Patents by Inventor Ching-Yung Chen
Ching-Yung Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240096498Abstract: A method for evaluating a risk of a subject getting a specific disease includes steps of: storing a reference database that contains original parameter sets; selecting target alleles from an SNP profile derived from genome sequencing data of a subject; selecting target parameter sets from among the original parameter sets; calculating, for each of the target parameter sets, a race factor based on a global risk allele frequency and a group-specific risk allele frequency included in the target parameter set; calculating a genetic factor based on statistics, global reference allele frequencies, the race factors for the target parameter sets, and numbers of chromosomes in homologous chromosome pairs included in the target parameter sets; calculating a citation factor based on numbers of citation times included in the target parameter sets; and calculating a risk score based on the genetic factor and the citation factor.Type: ApplicationFiled: August 28, 2023Publication date: March 21, 2024Inventors: Yi-Ting CHEN, Sing-Han HUANG, Ching-Yung LIN, Xiang-Yu LIN, Cheng-Tang WANG, Raksha NANDANAHOSUR RAMESH, Pei-Hsin CHEN
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Patent number: 10937724Abstract: A package structure applied to a driving apparatus of a display is disclosed. The driving apparatus includes at least one driving unit. The package structure includes a substrate, a first connecting unit, a second connecting unit and at least one package unit. The substrate is used to carry the driving unit. The first connecting unit is disposed at one side of the substrate. A longitudinal direction of the first connecting unit is parallel to a first direction. The second connecting unit is disposed at the other side of the substrate. A longitudinal direction of the second connecting unit is parallel to the first direction. The package unit is used to package the driving unit to form driving unit package object. A longitudinal direction of the driving unit package object is parallel to a second direction. The first direction and the second direction are perpendicular to each other.Type: GrantFiled: April 17, 2019Date of Patent: March 2, 2021Assignee: Raydium Semiconductor CorporationInventors: Ching-Yung Chen, Wen-Tsung Lin
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Publication number: 20190348358Abstract: A package structure applied to a driving apparatus of a display is disclosed. The driving apparatus includes at least one driving unit. The package structure includes a substrate, a first connecting unit, a second connecting unit and at least one package unit. The substrate is used to carry the at least one driving unit. The first connecting unit is disposed at one side of the substrate. A longitudinal direction of the first connecting unit is parallel to a first direction. The second connecting unit is disposed at the other side of the substrate. A longitudinal direction of the second connecting unit is parallel to the first direction. The at least one package unit is used to package the at least one driving unit to form at least one driving unit package object. A longitudinal direction of the at least one driving unit package object is parallel to a second direction. The first direction and the second direction are perpendicular to each other.Type: ApplicationFiled: April 17, 2019Publication date: November 14, 2019Inventors: Ching-Yung CHEN, Wen-Tsung LIN
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Publication number: 20190139867Abstract: A chip on film (COF) package structure used to package a chip is disclosed. The COF package structure includes a flexible substrate, a conductive layer, a plating layer and a solder resist layer. A conductive layer is formed on the flexible substrate. A plating layer is formed on the conductive layer and has an opening area. A solder resist layer is formed on the plating layer and connected to the conductive layer through the opening area. The solder resist layer has a single layer structure. A bending area is defined in the COF package structure. The bending area is enclosed in the opening area and the bending area is smaller than or equal to the opening area.Type: ApplicationFiled: November 8, 2018Publication date: May 9, 2019Inventor: CHING-YUNG CHEN
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Patent number: 9589883Abstract: A double-sided chip on film (COF) packaging structure and a manufacturing method thereof are disclosed. The double-sided COF structure includes a metal layer, a first insulating layer, a second insulating layer, a chip, and an encapsulant. The first insulating layer and second insulating layer are disposed on a first surface and a second surface of metal layer respectively. The first surface and second surface are opposite. The first insulating layer includes a first part and a second part separated from each other. An accommodating space is existed between the first part and the second part and a part of the first surface is exposed. The chip is accommodated in the accommodating space and disposed on the exposed part of the first surface. The encapsulant fills the spaces between the chip and the first part and between the chip and the second part to form the double-sided COF packaging structure.Type: GrantFiled: November 4, 2015Date of Patent: March 7, 2017Assignee: Raydium Semiconductor CorporationInventor: Ching-Yung Chen
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Patent number: 9423642Abstract: The invention discloses a package structure of a driving apparatus of a display. The driving apparatus of the display includes a plurality of driving units. The package structure includes a substrate and a plurality of package units. The substrate is used to carry the plurality of driving units. The plurality of driving units is apart to each other. The plurality of package units is used to package the plurality of driving units respectively to form a plurality of driving unit package body apart to each other. A total output channel number of the driving apparatus of the display equals to a total channel number of the plurality of driving units. This package structure can avoid heat concentration on the driving apparatus of the display to achieve good cooling effect and output effectiveness of the driving apparatus of the display will be not reduced accordingly.Type: GrantFiled: March 4, 2015Date of Patent: August 23, 2016Assignee: Raydium Semiconductor CorporationInventors: Ching-Yung Chen, Po-Cheng Lin
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Publication number: 20160133550Abstract: A double-sided chip on film (COF) packaging structure and a manufacturing method thereof are disclosed. The double-sided COF structure includes a metal layer, a first insulating layer, a second insulating layer, a chip, and an encapsulant. The first insulating layer and second insulating layer are disposed on a first surface and a second surface of metal layer respectively. The first surface and second surface are opposite. The first insulating layer includes a first part and a second part separated from each other. An accommodating space is existed between the first part and the second part and a part of the first surface is exposed. The chip is accommodated in the accommodating space and disposed on the exposed part of the first surface. The encapsulant fills the spaces between the chip and the first part and between the chip and the second part to form the double-sided COF packaging structure.Type: ApplicationFiled: November 4, 2015Publication date: May 12, 2016Inventor: Ching-Yung Chen
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Publication number: 20150253618Abstract: The invention discloses a package structure of a driving apparatus of a display. The driving apparatus of the display includes a plurality of driving units. The package structure includes a substrate and a plurality of package units. The substrate is used to carry the plurality of driving units. The plurality of driving units is apart to each other. The plurality of package units is used to package the plurality of driving units respectively to form a plurality of driving unit package body apart to each other. A total output channel number of the driving apparatus of the display equals to a total channel number of the plurality of driving units. This package structure can avoid heat concentration on the driving apparatus of the display to achieve good cooling effect and output effectiveness of the driving apparatus of the display will be not reduced accordingly.Type: ApplicationFiled: March 4, 2015Publication date: September 10, 2015Inventors: Ching-Yung CHEN, Po-Cheng LIN
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Publication number: 20140138809Abstract: A package structure and a manufacturing method thereof are disclosed. The package structure includes an outer lead, a driver chip, a soft material, and a solidified material. There is a distance between the driver chip and the outer lead. The soft material is used to fill the space in the package structure except the driver chip and the outer lead. The solidified material is formed in at least one region on the soft material between the driver chip and the outer lead. The hardness of the solidified material is higher than the hardness of the soft material.Type: ApplicationFiled: November 18, 2013Publication date: May 22, 2014Inventors: Chia-Hung Hsu, Ching-Yung Chen
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Patent number: 8238507Abstract: This invention provides a transmission architecture of transmitter which includes a forestage module, a pilot insertion, a scramble selector, and a backstage module. A frequency domain data symbol is transmitted by the forestage module. A pilot signal is inserted in the frequency domain data symbol by the pilot insertion, and a frequency domain pilot symbol is produced. The frequency domain pilot symbol performed a scramble operation and a select operation with certain scramble patterns by the scramble selector, and a requirement symbol is produced. The requirement symbol is converted into the transmitted signal by the backstage module. Because the use of the scramble operation and the select operation from the scramble selector, the transmission architecture of transmitter provided by this invention can both reduce the PAPR and increase the multi-cell diversity gain in an OFDM single frequency network system.Type: GrantFiled: June 3, 2008Date of Patent: August 7, 2012Assignee: Industrial Technology Research InstituteInventors: Chorng-Ren Sheu, Ming-Chien Tseng, Ching-Yung Chen
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Patent number: 8179985Abstract: A method for transmitting signals using orthogonal frequency division multiplexing (OFDM) symbols in a wireless communication system, includes: selecting a plurality of OFDM symbols as a symbol group in time dimension; and multiplying a scrambling pattern with the symbol group.Type: GrantFiled: July 25, 2007Date of Patent: May 15, 2012Assignee: Industrial Technology Research InstituteInventors: Chih-Yang Kao, Ming-Chien Tseng, Ching-Yung Chen
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Patent number: 8139673Abstract: A transmission method of a wireless signal including the following steps is provided. Multiple orthogonal frequency division multiplexing (OFDM) symbols carried by multiple subcarriers are generated according to a data signal. A scrambling pattern including multiple scrambling symbols is generated, wherein the scrambling symbols respectively correspond to the subcarriers in the frequency domain. The scrambling symbols corresponding to two contiguous subcarriers are correlated. The scrambling symbols are utilized to encode the OFDM symbols carried by the corresponding subcarriers.Type: GrantFiled: June 16, 2008Date of Patent: March 20, 2012Assignee: Industrial Technology Research InstituteInventors: Hsien-Wen Chang, Chorng-Ren Sheu, Ming-Chien Tseng, Ching-Yung Chen
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Patent number: 8040974Abstract: A shift space-time encoding scheme applies STBC over hierarchical modulation. A low-priority bit stream is modulated to complex symbols using STBC encoding and a high-priority bit stream is modulated to complex symbols without STBC encoding. Complex symbols from the low-priority bit stream together with the complex symbols from the high-priority bit stream are added to form a hierarchical 64-QAM constellation.Type: GrantFiled: October 10, 2007Date of Patent: October 18, 2011Assignee: Industrial Technology Research InstituteInventor: Ching-Yung Chen
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Publication number: 20110044388Abstract: A system for receiving a digital broadcast includes an input terminal that receives the digital broadcast containing scalable data, and a controller for controlling an operation mode of the system. In addition, the system may also include a processor that decodes the data, and a power management device that varies the amount of data to be decoded according to the operation mode.Type: ApplicationFiled: August 25, 2010Publication date: February 24, 2011Inventors: Ching-Yung Chen, Fang-Chu Chen, Chih-Chun Feng, Ce-Min Fang
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Patent number: 7813456Abstract: An apparatus for synchronizing pilots contained in symbols received by a receiver in a multicarrier transmission system and a method thereof are provided. Frequency or Time-frequency correlation-based scheme, with exploitation of time-frequency correlation characteristics of the pilots, may be used for identifying the positions of the pilots in frequency or time and frequency dimensions consisting of received symbols. In one example, the apparatus includes a pilot compensator and a signal selector for determining at least one correlation set, a correlator for generating one correlation set result for each of the correlation set, and a judgment or processing unit for determining positions of the pilots in response to the correlation set result.Type: GrantFiled: October 26, 2005Date of Patent: October 12, 2010Assignee: Industrial Technology Research InstituteInventors: Ching-Yung Chen, Yi-Ting Wang, Yung-Hua Hung
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Patent number: 7809064Abstract: A system for receiving a digital broadcast includes an input terminal that receives the digital broadcast containing scalable data, and a controller for controlling an operation mode of the system. In addition, the system may also include a processor that decodes the data, and a power management device that varies the amount of data to be decoded according to the operation mode.Type: GrantFiled: May 27, 2005Date of Patent: October 5, 2010Assignee: Industrial Technology Research InstituteInventors: Ching-Yung Chen, Fang-Chu Chen, Chih-Chun Feng, Ce-Min Fang
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Patent number: 7720183Abstract: A method for ICI self-cancellation and ICI reconstruction and cancellation is introduced. The method includes receiving input signals; receiving boundary information regarding a length q of an ISI-free region of the received signals; selecting a plurality of ISI-free signals from the received signals; combining the plurality of ISI-free signals to provide combined signals z(n); performing FFT operations on the combined signals to provide output signals Z(k); reconstructing ICI based on the output signals Z(k) and the length q of the ISI-free region of the input signals r(n) in order to provide an estimated ICI; subtracting the estimated ICI from the output signals Z(k) to provide a cancelled signal W(k); performing a channel estimation for the cancelled signal W(k); equalizing the cancelled signal W(k) to provide an equalized signal; and de-mapping the equalized signal to provide a de-mapped signal d(k).Type: GrantFiled: December 28, 2006Date of Patent: May 18, 2010Assignee: Industrial Technology Research InstituteInventors: Ming-Chien Tseng, Chorng-Ren Sheu, Ching-Yung Chen
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Patent number: 7653151Abstract: A structure and method for demodulating two-level differential amplitude-shift-keying signals using simple adding operations are provided. Threshold values are dynamically adjusted according to the channel response. By comparing the threshold values and the differential amplitude values, it can be found whether the amplitude of the received signal is changed. Furthermore, it no needs to know the changed value of received signal amplitudes and the differential two-level amplitude-shift-keying signals can be demodulated by just detecting whether the amplitude of the received signal is changed. By this idea, the complexity of the receiver implementation is simplified and the demodulator can get better performance.Type: GrantFiled: December 28, 2005Date of Patent: January 26, 2010Assignee: Industrial Technology Research InstituteInventors: Chih-Yang Kao, Ching-Yung Chen, Yung-Hua Hung
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Patent number: 7643170Abstract: An intelligent print system includes at least one document generating side, a priority generating unit and a machine side. The document generating side has been installed therein a printer driver for outputting a ready-for-print document. The priority generating unit is used for selectively providing a priority value to the document. The machine side includes a receiving and processing unit for receiving the document from the document generating side, a manual operation unit having an interrupt button and for a user to select documents having higher priority, a job selecting unit for discriminating the priority order of the document, and a print control unit for printing the document.Type: GrantFiled: August 11, 2005Date of Patent: January 5, 2010Assignee: Teco Image Systems Co., Ltd.Inventors: Chien Lung Chen, Ching Yung Chen
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Publication number: 20090257515Abstract: A transmission method of a wireless signal including the following steps is provided. Multiple orthogonal frequency division multiplexing (OFDM) symbols carried by multiple subcarriers are generated according to a data signal. A scrambling pattern including multiple scrambling symbols is generated, wherein the scrambling symbols respectively correspond to the subcarriers in the frequency domain. The scrambling symbols corresponding to two contiguous subcarriers are correlated. The scrambling symbols are utilized to encode the OFDM symbols carried by the corresponding subcarriers.Type: ApplicationFiled: June 16, 2008Publication date: October 15, 2009Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Hsien-Wen Chang, Chorng-Ren Sheu, Ming-Chien Tseng, Ching-Yung Chen