Abstract: A resin composition for composite material parts includes a main agent composed of an epoxy resin and a reactive diluent, and a curing agent. The reactive diluent, which is monomer or oligomer of acrylate or methacrylate having one or more vinyl (unsaturated double bond) functional groups and has low viscosity at room temperature, is used in an amount of 5 to 30 parts by weight based on 100 parts by weight of the main agent such that the main agent has a viscosity of 700 to 3000 cps at 25° C. The resin composition of the present invention is very suitable for being used to manufacture composite material parts used in wind blade, boat, automobile and aircraft by the manufacturing process such as vacuum infusion and hand lay-up vacuum assisted resin infusion process.

Abstract: A breakdown precautionary system of a semiconductor equipment includes a semiconductor equipment with a coil heater, at least a voltage/current detector, and an alarm system. The voltage/current detector detects the voltage and current of the coil heater at the same time. An alarm system will send an alarm signal and initiate an interlock safety measure of the semiconductor equipment when the detected current of the coil heater is 0 ampere.

Abstract: A mobile communication device (10) for processing calls of different types includes a call management module (30), a phone book module (40), a call history module (20), and a display module (50). The call management module processes the calls of different types, and generates call histories. Each of the call histories includes a phone number and a call type. The phone book module saves a plurality of phone entries, and each phone entry includes a name, a corresponding phone number, and a corresponding call type. The call history module is connected to the call management module and the phone book module, and saves the call histories. The display module is connected to the call history module, and displays the call histories.

Abstract: A wet cleaning device for chemically cleaning a plurality of wafers. The wet cleaning device includes a plurality of first chemical cleaning tanks for conducting a first cleaning procedure, a plurality of second chemical cleaning tanks for conducting a second cleaning procedure, a transferring tank including a first measuring device for measuring the wafers after the first cleaning procedure, a measuring tank including a second measuring device for measuring the wafers after the second cleaning procedure, a first transporting device, and a second transporting device.