Abstract: A photoresist includes a solvent, a polymer and an additive. The polymer is dissolved in the solvent, and the additive is dispersed in the solvent. The additive includes a double bond or includes an epoxy group. The additive has a surface tension different from a surface tension of the polymer.

Abstract: Interconnect structure packages (e.g., through silicon vias (TSV) packages, through interlayer via (TIV) packages) may be pre-manufactured as opposed to forming TIVs directly on a carrier substrate during a manufacturing process for a semiconductor die package at backend packaging facility. The interconnect structure packages may be placed onto a carrier substrate during manufacturing of a semiconductor device package, and a semiconductor die package may be placed on the carrier substrate adjacent to the interconnect structure packages. A molding compound layer may be formed around and in between the interconnect structure packages and the semiconductor die package.

Abstract: A method of manufacturing a package structure at least includes the following steps. An encapsulant laterally is formed to encapsulate the die and the plurality of through vias. A plurality of first connectors are formed to electrically connect to first surfaces of the plurality of through vias. A warpage control material is formed over the die, wherein the warpage control material is disposed to cover an entire surface of the die. A protection material is formed over the encapsulant and around the plurality of first connectors and the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.

Abstract: In an embodiment, a method includes: aligning a first package component with a second package component, the first package component having a first region and a second region, the first region including a first conductive connector, the second region including a second conductive connector; performing a first laser shot on a first portion of a top surface of the first package component, the first laser shot reflowing the first conductive connector of the first region, the first portion of the top surface of the first package component completely overlapping the first region; and after performing the first laser shot, performing a second laser shot on a second portion of the top surface of the first package component, the second laser shot reflowing the second conductive connector of the second region, the second portion of the top surface of the first package component completely overlapping the second region.

Abstract: A method of manufacturing a semiconductor device includes forming a first layer comprising an organic material over a substrate. A second layer is formed over the first layer, wherein the second layer includes a silicon-containing material and one or more selected from the group consisting of a photoacid generator, an actinic radiation absorbing additive including an iodine substituent, and a silicon-containing monomer having iodine or phenol group substituents. A photosensitive layer is formed over the second layer, and the photosensitive layer is patterned.

Abstract: A package structure includes a die, an encapsulant laterally encapsulating the die, a warpage control material disposed over the die, and a protection material disposed over the encapsulant and around the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.

Abstract: Integrated fan-out packages and methods of forming the same are disclosed. An integrated fan-out package includes two dies, an encapsulant, a first metal line and a plurality of dummy vias. The encapsulant is disposed between the two dies. The first metal line is disposed over the two dies and the encapsulant, and electrically connected to the two dies. The plurality of dummy vias is disposed over the encapsulant and aside the first metal line.

Abstract: A photoresist includes a polymer and a photoactive compound. The photoactive compound contains a sensitizer component. The photoactive compound contains an acid generator or a base molecular. The acid generator or the base molecular bonds the sensitizer component. The photoactive compound is within a polymer backbone. The sensitizer component is configured to absorb an EUV light to produce electrons.

Abstract: A preparation method of a dye incorporated in a recording layer for a high density optical recording medium, having the following general chemical structural formula (I): is provided.

Abstract: An indolestyryl compound. The indolestyryl compound has formula (I): wherein Z1 comprises benzene, naphthalene, or heterocyclic ring containing O, S, or N, R2 comprises H, halogen atoms, C1-5 alkyl, nitro, ester, carboxyl, sulfo, sulfonamide, sulfuric ester, amide, C1-3 alkoxy, amino, alkylamino, cyano, C1-6 alkylsulfonyl, or C2-7 alkoxy carbonyl, R3, R4, R5, and R6 comprise H, alkyl, aralkyl, or heterocyclic ring containing O, S, or N, R7 and R8 comprise H or alkyl, R10 comprises H, alkyl, halogen atoms, nitro, hydroxyl, amino, ester, or substituted or non-substituted sulfonyl, W comprises carbon or nitrogen, Y comprises carbon, oxygen, sulfur, selenium, —NR, or —C(CH3)2, m is 1˜3, and X1 comprises an anionic group or an anionic organometallic complex, wherein R3 and R4 are joined to a nitrogen atom or R5 and R6 are joined together to form a ring, and R bonded to nitrogen is C1-5 alkyl.

Abstract: A recording layer including a novel dye for a high density optical recording medium, employing short wavelength laser source with a wavelength not longer than 530 nm for recording high density information and reproduction/playback of the high density information recordings, is provided.

Abstract: A recording layer including a novel dye for a high density optical recording medium, employing short wavelength laser source with a wavelength not longer than 530 nm for recording high density information and reproduction/playback of the high density information recordings, is provided.

Abstract: A bisstyryl compound. The bisstyryl compound has formula (I): wherein Z1 and Z2 are benzene, naphthalene, or heterocyclic ring, R1 is H, C1-5 alkyl, hydroxyl, halogen atoms, or alkoxy, R2 is H, halogen atoms, C1-5 alkyl, nitro, ester, carboxyl, sulfo, sulfonamide, sulfuric ester, amide, C1-3 alkoxy, amino, alkylamino, cyano, C1-6 alkylsulfonyl, or C2-7 alkoxy carbonyl, R3, R4, R5, and R6 are H, halogen atoms, alkyl, aralkyl, or heterocyclic ring containing O, S, or N, or R3 and R4 are joined to a nitrogen atom or R5 and R6 are joined together to form a ring, R7 and R8 are H or alkyl, W is nitrogen with or without Z1 and Z2 or aromatic group without Z1 and Z2, Y is carbon, oxygen, sulfur, selenium, —NR, or —C(CH3)2, m is 1-3, n is 1-18, and X1 and X2 are anionic groups or anionic organometallic complexes.

Abstract: A preparation method of a dye incorporated in a recording layer for a high density optical recording medium, having the following general chemical structural formula (I): is provided.

Abstract: A recording layer including a novel dye for a high density optical recording medium, employing short wavelength laser source with a wavelength no longer than 530 nm 530 nm for recording high density information and reproduction/playback of the high density information recordings, is provided.

Abstract: An indolestyryl compound. The indolestyryl compound has formula (I): wherein Z1 comprises benzene, naphthalene, or heterocyclic ring containing O, S, or N, R2 comprises H, halogen atoms, C1-5 alkyl, nitro, ester, carboxyl, sulfo, sulfonamide, sulfuric ester, amide, C1-3 alkoxy, amino, alkylamino, cyano, C1-6 alkylsulfonyl, or C2-7 alkoxy carbonyl, R3, R4, R5, and R6 comprise H, alkyl, aralkyl, or heterocyclic ring containing O, S, or N, R7 and R8 comprise H or alkyl, R10 comprises H, alkyl, halogen atoms, nitro, hydroxyl, amino, ester, or substituted or non-substituted sulfonyl, W comprises carbon or nitrogen, Y comprises carbon, oxygen, sulfur, selenium, —NR, or —C(CH3)2, m is 1˜3, and X1 comprises an anionic group or an anionic organometallic complex, wherein R3 and R4 are joined to a nitrogen atom or R5 and R6 are joined together to form a ring, and R bonded to nitrogen is C1-5 alkyl.

Abstract: An apparatus for fabricating a coverlayer of optical information storage media is disclosed. The apparatus comprises a rotating platform, a rotating plate and a UV irradiation system. A substrate is disposed on the rotating platform and a radiation setting resin material is disposed on a surface of the substrate. The rotating plate is moved towards the rotating platform to compress the radiation-setting resin material against the substrate. The resulting structure is rotated by rotating the rotating platform. A thin radiation-setting resin layer with a uniform thickness is formed on the substrate. The radiation-setting resin layer is illuminated by a UV light to harden the radiation-setting resin layer. Next, the rotating plate is separated from the radiation-setting resin layer while the radiation-setting resin layer remains adhered to the substrate. The hardened radiation-setting resin layer serves as a coverlayer of the optical information storage media.

Abstract: A recording layer including a novel dye for a high density optical recording medium, employing short wavelength laser source with a wavelength no longer than 530 nm for recording high density information and reproduction/playback of the high density information recordings, is provided. The dye incorporated in the recording layer has the following general chemical structural formula (I).

Abstract: A recording layer including a novel dye for a high density optical recording medium, employing short wavelength laser source with a wavelength no longer than 530 nm 530 nm for recording high density information and reproduction/playback of the high density information recordings, is provided.

Abstract: A fluorescent dye, a structure of a fluorescent storage media and method using thereof, are disclosed. The fluorescent dye of the present invention comprises an organic violet fluorescent compound having a chemical structure (I) is suitable for using a short wavelength laser having a wavelength less than 500 nm as an excitation source. When a short wavelength laser is used for exciting the organic violet fluorescent compound (I), a fluorescence having an emission wavelength larger than 500 nm is induced, and a reading signal can be provided by detecting the intensity of the fluorescence radiation.