Patents by Inventor Ching Yun Tye

Ching Yun Tye has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor formation arrangement
    Patent number: 9387613
    Abstract: A semiconductor package formation arrangement includes a mold housing with an interior cavity having top, bottom and first and second end sides. A gate for transferring liquefied molding material extends to the first end side. A lead frame having a top surface, a rear surface opposite the top surface and a mold flow modifier forms a first cavity section between the top surface and the top side and a second cavity section between the rear surface and the bottom side. A topology of the lead frame causes liquefied molding material to fill the first and second cavity sections at different rates. The mold flow modifier extends away from the lead frame so as to compensate for the difference between the first and second rates.
    Type: Grant
    Filed: May 23, 2014
    Date of Patent: July 12, 2016
    Assignee: Infineon Technologies AG
    Inventors: Carlo Baterna Marbella, Ching Yun Tye, Ramasubramanian Natarajan
  • Device Package Configuration and Method for Compensating for Unbalanced Resin Flow in Mold Cavities
    Publication number: 20150336314
    Abstract: A semiconductor package formation arrangement includes a mold housing with an interior cavity having top, bottom and first and second end sides. A gate for transferring liquefied molding material extends to the first end side. A lead frame having a top surface, a rear surface opposite the top surface and a mold flow modifier forms a first cavity section between the top surface and the top side and a second cavity section between the rear surface and the bottom side. A topology of the lead frame causes liquefied molding material to fill the first and second cavity sections at different rates. The mold flow modifier extends away from the lead frame so as to compensate for the difference between the first and second rates.
    Type: Application
    Filed: May 23, 2014
    Publication date: November 26, 2015
    Inventors: Carlo Baterna Marbella, Ching Yun Tye, Ramasubramanian Natarajan
  • Carrier tape for electronic components
    Patent number: 7395932
    Abstract: A carrier tape for electrical components is provided comprising a tape having a length and a plurality of cavities along the length of the tape. Each cavity comprises inner side walls and a bottom surface and is capable of containing an electrical component.
    Type: Grant
    Filed: July 27, 2006
    Date of Patent: July 8, 2008
    Assignee: Infineon Technologies AG
    Inventors: Boon Kiat Chew, Chye Lin Toh, Ching Yun Tye, Lee Hua Alvin Seah