Patents by Inventor Ching-yuan L. Hsing

Ching-yuan L. Hsing has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods of tuning and temperature compensating a variable topography electromagnetic wave device
    Patent number: 6057748
    Abstract: An electromagnetic wave component uses one or more diaphragms secured to the interior of a waveguide structure to tune its resonant frequency, with each diaphragm engaged by one or more adjustment members that deform it. The adjustment members are preferably screws that are threaded through the structure to push and/or pull on the diaphragms, thereby tuning the electromagnetic wave component. The shift in the resonant frequency of the electromagnetic wave component due to temperature-induced dimensional changes is mitigated if the materials used for the diaphragm, the adjustment members and the structure which houses the diaphragm are chosen to have an appropriate combination of thermal coefficients of expansion.
    Type: Grant
    Filed: May 14, 1999
    Date of Patent: May 2, 2000
    Assignee: Hughes Electronics Corporation
    Inventors: Ching-yuan L. Hsing, John E. Jordan, Paul J. Tatomir
  • Variable topography electromagnetic wave tuning device, and operating method
    Patent number: 5977849
    Abstract: An electromagnetic wave component uses one or more diaphragms secured to the interior of a waveguide structure to tune its resonant frequency, with each diaphragm engaged by one or more adjustment members that deform it. The adjustment members are preferably screws that are threaded through the structure to push and/or pull on the diaphragms, thereby tuning the electromagnetic wave component. The shift in the resonant frequency of the electromagnetic wave component due to temperature-induced dimensional changes is mitigated if the materials used for the diaphragm, the adjustment members and the structure which houses the diaphragm are chosen to have an appropriate combination of thermal coefficients of expansion.
    Type: Grant
    Filed: July 22, 1997
    Date of Patent: November 2, 1999
    Assignee: Huhges Electronics Corporation
    Inventors: Ching-yuan L. Hsing, John E. Jordan, Paul J. Tatomir