Patents by Inventor Ching-Yu Hsiao

Ching-Yu Hsiao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240077349
    Abstract: A server includes a chassis, an air duct, a sensing module and a board management controller. The air duct is disposed in the chassis. The sensing module is disposed in the chassis. The sensing module senses whether the air duct is correctly installed. The board management controller is disposed in the chassis and coupled to the sensing module. When the air duct is not correctly installed, the sensing module notifies the board management controller to generate a warning message.
    Type: Application
    Filed: October 3, 2022
    Publication date: March 7, 2024
    Applicant: Wiwynn Corporation
    Inventors: Po-Sheng Su, Ching-Wen Hsiao, Hsien-Yu Wang, Tzu-Shun Wang
  • Patent number: 11721570
    Abstract: The present invention provides a wafer notch leveling device, which comprises a body, a first rotating portion, a positioning portion, a power portion, and a control unit. The body has a support portion and a pivot portion is provided at each terminal of the body, the pivot portion pivotally connects a plurality of supporting arms. The first rotating portion and the positioning portion are electrically connected with the power portion. The power portion is electrically connected with the control unit. Especially, when a plurality of wafers are placed on the support portion and fixed, the first rotating portion is electrically connected with the power portion through the control unit to drive the plurality of wafers to rotate the wafers, a notch on the wafer is leveled through the positioning portion.
    Type: Grant
    Filed: July 23, 2020
    Date of Patent: August 8, 2023
    Assignee: Sanwa Engineering Corp.
    Inventors: Min-Chih Tseng, Ching-Yu Hsiao
  • Patent number: 11598405
    Abstract: A planetary reducer contains: a sun gear rod, a gear assembly, a first external gear, and a second external gear. The sun gear rod includes an extension and a toothed section. The gear assembly includes a post, a first planetary gear, and a second planetary gear. Some of multiple teeth of the first planetary gear and some of multiple teeth of the second planetary gear expose outside the post. A number of the multiple teeth of the first planetary gear is different from a number of the multiple teeth of the second planetary gear. The first external gear includes a first surrounding portion and a first toothed portion which meshes with the first planetary gear. The second external gear includes a second surrounding portion and a second toothed portion which meshes with the second planetary gear.
    Type: Grant
    Filed: November 30, 2021
    Date of Patent: March 7, 2023
    Assignee: Sanwa Engineering Corp.
    Inventors: Li-Ping Chang, Ching-Yu Hsiao
  • Patent number: 11309159
    Abstract: The present invention discloses a structure of an emitter electrode for enhancing ion currents, including a tip end part and a shank part. The tip end part has a pinpoint, a first diameter, and a radius of curvature. A length of the tip end part with the shank part is from the pinpoint to a first position of the shank part and a distance between the first position and the pinpoint is 300 times the first diameter. The radius of curvature of the tip end part ranges from 50 nanometers to 5 micrometers. The first diameter is 2 times the radius of curvature.
    Type: Grant
    Filed: August 23, 2021
    Date of Patent: April 19, 2022
    Assignee: ALES TECH INC.
    Inventors: Wei-Chaio Lai, Chun-Yueh Lin, Ing-Shouh Hwang, Wei-Tse Chang, Ching-Yu Hsiao, Yu-Fong Yu, Zong-Yu Yang
  • Publication number: 20220068583
    Abstract: The present invention discloses a structure of an emitter electrode for enhancing ion currents, including a tip end part and a shank part. The tip end part has a pinpoint, a first diameter, and a radius of curvature. A length of the tip end part with the shank part is from the pinpoint to a first position of the shank part and a distance between the first position and the pinpoint is 300 times the first diameter. The radius of curvature of the tip end part ranges from 50 nanometers to 5 micrometers. The first diameter is 2 times the radius of curvature.
    Type: Application
    Filed: August 23, 2021
    Publication date: March 3, 2022
    Inventors: Wei-Chaio Lai, Chun-Yueh Lin, Ing-Shouh Hwang, Wei-Tse Chang, Ching-Yu Hsiao, Yu-Fong Yu, Zong-Yu Yang
  • Publication number: 20220028717
    Abstract: The present invention provides a wafer notch leveling device, which comprises a body, a first rotating portion, a positioning portion, a power portion, and a control unit. The body has a support portion and a pivot portion is provided at each terminal of the body, the pivot portion pivotally connects a plurality of supporting arms. The first rotating portion and the positioning portion are electrically connected with the power portion. The power portion is electrically connected with the control unit. Especially, when a plurality of wafers are placed on the support portion and fixed, the first rotating portion is electrically connected with the power portion through the control unit to drive the plurality of wafers to rotate the wafers, a notch on the wafer is leveled through the positioning portion.
    Type: Application
    Filed: July 23, 2020
    Publication date: January 27, 2022
    Inventors: Min-Chih Tseng, Ching-Yu Hsiao
  • Patent number: D579376
    Type: Grant
    Filed: June 1, 2007
    Date of Patent: October 28, 2008
    Inventor: Ching-Yu Hsiao
  • Patent number: D579377
    Type: Grant
    Filed: June 4, 2007
    Date of Patent: October 28, 2008
    Inventor: Ching-Yu Hsiao