Abstract: An electronic package and a carrier structure thereof are provided, in which the carrier structure is used for disposing a semiconductor chip and defined with a die placement area and a peripheral area adjacent to the die placement area on a surface thereof, and a winding shape of conductive traces arranged at a boundary between the die placement area and the peripheral area is a continuous bending shape with notches to facilitate dispersion of thermal stress, thereby preventing the problem of breakage from occurring to line segments of the conductive traces.

Abstract: An electronic package is provided, in which an electronic element is arranged on a carrier structure having a plurality of wire-bonding pads arranged on a surface of the carrier structure, and a plurality of bonding wires are connected to a plurality of electrode pads of the electronic element and the plurality of wire-bonding pads. Further, among any three adjacent ones of the plurality of wire-bonding pads, a long-distanced first wire-bonding pad, a middle-distanced second wire-bonding pad and a short-distanced third wire-bonding pad are defined according to their distances from the electronic element. Therefore, even if the bonding wires on the first to third wire-bonding pads are impacted by an adhesive where a wire sweep phenomenon occurred when the flowing adhesive of a packaging layer covers the electronic element and the bonding wires, the bonding wires still would not contact each other, thereby avoiding short circuit problems.

Abstract: A recoater collision prediction and calibration method for additive manufacturing and a system thereof are provided.

Abstract: The present disclosure provides a method of testing a single device under test (DUT) through multiple cores in parallel, which includes steps as follows. The test quantity of the DUT is calculated; the test quantity of the DUT is evenly allocated to to a plurality of test cores, so as to control a period of testing the DUT through the test cores in parallel.

Abstract: An apparatus and method for evaluating obstructive sleep apnea with PPG signal are provided. Measured heartbeat interval signal is used to evaluate whether there is obstructive apnea. The system includes a motion sensor for detecting whether a user is in a stationary state; an optical sensor for measuring the heartbeat interval signal of the user in a stationary state; a microprocessor for processing the heartbeat interval signal of the user to obtain an apnea parameter; an alert module for receiving the apnea parameter and feeding them back to the user; and a memory module for storing the apnea parameter after the signal processing. The system and method are used to determine whether the heartbeat interval signal is an obstructive sleep apnea signal, and further determine whether the user is in an obstructive sleep apnea situation.

Abstract: The present disclosure provides a method of testing a single device under test (DUT) through multiple cores in parallel, which includes steps as follows. The test quantity of the DUT is calculated; the test quantity of the DUT is evenly allocated to to a plurality of test cores, so as to control a period of testing the DUT through the test cores in parallel.

Abstract: A recoater collision prediction and calibration method for additive manufacturing and a system thereof are provided.

Abstract: The present disclosure provides a system and a method for monitoring semiconductor manufacturing equipment. The system includes a sensor, a circuit, and an analysis unit. The sensor provides a sensor signal. The circuit receives the sensor signal and generates an input signal. The analysis unit includes a signal management platform, receiving the input signal and performing a first data process to generate a first data signal; a diagnosis subsystem, receiving the first data signal from the signal management platform and performing a health status monitoring process to generate a second data signal; and a decision subsystem, performing a determination process to generate a third data signal according to the second data signal from the diagnosis subsystem. The diagnosis subsystem generates a feedback signal according to the third data signal, and the signal management platform transmits the feedback signal to the semiconductor manufacturing equipment.

Abstract: The present disclosure provides a system and a method for monitoring semiconductor manufacturing equipment. The system includes a sensor, a circuit, and an analysis unit. The sensor provides a sensor signal. The circuit receives the sensor signal and generates an input signal. The analysis unit includes a signal management platform, receiving the input signal and performing a first data process to generate a first data signal; a diagnosis subsystem, receiving the first data signal from the signal management platform and performing a health status monitoring process to generate a second data signal; and a decision subsystem, performing a determination process to generate a third data signal according to the second data signal from the diagnosis subsystem. The diagnosis subsystem generates a feedback signal according to the third data signal, and the signal management platform transmits the feedback signal to the semiconductor manufacturing equipment.

Abstract: A display driving device is provided. The display device includes a first data line, a first switch, a first storage unit, and a data output unit. The first switch is electrically connected between the first data line and the data output unit, and the data output unit is further electrically connected to the first storage unit. In a first closing period of the first switch, the data output unit outputs a first data signal to the first data line through the first switch, and the first storage unit stores the first data signal received from the data output unit. After the first closing period and before a second closing period of the first switch, the first storage unit charges the data output unit with the first data signal so that the data output unit and the first data line are at the voltage level.

Abstract: A smart mechanical component has a mechanical part main body; a mechanical part secondary body located inside of the mechanical part main body; a three dimensional three-dimensional (3-D) reserved space located between the mechanical part main body and the mechanical part secondary body; at least one connecting unit connecting the mechanical part main body and the mechanical part secondary body; wherein the mechanical part main body, the mechanical part secondary body and the three dimensional three-dimensional (3-D) reserved space form a capacitor; the connecting unit forms an inductor; the inductor and the capacitor forms an inductor-capacitor circuit.

Abstract: The present disclosure provides a device and method for powder distribution and an additive manufacturing method, wherein different size or kind of powders could be chosen to be accommodated within a receptacle. The receptacle can uniformly mix the powder by a rotation movement, pour out the powders by the rotation movement and distribute the powders for forming a layer by a translation movement. In another embodiment, the receptacle further comprises a heating element for preheating the powders. Not only can the present disclosure uniformly mix the powders so as to reduce the thermal deformation and distribute the powder layer compactly, but also can the present disclosure distribute different kinds of powder in different layer so as to increase the diversity in additive manufacturing.

Abstract: A display driving device is provided. The display device includes a first data line, a first switch, a first storage unit, and a data output unit. The first switch is electrically connected between the first data line and the data output unit, and the data output unit is further electrically connected to the first storage unit. In a first closing period of the first switch, the data output unit outputs a first data signal to the first data line through the first switch, and the first storage unit stores the first data signal received from the data output unit. After the first closing period and before a second closing period of the first switch, the first storage unit charges the data output unit with the first data signal so that the data output unit and the first data line are at the voltage level.

Abstract: A method for fabricating a medical device includes steps as follows: A degradable powder including at least one metal element is firstly provided on a target surface. A focused energy light bean is applied to sinter/cure the biodegradable powder within an oxygen-containing atmosphere; wherein the oxygen concentration of the oxygen-containing atmosphere is adjusted to provide a first oxygen concentration and a second concentration when the focused energy light is driven to a first location and second location of the target surface respectively. The aforementioned processes are then repeatedly carried out to form a three-dimensional (3D) structure of the medical device.

Abstract: A bionic fixing apparatus is provided. The bionic fixing apparatus includes a body having a through hole and at least one slit. The through hole penetrates the body from the top surface to the bottom surface to form a top opening and a bottom opening. An inner diameter of the top opening is larger than an inner diameter of the bottom opening. The slit is connected to the bottom opening and extends upwardly from the bottom surface of the body, such that the body has a flexible bottom portion.

Abstract: A bionic apparatus is provided. The bionic apparatus includes a flexible portion having a plurality of pores, a rigid portion connected with the flexible portion, and a supporting element disposed in the flexible portion. The pore size of each pore is between 50 ?m to 500 ?m. The flexible portion, the rigid portion and the supporting element are one-piece formed by a additive manufacturing process.

Abstract: A method for fabricating a medical device includes steps as follows: A degradable powder including at least one metal element is firstly provided on a target surface. A focused energy light bean is applied to sinter/cure the biodegradable powder within an oxygen-containing atmosphere; wherein the oxygen concentration of the oxygen-containing atmosphere is adjusted to provide a first oxygen concentration and a second concentration when the focused energy light is driven to a first location and second location of the target surface respectively. The aforementioned processes are then repeatedly carried out to form a three-dimensional (3D) structure of the medical device.

Abstract: An additive manufacturing method for a 3D object is provided and includes (a) providing a 3D digital model of the 3D object; (b) dividing the 3D digital model into repeat arrangement of at least one type of polyhedral 3D units and an X-Y plane is an acute angle or an obtuse angle; (c) cutting the 3D digital model along a Z-axis into a plurality of 2D slices; (d) defining a scanning path covering one of the 2D slices; (e) providing an energy beam to a material on a working plane along the scanning path to form a construction layer corresponding to the one of the 2D slices; and (f) repeating the steps (d) and (e) to build up the 3D object by adding a plurality of construction layers in sequence.

Abstract: A fabrication method of magnetic device is provided. A magnetic material is provided. A portion of the magnetic material is selectively irradiated by an energy beam, and reactive gas is introduced simultaneously. The magnetic material being irradiated is melted and solidified to form a solidified layer. An outer layer of the solidified layer reacts with the reactive gas to form a barrier layer, so as to form a magnetic unit including the solidified layer and the barrier layer. It is determined whether the manufacturing process of the same layer is finished, if not, the energy beam is moved to the other portion of the magnetic material. The above step is repeated to overlap multiple magnetic units to form a magnetic layer. If yes, the flow returns to the 1st step to provide another magnetic material to the magnetic layer. The above steps are repeated to form a 3D magnetic device.

Abstract: An implant device for osseous integration includes a plurality of connection bars and at least one frame bar. These connection bars are connected with each other to form a three-dimensional (3D) grid structure. The frame bar is connected with at least two of the connection bars to define at least one edge of the 3D grid structure. Wherein, the frame bar has a diameter substantially greater than that of these connection bars.