Patents by Inventor Ching-Yu Pan

Ching-Yu Pan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11735651
    Abstract: A method includes forming a fin on a substrate, forming an insulating material over the fin, recessing the insulating material to form an isolation region surrounding the fin, wherein an upper portion of the fin protrudes above the isolation region, performing a trimming process to reduce a width of the upper portion of the fin, and forming a gate structure extending over the isolation region and the upper portion of the fin.
    Type: Grant
    Filed: July 25, 2022
    Date of Patent: August 22, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chung-Shu Wu, Ying-Ya Hsu, Ching-Yu Pan, Hsiu-Hao Tsao, An Chyi Wei, Yuan-Hung Chiu
  • Publication number: 20220359735
    Abstract: A method includes forming a fin on a substrate, forming an insulating material over the fin, recessing the insulating material to form an isolation region surrounding the fin, wherein an upper portion of the fin protrudes above the isolation region, performing a trimming process to reduce a width of the upper portion of the fin, and forming a gate structure extending over the isolation region and the upper portion of the fin.
    Type: Application
    Filed: July 25, 2022
    Publication date: November 10, 2022
    Inventors: Chung-Shu Wu, Ying-Ya Hsu, Ching-Yu Pan, Hsiu-Hao Tsao, An Chyi Wei, Yuan-Hung Chiu
  • Patent number: 11437498
    Abstract: A method includes forming a fin on a substrate, forming an insulating material over the fin, recessing the insulating material to form an isolation region surrounding the fin, wherein an upper portion of the fin protrudes above the isolation region, performing a trimming process to reduce a width of the upper portion of the fin, and forming a gate structure extending over the isolation region and the upper portion of the fin.
    Type: Grant
    Filed: December 7, 2020
    Date of Patent: September 6, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chung-Shu Wu, Ying-Ya Hsu, Ching-Yu Pan, Hsiu-Hao Tsao, An Chyi Wei, Yuan-Hung Chiu
  • Publication number: 20220075714
    Abstract: A data merge method for a rewritable non-volatile memory module including a plurality of physical units is provided. The method includes: selecting at least one first physical unit and at least one second physical unit from the physical units; reading first mapping information from the rewritable non-volatile memory module, and the first mapping information includes mapping information of the first physical unit and mapping information of the second physical unit; copying valid data collected from the first physical unit and valid data collected from the second physical unit to at least one third physical unit of the physical units according to the first mapping information; and when a data volume of valid data copied from the second physical unit to the third physical unit reaches a data volume threshold, stopping collecting valid data from the second physical unit, and continuing collecting valid data from the first physical unit.
    Type: Application
    Filed: September 25, 2020
    Publication date: March 10, 2022
    Applicant: PHISON ELECTRONICS CORP.
    Inventors: Che-Yueh Kuo, Ching-Yu Pan
  • Patent number: 11249898
    Abstract: A data merge method for a rewritable non-volatile memory module including a plurality of physical units is provided. The method includes: selecting at least one first physical unit and at least one second physical unit from the physical units; reading first mapping information from the rewritable non-volatile memory module, and the first mapping information includes mapping information of the first physical unit and mapping information of the second physical unit; copying valid data collected from the first physical unit and valid data collected from the second physical unit to at least one third physical unit of the physical units according to the first mapping information; and when a data volume of valid data copied from the second physical unit to the third physical unit reaches a data volume threshold, stopping collecting valid data from the second physical unit, and continuing collecting valid data from the first physical unit.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: February 15, 2022
    Assignee: PHISON ELECTRONICS CORP.
    Inventors: Che-Yueh Kuo, Ching-Yu Pan
  • Publication number: 20210111272
    Abstract: A method includes forming a fin on a substrate, forming an insulating material over the fin, recessing the insulating material to form an isolation region surrounding the fin, wherein an upper portion of the fin protrudes above the isolation region, performing a trimming process to reduce a width of the upper portion of the fin, and forming a gate structure extending over the isolation region and the upper portion of the fin.
    Type: Application
    Filed: December 7, 2020
    Publication date: April 15, 2021
    Inventors: Chung-Shu Wu, Ying-Ya Hsu, Ching-Yu Pan, Hsiu-Hao Tsao, An Chyi Wei, Yuan-Hung Chiu
  • Patent number: 10861960
    Abstract: A method includes forming a fin on a substrate, forming an insulating material over the fin, recessing the insulating material to form an isolation region surrounding the fin, wherein an upper portion of the fin protrudes above the isolation region, performing a trimming process to reduce a width of the upper portion of the fin, and forming a gate structure extending over the isolation region and the upper portion of the fin.
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: December 8, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Shu Wu, Ying-Ya Hsu, Ching-Yu Pan, Hsiu-Hao Tsao, An Chyi Wei, Yuan-Hung Chiu