Patents by Inventor Chinh Minh Nguyen

Chinh Minh Nguyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stacking devices at finished package level
    Patent number: 9064716
    Abstract: An embodiment is a method and apparatus to stack devices. A first finished package level (FPL) device having a first grounded tested die (GTD) is reduced to nearly size of the first GTD. The first FPL has a first plurality of solder balls. The reduced first FPL device is attached to a first substrate to form a first device assembly.
    Type: Grant
    Filed: September 30, 2009
    Date of Patent: June 23, 2015
    Assignee: VIRTIUM TECHNOLOGY, INC.
    Inventors: Phan Hoang, Chinh Minh Nguyen
  • STACKING DEVICES AT FINISHED PACKAGE LEVEL
    Publication number: 20110074002
    Abstract: An embodiment is a method and apparatus to stack devices. A first finished package level (FPL) device having a first grounded tested die (GTD) is reduced to nearly size of the first GTD. The first FPL has a first plurality of solder balls. The reduced first FPL device is attached to a first substrate to form a first device assembly.
    Type: Application
    Filed: September 30, 2009
    Publication date: March 31, 2011
    Applicant: VIRTIUM TECHNOLOGY, INC.
    Inventors: Phan Hoang, Chinh Minh Nguyen