Abstract: Described herein are gold (III) compounds according to formula (I) for use as emitters in organic light-emitting devices (OLEDs) and methods of making and using said compounds. The gold (III) compound includes a group 15 element containing tridentate ligand and one aryl auxiliary ligand that are both coordinated to the gold (III) metal center to form a series of thermally stable and highly luminescent gold (III) complexes. The gold (III) compounds disclosed herein can be used as light-emitting material for fabrication of OLEDs. The gold (III) compounds can be deposited as a layer or a component of a layer using a solution processing technique or a vacuum deposition process. The gold (III) compounds are robust and can provide electroluminescence with high efficiency and brightness.

Abstract: Described herein are gold (III) compounds according to formula (I) for use as emitters in organic light-emitting devices (OLEDs) and methods of making and using said compounds. The gold (III) compound includes a group 15 element containing tridentate ligand and one aryl auxiliary ligand that are both coordinated to the gold (III) metal center to form a series of thermally stable and highly luminescent gold (III) complexes. The gold (III) compounds disclosed herein can be used as light-emitting material for fabrication of OLEDs. The gold (III) compounds can be deposited as a layer or a component of a layer using a solution processing technique or a vacuum deposition process. The gold (III) compounds are robust and can provide electroluminescence with high efficiency and brightness.

Abstract: A composite for use in forming a multi-layer printed circuit board, comprised of an INVAR® sheet having a thickness of between 0.5 mil and 5 mil; and a layer of electrodeposited copper on at least one side thereof. The copper has a thickness of between 1&mgr; and 50&mgr;, wherein the composite has a thermal coefficient of expansion (TCE) of about 2.8 to 6.0 ppm at temperatures between 0° F. and 200° F.

Abstract: A composite for use in forming a multi-layer printed circuit board, comprised of an INVAR® sheet having a thickness of between 0.5 mil and 5 mil; and a layer of electrodeposited copper on at least one side thereof. The copper has a thickness of between 1&mgr; and 50&mgr;, wherein the composite has a thermal coefficient of expansion (TCE) of about 2.8 to 6.0 ppm at temperatures between 0° F. and 200° F.

Abstract: In one embodiment, the present invention relates to a flexible laminate, comprising a first flexible polymeric film; a copper layer having a microcracking prevention layer on at least one side the microcracking prevention layer sufficient to prevent microcracks in a copper layer having a thickness of up to about 18 &mgr;m during at least 50,000,000 bending cycles and/or a copper layer having a thickness of up to about 35 &mgr;m during at least 20,000,000 bending cycles of the flexible laminate; and a second flexible polymeric film.

Abstract: This invention relates to a process for applying a stabilization layer to at least one side of copper foil comprising contacting said side of said copper foil with an electrolyte solution comprising zinc ions, chromium ions and at least one hydrogen inhibitor. This invention also relates to copper foils treated by the foregoing process, and to laminates comprising a dielectric substrate and copper foil treated by the foregoing process adhered to said dielectric substrate.

Abstract: In one embodiment, the present invention relates to a method of treating metal foil, involving sequentially contacting a metal foil with an acidic solution; placing the metal foil in a nickel treatment bath and applying a current through the nickel treatment bath, wherein the nickel treatment bath contains at least about two plating zones, about 1 to about 50 g/l of an ammonium salt, and about 10 to about 100 g/l of a nickel compound; and applying a nickel flash layer to the metal foil. In another embodiment, the present invention relates to a metal foil treated according to the method described above.

Abstract: This invention relates to a process for applying a stabilization layer to at least one side of copper foil comprising contacting said side of said copper foil with an electrolyte solution comprising zinc ions, chromium ions and at least one hydrogen inhibitor. This invention also relates to copper foils treated by the foregoing process, and to laminates comprising a dielectric substrate and copper foil treated by the foregoing process adhered to said dielectric substrate.

Abstract: The present invention provides a method for producing high density electronic circuit boards comprising the steps of depositing a layer of a first metal upon a layer of foil to produce a composite then attaching the composite to an insulative support to produce a laminate. The layer of foil is then removed from the layer of first metal. Photoresist is then applied to the layer of first metal, exposed and developed. During the development of the photoresist portions of the photoresist are removed from the layer of first metal. A layer of third metal is then plated upon the portions of the layer of first metal that are not covered by the photoresist. All remaining photoresist and the portions of the layer of first metal which are not covered by the third metal are then removed producing a finished fine-line pattern having conductive and insulative areas. The finished fine-line pattern may then be utilized to produce a circuit board.

Abstract: A method and means for catalytically removing impurities found in the exhaust stream emanating from the internal combustion engine is provided. Such exhaust gases are initially brought into contact with a metallic oxidation catalyst at a temperature sufficient to cause a significant amount of the unreacted oxygen present to be removed therefrom by reacting it with oxidizable materials in the exhaust gases, with the oxidation catalyst employed being characterized by its lack of activity with respect to converting nitrogen and hydrogen found in exhaust gases into ammonia. The so-treated exhaust gases are then brought into contact with a nitrogen oxide (NO.sub.x) reducing catalyst, which is also characterized by its lack of activity with respect to converting nitrogen and hydrogen found in the exhaust gases into ammonia, at a temperature sufficient to cause nitrogen oxide gases in the exhaust gases to be catalytically reduced.