shielding wall in a detachable manner and installed on the side of the display casing. An opening is formed on the bracket. The fixing mechanism further includes a screwing component. An end of the screwing component passes through the hole on the display casing and is screwed inside the opening on the bracket. The other end of the screwing component is installed inside a wall mount. The shielding wall is for shielding the end of the screwing component.